Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices
    259.
    发明申请
    Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices 审中-公开
    微机电器件集成封装的方法与装置

    公开(公告)号:US20130260503A1

    公开(公告)日:2013-10-03

    申请号:US13903363

    申请日:2013-05-28

    CPC classification number: B81C1/00134 B81C1/00333 B81C2203/0145

    Abstract: Microelectromechanical systems (MEMS) packages, packaged MEMS devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer. The method further may include forming a packaging layer above the chamber sacrificial layer. The method additionally may include forming one or more openings through the packaging layer. The method also may include removing the chamber sacrificial layer through the one or more openings. The method may include forming a sealing layer above the packaging layer such that the sealing layer substantially seals the one or more openings to form a hermetic cavity.

    Abstract translation: 公开了微机电系统(MEMS)封装,封装的MEMS器件及其制造方法。 该方法可以包括在耦合到晶片的绝缘层上方形成腔室牺牲层。 该方法还可以包括在腔室牺牲层上方形成包装层。 该方法另外可以包括通过包装层形成一个或多个开口。 该方法还可以包括通过一个或多个开口去除腔室牺牲层。 该方法可以包括在包装层之上形成密封层,使得密封层基本上密封一个或多个开口以形成密封腔。

Patent Agency Ranking