MICROPHONE ASSEMBLY WITH TAPERED PORT
    243.
    发明公开

    公开(公告)号:US20240056763A1

    公开(公告)日:2024-02-15

    申请号:US18383599

    申请日:2023-10-25

    CPC classification number: H04S7/304 G06F3/012 H04S7/307 H04S7/306 H04R1/1008

    Abstract: Embodiments relate to an audio system that performs equalization of audio signals based on one or more diffuse field head-related transfer functions (HRTFs) and device-specific data. User-specific data and device-specific data (i.e., transducer-specific data) are applied to an acoustic model to predict an acoustic response for a user. An equalization filter is then determined using the acoustic response and the one or more diffuse field HRTFs. The equalization filter is applied to a processed version of an audio signal to create a modified version of the audio signal. The modified version of the audio signal is presented to the user via a transducer array of the audio system. The audio system can further include a microphone assembly that reduces the Helmholtz resonance effect.

    Virtual keyboard based on adaptive language model

    公开(公告)号:US11899928B2

    公开(公告)日:2024-02-13

    申请号:US17739562

    申请日:2022-05-09

    CPC classification number: G06F3/04886 G06F3/013 G06F3/04883

    Abstract: Disclosed herein are related to systems and methods for providing inputs through a virtual keyboard with an adaptive language model. In one approach, one or more processors determine whether a user intended to provide semantically meaningful characters or not, when providing a hand motion or a hand pose with respect to a virtual keyboard. The virtual keyboard may be located on a surface without physical keys. In one approach, the one or more processors determine an input to the virtual keyboard based on the hand motion or the hand pose. In one approach, the one or more processors determine weight of a language model according to the determined user intention. In one approach, the one or more processors modify the detected input according to the determined weight of the language model.

    SOURCE-CAMERA ASSEMBLY WITH LIGHT PATH FOR A REFERENCE PIXEL

    公开(公告)号:US20240045035A1

    公开(公告)日:2024-02-08

    申请号:US17981895

    申请日:2022-11-07

    Abstract: A source-camera assembly with an isolated light path for a reference pixel is described. The assembly may include a projector, a camera assembly, a reference waveguide, and an overmold. The projector may include a source array configured to emit light and a lens assembly configured to direct the light into a local area. The camera assembly may include a sensor and a reference pixel. The sensor may be configured to detect the emitted light reflected from an object within the local area. The reference waveguide is configured to guide a portion of the light emitted by the projector from the source array to the reference pixel. The light detected by the sensor and the light detected by the reference pixel may be used to determine depth information for the object. The overmold is opaque to the emitted light and covers portions of the projector, the camera assembly, and the reference waveguide.

    REFLECTIVE FRESNEL FOLDED OPTIC DISPLAY
    248.
    发明公开

    公开(公告)号:US20240036342A1

    公开(公告)日:2024-02-01

    申请号:US17874002

    申请日:2022-07-26

    CPC classification number: G02B27/283 G02B3/08 G02B27/0172

    Abstract: An example apparatus may include a display and an optical configuration configured to provide an image of a display, for example, in a head-mounted device. An example apparatus may include a display, a first lens assembly including a lens and a reflector, and a second lens assembly including a second lens and a second reflector. In some examples, the first lens assembly has a front surface configured to receive display light from the display when the display is energized. The first lens assembly may include a Fresnel surface (e.g., a Fresnel surface including facets and steps) that may, for example, be formed in a lens surface, or in the surface of a substrate supported by a lens surface. Other devices, methods, systems and computer-readable media are also disclosed.

    Light emitting diodes manufacture and assembly

    公开(公告)号:US11888087B1

    公开(公告)日:2024-01-30

    申请号:US17575920

    申请日:2022-01-14

    Abstract: A method for manufacturing LED devices is provided. The method comprises forming an epitaxial layer on a starter substrate, the epitaxial layer having a first surface that interfaces with the starter substrate and a second surface opposite to the first surface; establishing an adhesive bond between the second surface of the epitaxial layer and a carrier substrate having a pre-determined light transmittance; etching away the starter substrate; etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies on a third surface of the epitaxial layer opposite to the second surface; establishing one or more conductive bonds between selected one or more LED dies, from the plurality of LED dies, and a backplane; weakening the adhesive bond between the second surface of the epitaxial layer and the carrier substrate; and moving the carrier substrate away from the backplane.

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