摘要:
The bipolar plate for PEM fuel cells made of a polymer blend which is filled with conductivity-enhancing carbon fillers and which includes at least two mutually nonmiscible blend polymers, is distinguished by the fact that the at least two blend polymers form a co-continuous structure and the carbon fillers are at a higher concentration in one of the blend polymers or in the phase between the blend polymers, or that a blend polymer in which the carbon fillers are at a higher concentration forms a continuously conductive matrix in which the at least one further blend polymer is intercalated.
摘要:
In one aspect, an optical sensor is used to detect defects, which can appear on smooth surfaces, is provided. The sensor includes a telecentric laser scanner and a detection unit. The scanner includes a laser for the approximately perpendicular illumination of a smooth surface, a scanning mirror, and a telecentric optical system for guiding illumination and detection beams the detection unit includes an optical detector system, a central diaphragm, which is concentrically positioned in the vicinity of the optical detector system in the direction toward the telecentric laser scanner, a highly sensitive photomultiplier for detecting scattered light, which emanates from defects on smooth surfaces, and a slit diaphragm arranged upstream of the photomultiplier.
摘要:
The Czochralski method is used for producing p−-doped and epitaxially coated semiconductor wafers from silicon, wherein a silicon single crystal is pulled, and during the pulling is doped with boron, hydrogen and nitrogen, and the single crystal thus obtained is processed to form p−-doped semiconductor wafers which are epitaxially coated.
摘要:
Silicon wafers in the entire volume of which crystal lattice vacancies are the prevalent point defect type, have a rotationally symmetric region whose width is at least 80% of the wafer radius, crystal lattice vacancy agglomerates of at least 30 nm in a density ≦6·103 cm−3, crystal lattice vacancy agglomerates of from 10 nm to 30 nm in a density of 1·105 cm−3 to 3·107 cm−3, OSF seeds in a density of 0 to 10 cm−2, and an average bulk BMD density of 5·108 cm−3 to 5·109 cm−3, which varies at most by a factor of 10 radially over the entire silicon wafer, and a BMD-free layer on the front side, wherein the first BMD is found at a depth of at least 5 μm and on average at a depth of at least 8 μm.
摘要翻译:其晶格空位为整体体积的硅晶片为普遍点缺陷型,具有宽度为晶片半径的至少80%的旋转对称区域,密度<= 6.103至少为30nm的晶格空位聚集体 cm-3,密度为1.105cm-3至3.107cm-3的10nm至30nm的晶格空位团聚体,密度为0至10cm -2的OSF晶种,平均体积BMD密度为5.108 cm -3至5.109cm -3,其在整个硅晶片上径向上变化10倍,并且在前侧上变化为不含BMD的层,其中在至少5μm的深度处发现第一BMD 平均至少8 m的深度。
摘要:
The present invention relates to thermoplastic molding compositions, comprising a mixture composed of (A) from 30 to 69% by weight, based on the entirety of components (A), (B) and (C), of a methyl methacrylate polymer, (B) from 30 to 69% by weight, based on the entirety of components (A), (B) and (C), of a copolymer, obtainable via polymerization of a vinylaromatic monomer and of a vinyl cyanide, and (C) from 1 to 40% by weight, based on the entirety of components (A), (B) and (C), of a graft copolymer, obtainable from (C1) from 60 to 90% by weight, based on (C), of an agglomerated core based on a 1,3-diene, (C2) from 5 to 20% by weight, based on (C), of a first graft shell composed of a vinylaromatic monomer, of an alkyl methacrylate, and, if appropriate, of a crosslinking monomer, and (C3) from 5 to 20% by weight, based on (C), of a second graft shell composed of an alkyl(meth)acrylate polymer, with the proviso that the ratio by weight of (C2) to (C3) is in the range from 2:1 to 1:2, and it is inventively significant here that the core (C1) has monomodal particle size distribution, the average particle size D50 of the core (C1) (determined by the method mentioned in the description) is in the range from 300 to 400 nm, and the difference between the refractive index (nD-C) of the entire component (C) and the refractive index (nD-AB) of the entire matrix of components (A) and (B) is in the range from 0.003 to 0.008, each of the refractive indices being measured by the methods mentioned in the description, and also to a process for preparation of these molding compositions, to their use, and to the moldings obtainable therefrom.
摘要:
Molding compositions comprising: a composition (I) present in an amount of 10 to 100% by weight, based on the molding composition, wherein the composition (I) comprises: (A) 40 to 95% by weight, based on the composition (I), of a copolymer comprising: α-methylstyrene in an amount of 55 to 90% by weight, acrylonitrile in an amount of 10 to 50% by weight, and one or more other monomers in an amount of 0 to 5% by weight, wherein the percentages by weight of the α-methylstyrene, the acrylonitrile and the one or more other monomers are based on the weight of component (A); (B) 2.5 to 75% by weight, based on the composition (I), of a polymer comprising: a vinylaromatic monomer in an amount of 60 to 90% by weight, acrylonitrile in an amount of 8.01 to 39.8% by weight, and maleic anhydride in an amount of 0.2 to 1.99% by weight, wherein the percentages by weight of the vinylaromatic monomer, the acrylonitrile and the maleic anhydride are based on the weight of component (B); and (C) 2.5 to 60% by weight, based on the composition (I), of glass fibres.
摘要:
Silicon wafers having a density of BMDs with sizes between 20 to 40 nm at positions ≧20 μm below the wafer surface in the range of 5×1011/cm3, and a density of BMDs with sizes of ≧300 nm≦1×107/cm3, exhibit reduced slip dislocation and warpage. The wafers are sliced from a crystal grown under specific conditions and then subjected to both low temperature heat-treatment and high temperature anneal.
摘要翻译:在5×10 11 / cm 3范围内,在晶片表面下方>20μm处的位置具有20至40nm的BMD密度的硅晶片,以及 尺寸> = 300nm的BMD的密度显示减少的滑脱位错和翘曲。 将晶片从在特定条件下生长的晶体切片,然后进行低温热处理和高温退火。
摘要:
The Czochralski method is used for producing p−-doped and epitaxially coated semiconductor wafers from silicon, wherein a silicon single crystal is pulled, and during the pulling is doped with boron, hydrogen and nitrogen, and the single crystal thus obtained is processed to form p−-doped semiconductor wafers which are epitaxially coated.
摘要:
An arrangement (1) for cleaning surfaces (2), particularly curved or arched or wavy surfaces and/or surfaces (2) with varying direction of curvature, for example on vehicle chassis, metal strip or unflat plates. The arrangement has a cleaning device (3) having a tension resistant carrier band or belt with an upper section and a lower section and also at least two reversing rollers or rolls (4), which device acts with a section as a cleaning belt section (6) on the surface to be cleaned (2) with its inner side facing the reversing rollers or rolls (4). The device (1) has a presser device (8) with a guide (9) for the cleaning belt section (6), through which the cleaning belt section (6) can be pressed. It is provided that the presser device (8) includes at least one flexible cushion or buffer (10), and that the guide (9) acted on thereby is deflectable or bendable transversely to, or at right angles to, the surface to be cleaned (2).
摘要:
The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.