Abstract:
A pelvic balancer is disclosed. The pelvic balancer includes a first correction part to support any one of user's left and right pelvic bones placed thereon, a second correction part to support the other one of the user's left and right pelvic bones placed thereon, and a central shaft connected with the first correction part and the second correction part so that the first correction part and the second correction part can rotate. Accordingly, pelvis correction can be achieved by setting a dislocated pelvis to a normal position only by using a user's weight without application of a physical pressing force.
Abstract:
In a method for forming a semiconductor device, a device isolation layer is formed in a capacitor region of a silicon substrate, and a bottom electrode and a dielectric layer are formed on the device isolation layer. Insulation sidewalls are formed on both sides of the bottom electrode. A top electrode is formed on the dielectric layer, and simultaneously a gate electrode is formed in a transistor region of the silicon substrate. Source/drain impurity regions are formed in the silicon substrate at both sides of the gate electrode.
Abstract:
An apparatus and method for determining operation of location update in a broadband wireless communication system are provided. The apparatus includes a receiver, an interpreter, and a determiner. In an idle mode, the receiver receives a paging advertisement message from a Base Station (BS). The interpreter identifies paging group identification information included in the paging advertisement message. The determiner determines one of execution and non-execution of a location update process due to a change of a paging group if the paging group identification information is different from paging group identification information included in a previously received paging advertisement message.
Abstract:
A nonvolatile memory device and a method of forming a nonvolatile memory device are provided. The nonvolatile memory device includes an active region of a semiconductor substrate defined by a device isolation layer, a tunnel insulating structure disposed on the active region, and a charge storage structure disposed on the tunnel insulating structure. The nonvolatile memory device also includes a gate interlayer dielectric layer disposed on the charge storage structure, and a control gate electrode disposed on the gate interlayer dielectric layer. The charge storage structure includes an upper charge storage structure and a lower charge storage structure, and the upper charge storage structure has a higher impurity concentration than the lower charge storage structure.
Abstract:
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
Abstract:
Provided are a semiconductor memory device and a method of programming the same. The semiconductor memory device includes a mode input value generating unit and a logic operating unit. The mode input value generating unit changes a connection state between input values of a current driving circuit so as to correspond to each of at least two operating modes, and defines a logic function of a magnetic memory cell connected to the current driving circuit in response to each operating mode. The logic operating unit performs a logic operation on the logic functions of at least two magnetic memory cells defined according to each of the operating modes and generates a result of logic operation.
Abstract:
A nonvolatile memory device and a method for fabricating the nonvolatile memory device are disclosed. The method comprises forming a device isolation pattern comprising a first opening and a second opening wider than the first opening, wherein the first opening is formed in the second opening; and forming a gate insulating layer on a first portion of an active region of the substrate, wherein the first opening exposes the first portion of the active region of the substrate. The method further comprises forming a first conductive layer in the first and second openings and on the gate insulating layer, partially etching the first conductive layer to form a U-shaped floating gate electrode, forming a gate interlayer insulating layer on the U-shaped floating gate electrode, forming a second conductive layer on the gate interlayer insulating layer and the device isolation pattern, and patterning the second conductive layer.
Abstract:
A high speed add-compare-select (ACS) circuit for a Viterbi decoder or a turbo decoder has a lower critical path delay than that achievable using a traditional ACS circuit. According to one embodiment of the invention, the path and branch metrics are split into most-significant and least-significant portions, such portions separately added in order to reduce the propagation delay.
Abstract:
There is provided a bracket for securing a side airbag for an automotive vehicle. The bracket includes a support plate, an installation plate positioned at upper part of the support plate and including an installation aperture, and fixing plates formed by being forwardly bent from the right and left edges, with respect to the installation plate, of the support plate.
Abstract:
A light emitting diode package is provided. The light emitting diode package comprises a submount substrate which includes a mounting region having side walls inclined upwardly, first and second cavities formed around the mounting region, and first and second grooves extending between the mounting region and the first and second cavities on an upper surface of the submount. The package further comprises first and second bump pads formed on a bottom surface of the mounting surface, first and second bonding pads formed on a bottom surface of the first and second cavities, respectively, first and second conductive lines formed along a bottom surface of the first and second grooves for connecting the first and second bump pads to the first and second bonding pads, respectively, and a light emitting diode mounted on the mounting region so as to be connected to the first and second bump pads.