公开(公告)号：USD768741S1

公开(公告)日：2016-10-11

申请号：US29537304

申请日：2015-08-25

Applicant: Sintokogio, Ltd.

Designer： Yukiyoshi Funakoshi ,  Keishiro Kaneda ,  Katsuhito Sato

公开(公告)号：US09381616B2

公开(公告)日：2016-07-05

申请号：US14404319

申请日：2013-06-19

Applicant: SINTOKOGIO, LTD.

Inventor： Shoichi Yamamoto ,  Ryo Tatematsu ,  Takeshi Sugiura ,  Kyouji Yamashita

IPC: B24C9/00

CPC classification number: B24C9/00

Abstract: The present invention has the object of providing a shot processing machine capable of constraining the spilling over and dropping of projection material to outside the projection chamber. The shot processing machine of the invention is a shot processing machine for performing surface treatment by projecting projection material onto a workpiece inside a projection chamber, comprising: a cabinet inside of which a projection chamber is formed, an opening disposed on the cabinet for loading and discharging workpieces; and a door movably attached to the cabinet, for opening and closing the opening, whereby a projection material adhesion prevention mechanism for preventing the adhesion of projection material is provided on the inside of the door.

Abstract translation: 本发明的目的是提供一种能够限制投影材料向投影室外部溢出的投射处理机。 本发明的射出加工机是一种用于通过将投影材料投影到投影室内的工件上进行表面处理的喷丸加工机，其特征在于，具有：形成有投影室的箱体， 排放工件; 以及可移动地附接到机壳的门，用于打开和关闭开口，由此在门的内侧设置有用于防止突起材料粘附的突起材料粘附防止机构。

公开(公告)号：US20160176008A1

公开(公告)日：2016-06-23

申请号：US14909992

申请日：2014-03-26

Applicant: SINTOKOGIO, LTD.

Inventor： Kazuyoshi MAEDA ,  Norihito SHIBUYA

IPC: B24B31/16 ,  B24C3/26 ,  B24B57/02 ,  B24B31/02 ,  B24B31/06

CPC classification number: B24B31/16 ,  B24B31/02 ,  B24B31/06 ,  B24B57/02 ,  B24C1/08 ,  B24C3/065 ,  B24C3/26 ,  B24C7/0092 ,  H01G13/00

Abstract: A polishing device includes a processing vessel into which workpieces are charged, a fluidizing unit that fluidizes the workpieces in the processing vessel, an abrasive-feeding unit that feeds an abrasive into the workpieces, and a suction unit that generates an air flow in a direction in which the abrasive passes through the processing vessel, and recovers the abrasive by suction. The abrasive fed from the abrasive-feeding unit is allowed to pass between the workpieces charged into the processing vessel by the air flow generated from the suction unit while coming into contact with the workpieces. Accordingly, the workpieces are polished.

Abstract translation: 抛光装置包括：加工工件的处理容器，将处理容器中的工件流化的流化单元，将研磨剂供给到工件中的研磨给料单元;以及吸入单元，其将方向 其中磨料通过处理容器，并通过抽吸回收磨料。 从研磨给料单元供给的磨料允许通过在与工件接触的同时从吸入单元产生的气流在被加载到处理容器内的工件之间通过。 因此，抛光工件。

公开(公告)号：US09339866B2

公开(公告)日：2016-05-17

申请号：US14402753

申请日：2013-02-07

Applicant: SINTOKOGIO, LTD.

Inventor： Shigeyoshi Kato ,  Hisashi Harada

IPC: B22C9/10 ,  B22C13/16 ,  B22C15/24 ,  B22C13/12 ,  B22C19/04

CPC classification number: B22C9/10 ,  B22C13/12 ,  B22C13/16 ,  B22C15/24 ,  B22C19/04

Abstract: The core sand filling method comprises a step of operating an aeration air supply means, so as to float and fluidize core sand within a sand blow chamber and, when a pressure Pf of the sand blow chamber measured by the first pressure sensor reaches a first pressure, operating a compressed air supply means and a step of stopping the aeration air supply means and compressed air supply means from operating when each of the pressure Pf within the sand blow chamber and a pressure Pc within a sand storage chamber is a second pressure or higher while a differential pressure ΔP=Pc−Pf is a third pressure or lower.

Abstract translation: 芯砂填充方法包括操作曝气供给装置的步骤，以便使砂砂室内的砂岩浮起和流化，并且当由第一压力传感器测量的砂吹室的压力Pf达到第一压力 操作压缩空气供给装置，并且当砂浴室内的压力Pf和砂储存室内的压力Pc为第二压力以上时，使通气用空气供给单元和压缩空气供给单元停止运转的步骤 而压差Dgr; P = Pc-Pf是第三压力或更低。

公开(公告)号：USD750142S1

公开(公告)日：2016-02-23

申请号：US29488916

申请日：2014-04-24

Applicant: Sintokogio, Ltd.

Designer： Hiroaki Suzuki ,  Masato Umeoka

公开(公告)号：USD749156S1

公开(公告)日：2016-02-09

申请号：US29498750

申请日：2014-08-07

Applicant: Sintokogio, Ltd.

Designer： Takeshi Sugiura ,  Shoichi Yamamoto ,  Kyouji Yamashita

公开(公告)号：US20160016287A1

公开(公告)日：2016-01-21

申请号：US14772858

申请日：2013-10-17

Applicant: SINTOKOGIO, LTD.

Inventor： Masatoshi YAMAMOTO

IPC: B24C1/10

CPC classification number: B24C1/10 ,  B24C3/18

Abstract: A hanging section is installed at an upper side of a cabinet, and an autorotation mechanism rotates the hanging section around an axis of the hanging section in upward/downward directions of a device. In addition, a hanger unit hanging from the hanging section is installed in a cabinet, and a pair of frame sections is parallelly installed in series to match opening directions. Then, projection machines project a shot media toward the hanger unit. In addition, a loading/unloading device installed outside the cabinet is configured such that arm constituting a part thereof can be inserted into an opening section of the frame section of the hanger unit, and a tray on which a workpiece is placed can be conveyed. The loading/unloading device loads/unloads the tray with respect to the hanger unit by advancing and retracting the arm.

Abstract translation: 悬挂部安装在机柜的上侧，并且自动转动机构使悬吊部在装置的上下方向上围绕悬挂部的轴线旋转。 此外，悬挂在悬挂部分上的吊架单元安装在机柜中，并且一对框架部分并联地并联安装成与打开方向相匹配。 然后，投影机将投篮媒体投射到衣架单元。 此外，安装在机柜外部的装卸装置被构造成使得构成其一部分的臂能够插入到衣架单元的框架部分的开口部分中，并且可以传送其上放置工件的托盘。 加载/卸载装置通过前进和后退臂来装载/卸载托盘相对于衣架单元。

公开(公告)号：US09230868B2

公开(公告)日：2016-01-05

申请号：US14807338

申请日：2015-07-23

Applicant: SINTOKOGIO, LTD.

Inventor： Kouichi Inoue ,  Kazuyoshi Maeda ,  Norihito Shibuya

IPC: H01L21/66 ,  H01L21/26

CPC classification number: H01L22/12 ,  H01J37/3171 ,  H01L21/26 ,  H01L21/265 ,  H01L21/67288 ,  H01L21/6838 ,  H01L22/20 ,  H01L22/26 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the semiconductor element substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the semiconductor element substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the semiconductor element substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the semiconductor element substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the semiconductor element substrate for which injection treatment has been performed.

Abstract translation: 翘曲矫正装置包括：喷射机构，其包括进行喷射处理的喷嘴;吸附台，其通过主表面侧或膜表面侧的吸附来保持半导体元件基板;移动机构，其移动吸附台，使得半导体 元件基板相对于喷嘴的注射粒子的注入区域相对移动，容纳保持在吸附台上并在其内部进行注射处理的半导体元件基板的注入处理室，测量机构 半导体元件基板的翘曲以及基于目标翘曲量与通过测量机构测量的翘曲量之差的控制装置，进行喷射机构的喷射处理条件的设定处理中的至少一个 以及半导体元件的接受/拒绝确定 已经进行了注射处理的底物。

公开(公告)号：US20150346371A1

公开(公告)日：2015-12-03

申请号：US14654902

申请日：2013-08-05

Applicant: SINTOKOGIO, LTD.

Inventor： Hiroyasu MAKINO ,  Minoru HIRATA ,  Shuji TAKASU ,  Hiroyuki MIYAZAKI ,  Matthias STREHLE

IPC: G01V3/02 ,  B22C9/02 ,  B22C19/00

CPC classification number: G01V3/02 ,  B22C9/02 ,  B22C15/02 ,  B22C19/00 ,  B22C19/04 ,  G01F23/242

Abstract: A method for detecting powder is performed in a powder detection device including a pair of electrodes arranged to be opposed to each other with a gap interposed therebetween and an electric circuit electrically connected to the pair of electrodes. The method includes detecting powder filling in a case where the electric circuit together with powder and the electrodes forms a closed circuit when the powder fills the gap.

Abstract translation: 在粉末检测装置中进行粉末检测的方法，该粉末检测装置包括一对彼此相对设置的电极，并且间隔开间隙和与该对电极电连接的电路。 该方法包括当粉末填充间隙时，电路与粉末和电极形成闭合的情况下检测粉末填充。

公开(公告)号：US09149908B2

公开(公告)日：2015-10-06

申请号：US14368373

申请日：2012-10-17

Applicant: SINTOKOGIO, LTD.

Inventor： Yuji Kobayashi ,  Akinori Matsui

IPC: B24C1/10 ,  C21D7/06 ,  B24B39/00 ,  B24C3/32 ,  B24C11/00

CPC classification number: B24C1/10 ,  B24B39/006 ,  B24C3/325 ,  B24C11/00 ,  C21D7/06

Abstract: First, a nozzle insertion process in which a nozzle is inserted into a water cooling hole having a small diameter which is provided in a back of a mold is performed. Then, an injection process in which a mixed flow of air having a pressure ranging from 0.1 MPa to 1.0 MPa with an injection particle is jetted from a leading end of a nozzle to a distal portion of the water cooling hole. As a result, a shot peening process is performed on the distal portion of the water cooling hole.

Abstract translation: 首先，进行将喷嘴插入设置在模具背面的具有小直径的水冷却孔中的喷嘴插入工序。 然后，将喷射粒子的压力为0.1MPa〜1.0MPa的空气的混合流从喷嘴的前端喷射到水冷却孔的前端部的喷射处理。 结果，在水冷却孔的远端进行喷丸硬化处理。