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公开(公告)号：US20190206590A1
公开(公告)日：2019-07-04
申请号：US16299924
申请日：2019-03-12
Inventor： Satoko YAMOTO , Hideo FUKUDA , lsao TOMOMATSU
IPC: H01B7/02 , H01B7/00 , H01F5/06 , H01F6/06 , H01B13/14 , H01B13/08 , H02K1/16 , H02K3/12 , H02K3/34
CPC classification number: H01B7/0225 , B32B15/08 , H01B3/30 , H01B3/301 , H01B3/306 , H01B3/36 , H01B3/38 , H01B3/427 , H01B7/0009 , H01B7/02 , H01B7/0275 , H01B13/08 , H01B13/14 , H01F5/06 , H01F6/06 , H02K1/16 , H02K3/12 , H02K3/32 , H02K3/34 , H02K15/12
Abstract: An insulated wire, having: a single conductor or multiple conductors; an insulating layer on the outer periphery of the single conductor or each of the multiple conductors; and an adhesion layer on the outer periphery of the insulating layer, wherein the thickness of the adhesion layer is 2 to 200 μm, wherein a resin constituting the adhesion layer does not have a melting point, wherein the resin constituting the adhesion layer has a tensile modulus of 0.6×107 to 10×107 Pa at 250° C., and wherein a substance having 2 or more amino groups exists on the surface of the adhesion layer; a coil containing the insulated wire; and an electrical or electronic equipment using the coil.
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232.发明授权公开(公告)号：US10325695B2
公开(公告)日：2019-06-18
申请号：US15061544
申请日：2016-03-04
Inventor： Hideo Fukuda , Dai Fujiwara , Tsuneo Aoi , Hiroshi Kaneiwa , Takefumi Kaji
IPC: H01B7/00 , H01F5/06 , H02K3/30 , H01B13/06 , B32B7/04 , B32B27/06 , B32B27/08 , B32B27/28 , B32B27/34 , B32B3/14 , H01B7/02 , H01B13/00 , H02K3/04 , B32B15/04 , B32B15/08 , B32B15/088 , B32B15/20 , B32B3/04 , H01B3/30
Abstract: A rectangular wire having: a multilayer conductor member constructed by stacking, in a thickness direction, a rectangular metallic conductor that has a layer of a first thermoplastic resin formed on the outer periphery thereof, the first thermoplastic resin being a non-crystalline resin having no melting point or a crystalline resin having an amide bond; and a layer of a second thermoplastic resin having a melting point of 300° C. or more on the outer periphery of the multilayer conductor member.
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233.发明申请公开(公告)号：US20190177204A1
公开(公告)日：2019-06-13
申请号：US16089182
申请日：2017-03-28
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Shinichi ARAI , Takeshi YAGI , Shigeto MATSUMOTO
IPC: C03B37/018
Abstract: A manufacturing method for an optical fiber preform includes forming a porous material made of fine silica glass particles surrounding a plurality of glass rods; and sintering the porous material, wherein the forming the porous material includes forming the porous material such that two or more of the plurality of glass rods protrude from the porous material, and the sintering includes supporting end portions of protruding sides of the two or more protruding glass rods collectively with a support jig, and performing the sintering. With this, a reduction in manufacturing yield is suppressed.
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234.发明授权公开(公告)号：US10305240B2
公开(公告)日：2019-05-28
申请号：US15127630
申请日：2015-03-20
Applicant: FURUKAWA ELECTRIC CO., LTD. , FURUKAWA AUTOMOTIVE SYSTEMS INC. , TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor： Yasushi Kihara , Yukihiro Kawamura , Takashi Tonoike , Takahito Nakashima , Hiroshi Kobayashi , Hiroyasu Taga
IPC: H01R4/62 , H01R4/70 , H01R43/058 , H01R43/048 , H01R4/18 , B60R16/02
Abstract: Under compression by molds (31a, 31b), a wire (25), a covered area (27), and a crimping portion (5) are compressed and their cross-sectional areas decrease. Here, A1 is the cross-sectional area of the wire (25) after compression. That is, A1 is the sum of the cross-sectional area of the each strand after compression. Also, 131 is the cross-sectional area of the covered area (27) after compression. In the present invention, the compression rate for the wire (25) is set between 50% and 80%. Also, the compression rate for the covered area (27) is set between 40% and 90%. The amount of compression by the molds (31a, 31b) is set so that the compression rates are within these ranges. In the present invention, the compression rate is calculated by: (cross-sectional area after compression)/(cross-sectional area before compression). That is, 80% compression rate means that the cross-sectional area has decreased by 20% due to compression. That is, the relationships of 80%≥(A1/A0)≥50% and 90%≥(B1/B0)≥40% are satisfied.
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公开(公告)号：US20190153571A1
公开(公告)日：2019-05-23
申请号：US16252215
申请日：2019-01-18
Inventor： Toshihiro OMORI , Ryosuke KAINUMA , Yuki NOGUCHI , Sumio KISE , Toyonobu TANAKA
Abstract: A Fe-based shape memory alloy material, containing 25 atom % to 42 atom % of Mn, 9 atom % to 13 atom % of Al, 5 atom % to 12 atom % of Ni, and 5.1 atom % to 15 atom % of Cr, with the balance being Fe and unavoidable impurities; a method of producing the same; and a wire material and sheet material composed of the alloy material.
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Patent Agency Ranking
公开(公告)号：US10299417B2
公开(公告)日：2019-05-21
申请号：US15708498
申请日：2017-09-19
Inventor： Masanori Yamasaki , Tatsuya Yuasa , Katsutoshi Sakai , Akihiro Nagao
Abstract: The outer layer is peeled exactly a predetermined length from the end portion of the electromagnetic shielding tube. That is, the metal layer is exposed exactly a predetermined range at the end portion of the electromagnetic shielding tube. A flexible conductor is connected to the exposed metal layer. A separated portion is provided in the inner layer. The separated portion is formed along the length direction of the electromagnetic shielding tube. Additionally, a depth of the separated portion is the same value as the thickness of the inner layer. As such, the inner surface of the metal layer is exposed at the separated portion. It is preferable that the separated portion be formed at a plurality of locations in the circumferential direction. The inner layer is divided into a plurality of sections in the circumferential direction by the separated portion. The separated portion is a terminal processed portion, which mitigates the effects caused by differences in the physical properties of the inner layer and the metal layer.
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公开(公告)号：US10287405B2
公开(公告)日：2019-05-14
申请号：US16028290
申请日：2018-07-05
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Masaki Nishiguchi , Arifumi Matsumura
IPC: C08K3/22 , C08J3/22 , C08J3/24 , C08K5/14 , C08K5/5425 , B29B7/02 , B29B7/90 , B29C35/02 , B29C47/00 , C08K3/26 , C08K3/36 , B29B7/00 , B29B7/74 , C08L23/04 , H01B3/44 , C08L23/00 , B29K105/16 , B29L7/00
Abstract: A production method, containing the step of: mixing 0.02 to 0.6 parts by mass of an organic peroxide, 0.2 to 300 parts by mass of an inorganic filler, 2 to 15.0 parts by mass of a silane coupling agent, and a silanol condensation catalyst, based on 100 parts by mass of a polyolefin-based resin, in which the inorganic filler has an X value specified by Formula (I) satisfies 5 to 1050, X=ΣA/B Formula (I) wherein, ΣA denotes a total amount of a product of a BET specific surface area (m2/g) of the inorganic filler and a blending amount of the inorganic filler, and B denotes a blending amount of the silane coupling agent; and a crosslinkable resin composition and a crosslinked resin molded body produced by the production method; and a silane master batch and a molded article.
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公开(公告)号：US20190136351A1
公开(公告)日：2019-05-09
申请号：US16232522
申请日：2018-12-26
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Hiroshi KANEKO , Akiyoshi ARAKI , Kyota SUSAI
Abstract: An aluminum alloy material is an aluminum alloy material having an alloy composition consisting of 0.2 to 1.8% by mass of Mg, 0.2 to 2.0% by mass of Si, 0.01 to 1.50% by mass of Fe, 0.06 to 2% by mass in total of at least one selected from Cu, Ag, Zn, Ni, Co, Au, Mn, Cr, V, Zr, and Sn, with the balance containing Al and inevitable impurities. The aluminum alloy material has a fibriform metallographic structure where crystal grains extend so as to be aligned in one direction. In a cross section parallel to the one direction, an average value of a size perpendicular to a longitudinal direction of the crystal grains is 270 nm or less.
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公开(公告)号：US20190127826A1
公开(公告)日：2019-05-02
申请号：US16232630
申请日：2018-12-26
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Hiroshi KANEKO , Akiyoshi ARAKI , Kyota SUSAI
Abstract: An aluminum alloy material has an alloy composition consisting of 0.2 to 1.8% by mass of Mg, 0.2 to 2.0% by mass of Si, 0.01 to 1.50% by mass of Fe, with the balance containing Al and inevitable impurities. The aluminum alloy material has a fibriform metallographic structure where crystal grains extend so as to be aligned in one direction. In a cross section parallel to the one direction, an average value of a size perpendicular to a longitudinal direction of the crystal grains is 270 nm or less.
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公开(公告)号：US10241267B2
公开(公告)日：2019-03-26
申请号：US15423082
申请日：2017-02-02
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kazuaki Kiyota , Tatsuya Kimoto , Yusuke Saito
IPC: G02B6/12 , G02B6/122 , G02B6/132 , G02B6/136 , G02F1/225 , H01S5/026 , H01S5/40 , G02F1/025 , G02F1/017 , G02F1/21 , H01S5/12 , H01S5/223 , H01S5/343 , H01S5/50 , H01S5/20
Abstract: A semiconductor optical integrated device includes: a substrate; at least a lower cladding layer, a waveguide core layer, and an upper cladding layer sequentially layered on the substrate, a buried hetero structure waveguide portions each having a waveguide structure in which a semiconductor cladding material is embedded near each of both sides of the waveguide core layer; and a ridge waveguide portion having a waveguide structure in which a semiconductor layer including at least the upper cladding layer protrudes in a mesa shape. Further, a thickness of the upper cladding layer in each of the buried hetero structure waveguide portions is greater than a thickness of the upper cladding layer in the ridge waveguide portion.
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