Abstract:
A terminal random access method for a cellular radio communications system and a method for generating a group identifier are provided. The terminal random access method for a cellular radio communications system includes steps of: transmitting random access preamble message by a terminal to a base station in a random access time slot in a radio frame; combining location information of the random access time slot in the radio frame and that in the frequency domain to generate a group identifier and sending a random access response message to the terminal after adding the group identifier and an individual identifier that corresponds to the random access preamble message to the random access response message by the base station; judging whether the random access response message that corresponds to the sent random access preamble message is received, by judging whether the group identifier and the individual identifier within the received random access response message are all expected values. This invention provides fast and accurate access to the cellular radio communications system for the terminal and allows simple and easy operations to set a group identifier in the same way regardless of whether or not the configuration of the random access time slot changes.
Abstract:
A method for growth of an alloy for use in a nanostructure, to provide a resulting nanostructure compound including at least one of GexTey, InxSby, InxSey, SbxTey, GaxSby, GexSby,Tez, InxSbyTez, GaxSeyTez, SnxSbyTez, InxSbyGez, GewSnxSbyTez, GewSbxSeyTez, and TewGexSbySz, where w, x, y and z are numbers consistent with oxidization states (2, 3, 4, 5, 6) of the corresponding elements. The melt temperatures for some of the resulting compounds are in a range 330-420° C., or even lower with some compounds.
Abstract:
A real-time method employing a portable peptide-containing potentiometric biosensor, can directly detect and/or quantify bacterial spores. Two peptides for specific recognition of B. subtilis and B. anthracis Sterne may be immobilized by a polysiloxane monolayer immobilization (PMI) technique. The sensors translate the biological recognition event into a potential change by detecting, for example, B. subtilis spores in a concentration range of 0.08-7.3×104 CFU/ml. The sensing method exhibited highly selective recognition properties towards Bacillus subtilis spores over other kinds of spores. The selectivity coefficients of the sensors for other kinds of spores are in the range of 0-1.0×10−5. The biosensor method not only has the specificity to distinguish Bacillus subtilis spores in a mixture of B. subtilis and B. thuringiensis (thur.) Kurstaki spores, but also can discriminate between live and dead B. subtilis spores. Furthermore, the sensing method can distinguish a Bacillus subtilis 1A700 from other B. subtilis strain. Assay time may be as low as about 5 minutes for a single test. Rapid identification of B. anthracis Sterne and B. anthracis ΔAmes was also provided.
Abstract:
A method for forming fin structures for a semiconductor device that includes a substrate and a dielectric layer formed on the substrate is provided. The method includes etching the dielectric layer to form a first structure, depositing an amorphous silicon layer over the first structure, and etching the amorphous silicon layer to form second and third fin structures adjacent first and second side surfaces of the first structure. The second and third fin structures may include amorphous silicon material. The method further includes depositing a metal layer on upper surfaces of the second and third fin structures, performing a metal-induced crystallization operation to convert the amorphous silicon material of the second and third fin structures to a crystalline silicon material, and removing the first structure.
Abstract:
A semiconductor device may include a substrate and an insulating layer formed on the substrate. A fin may be formed on the insulating layer. The fin may include a side surface and a top surface, and the side surface may have a orientation. A first gate may be formed on the insulating layer proximate to the side surface of the fin.
Abstract:
A non-volatile memory device includes a substrate, an insulating layer, a fin structure, a floating gate, an inter-gate dielectric and a control gate. The insulating layer is formed on the substrate and the fin structure is formed on the insulating layer. The fin structure may include a strained layer formed on a non-strained layer.
Abstract:
A computer network-based distributed presentation system and process is presented that controls the display of one or more video streams output by multiple video cameras located across multiple presentation sites on display screens located at each presentation site. The distributed presentation system and process provides the ability for a user at a site to customize the screen configuration (i.e., what video streams are display at any one time and in what format) for that site via a two-layer display director module. In the design layer of the module, a user interface is provided for a user to specify display priorities dictating what video streams are to be displayed on the screen over time. These display priorities are then provided to the execution layer of the module which translates them into probabilistic timed automata and uses the automata to control what is displayed on the display screen.
Abstract:
A non-volatile memory device includes a substrate, an insulating layer, a fin, an oxide layer, spacers and one or more control gates. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. The oxide layer is formed on the fin and acts as a tunnel oxide for the memory device. The spacers are formed adjacent the side surfaces of the fin and the control gates are formed adjacent the spacers. The spacers act as floating gate electrodes for the non-volatile memory device.
Abstract:
A method of manufacturing a MOSFET type semiconductor device includes planarizing a gate material layer that is deposited over a channel. The planarization is performed in a multi-step process that includes an initial “rough” planarization and then a “fine” planarization. The slurry used for the finer planarization may include added material that tends to adhere to low areas of the gate material.
Abstract:
A method of fabricating a semiconductor device comprises forming a gate electrode over a substrate and forming deep amorphous regions within the substrate. And implanting dopants to form deep source/drain regions at a depth less than that of the deep amorphous regions, partially re-crystallizing portions of the deep amorphous regions to reduce their depth, and re-crystallizing the reduced amorphous regions to form activated final source/drain regions.