MEMORY SYSTEM DESIGN USING BUFFER(S) ON A MOTHER BOARD

    公开(公告)号:US20200293468A1

    公开(公告)日:2020-09-17

    申请号:US16837844

    申请日:2020-04-01

    Applicant: Rambus Inc.

    Abstract: A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.

    Interface for Bridging Out-of-Band Information from a Downstream Communication Link to an Upstream Communication Link

    公开(公告)号:US20200278942A1

    公开(公告)日:2020-09-03

    申请号:US16780818

    申请日:2020-02-03

    Applicant: Rambus Inc.

    Abstract: A device includes a first interface to receive a signal from a first communication link, wherein the receive signal includes out-of-band (OOB) information. A detector coupled to the first interface detects the OOB information. An encoder coupled to the detector encodes the OOB information into one or more symbols (e.g., control characters). A second interface is coupled to the encoder and a second communication link (e.g., a serial transport path). The second interface transmits the symbols on the second communication link. The device also includes mechanisms for preventing false presence detection of terminating devices.

    Memory component that enables calibrated command- and data-timing signal arrival

    公开(公告)号:US10755764B2

    公开(公告)日:2020-08-25

    申请号:US16418316

    申请日:2019-05-21

    Applicant: Rambus Inc.

    Abstract: A clock signal is transmitted to first and second integrated circuit (IC) components via a clock signal line, the clock signal having a first arrival time at the first IC component and a second, later arrival time at the second IC component. A write command is transmitted to the first and second IC components to be sampled by those components at respective times corresponding to transitions of the clock signal, and write data is transmitted to the first and second IC components in association with the write command. First and second strobe signals are transmitted to the first and second IC components, respectively, to time reception of the first and second write data in those components. The first and second strobe signals are selected from a plurality of phase-offset timing signals to compensate for respective timing skews between the clock signal and the first and second strobe signals.

    SYSTEM AND METHOD FOR PROVIDING A CONFIGURABLE TIMING CONTROL FOR A MEMORY SYSTEM

    公开(公告)号:US20200265876A1

    公开(公告)日:2020-08-20

    申请号:US16802073

    申请日:2020-02-26

    Applicant: Rambus Inc.

    Abstract: A system and method for providing a configurable timing control of a memory system is disclosed. In one embodiment, the system has a first interface to receive a DIMM clock and configuration information, a second interface to a first data bus, and a third interface to a second data bus. The system further has a plurality of flip-flops, a multiplexor coupled to the plurality of flip-flops, a first control block for controlling to hold an input data within the plurality of flip-flops, and a second control block for controlling a timing of an output data from the plurality of flip-flops via the multiplexor with a programmable delay. The input data is received via the second interface. The programmable delay is received via the first interface. The output data is sent out with the timing delay via the third interface.

    STACKED DRAM DEVICE AND METHOD OF MANUFACTURE
    268.
    发明申请

    公开(公告)号:US20200265873A1

    公开(公告)日:2020-08-20

    申请号:US16801990

    申请日:2020-02-26

    Applicant: Rambus Inc.

    Inventor: Thomas Vogelsang

    Abstract: A memory device includes a first dynamic random access memory (DRAM) integrated circuit (IC) chip including first memory core circuitry, and first input/output (I/O) circuitry. A second DRAM IC chip is stacked vertically with the first DRAM IC chip. The second DRAM IC chip includes second memory core circuitry, and second I/O circuitry. Solely one of the first DRAM IC chip or the second DRAM IC chip includes a conductive path that electrically couples at least one of the first memory core circuitry or the second memory core circuitry to solely one of the first I/O circuitry or the second I/O circuitry, respectively.

    MEMORY SYSTEM WITH THREADED TRANSACTION SUPPORT

    公开(公告)号:US20200264782A1

    公开(公告)日:2020-08-20

    申请号:US16805535

    申请日:2020-02-28

    Applicant: Rambus Inc.

    Abstract: Memory modules, systems, memory controllers and associated methods are disclosed. In one embodiment, a memory module includes a module substrate having first and second memory devices. Buffer circuitry disposed on the substrate couples to the first and second memory devices via respective first and second secondary interfaces. The buffer circuitry includes a primary signaling interface for coupling to a group of signaling links associated with a memory controller. The primary signaling interface operates at a primary signaling rate and the first and second secondary data interfaces operate at a secondary signaling rate. During a first mode of operation, the primary interface signaling rate is at least twice the secondary signaling rate. A first time interval associated with a transfer of first column data via the first secondary interface temporally overlaps a second time interval involving second column data transferred via the second secondary interface.

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