公开(公告)号：US20220216316A1

公开(公告)日：2022-07-07

申请号：US17701840

申请日：2022-03-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Xian Liu ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L29/423 ,  H01L29/66 ,  G11C16/04 ,  H01L29/788

Abstract: A memory device, and method of making the same, that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a first channel region in the substrate extending between the first and second regions, a first floating gate disposed over and insulated from a first portion of the first channel region adjacent to the second region, a first coupling gate disposed over and insulated from the first floating gate, a first word line gate disposed over and insulated from a second portion of the first channel region adjacent the first region, and a first erase gate disposed over and insulated from the first word line gate.

公开(公告)号：US11362218B2

公开(公告)日：2022-06-14

申请号：US16910022

申请日：2020-06-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Elizabeth Cuevas ,  Yuri Tkachev ,  Parviz Ghazavi ,  Bernard Bertello ,  Gilles Festes ,  Bruno Villard ,  Catherine Decobert ,  Nhan Do ,  Jean Francois Thiery

IPC: H01L27/11517 ,  H01L27/11531 ,  H01L29/788 ,  H01L29/66 ,  H01L27/11543 ,  H01L27/11551 ,  H01L27/11524 ,  H01L27/11521 ,  H01L27/11529 ,  H01L27/11534

Abstract: A memory device includes a semiconductor substrate with memory cell and logic regions. A floating gate is disposed over the memory cell region and has an upper surface terminating in opposing front and back edges and opposing first and second side edges. An oxide layer has a first portion extending along the logic region and a first thickness, a second portion extending along the memory cell region and has the first thickness, and a third portion extending along the front edge with the first thickness and extending along a tunnel region portion of the first side edge with a second thickness less than the first thickness. A control gate has a first portion disposed on the oxide layer second portion and a second portion vertically over the front edge and the tunnel region portion of the first side edge. A logic gate is disposed on the oxide layer first portion.

公开(公告)号：US11362100B2

公开(公告)日：2022-06-14

申请号：US17069563

申请日：2020-10-13

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Steven Lemke ,  Hieu Van Tran ,  Nhan Do

IPC: H01L27/11517 ,  H01L27/11529 ,  H01L29/788 ,  H01L29/423 ,  H01L29/66 ,  H01L27/11551

Abstract: Memory cells formed on upwardly extending fins of a semiconductor substrate, each including source and drain regions with a channel region therebetween, a floating gate extending along the channel region and wrapping around the fin, a word line gate extending along the channel region and wrapping around the fin, a control gate over the floating gate, and an erase gate over the source region. The control gates are a continuous conductive strip of material. First and second fins are spaced apart by a first distance. Third and fourth fins are spaced apart by a second distance. The second and third fins are spaced apart by a third distance greater than the first and second distances. The continuous strip includes a portion disposed between the second and third fins, but no portion of the continuous strip is disposed between the first and second fins nor between the third and fourth fins.

公开(公告)号：US11322507B2

公开(公告)日：2022-05-03

申请号：US17185709

申请日：2021-02-25

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Jack Sun ,  Xian Liu ,  Leo Xing ,  Nhan Do ,  Andy Yang ,  Guo Xiang Song

IPC: H01L21/00 ,  H01L27/11531 ,  H01L27/11521 ,  H01L29/788 ,  H01L29/66 ,  H01L21/28 ,  H01L29/49

Abstract: A method of forming a semiconductor device includes recessing the upper surface of first and second areas of a semiconductor substrate relative to the third area of the substrate, forming a pair of stack structures in the first area each having a control gate over a floating gate, forming a first source region in the substrate between the pair of stack structures, forming an erase gate over the first source region, forming a block of dummy material in the third area, forming select gates adjacent the stack structures, forming high voltage gates in the second area, forming a first blocking layer over at least a portion of one of the high voltage gates, forming silicide on a top surface of the high voltage gates which are not underneath the first blocking layer, and replacing the block of dummy material with a block of metal material.

公开(公告)号：US11315940B2

公开(公告)日：2022-04-26

申请号：US17151944

申请日：2021-01-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Guo Xiang Song ,  Leo Xing ,  Jack Sun ,  Xian Liu ,  Nhan Do

IPC: H01L27/11531 ,  H01L27/11521 ,  H01L29/78 ,  H01L21/762 ,  H01L29/423 ,  H01L29/66 ,  H01L21/28 ,  H01L21/265 ,  H01L29/788

Abstract: A method of forming memory cells, HV devices and logic devices on a substrate, including recessing the upper surface of the memory cell and HV device areas of the substrate, forming a polysilicon layer in the memory cell and HV device areas, forming first trenches through the first polysilicon layer and into the silicon substrate in the memory cell and HV device areas, filling the first trenches with insulation material, forming second trenches into the substrate in the logic device area to form upwardly extending fins, removing portions of the polysilicon layer in the memory cell area to form floating gates, forming erase and word line gates in the memory cell area, HV gates in the HV device area, and dummy gates in the logic device area from a second polysilicon layer, and replacing the dummy gates with metal gates that wrap around the fins.

公开(公告)号：US20210399127A1

公开(公告)日：2021-12-23

申请号：US16910022

申请日：2020-06-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Elizabeth Cuevas ,  Yuri Tkachev ,  Parviz Ghazavi ,  Bernard Bertello ,  Gilles Festes ,  Bruno Villard ,  Catherine Decobert ,  Nhan Do ,  Jean Francois Thiery

IPC: H01L29/788 ,  H01L29/66 ,  H01L27/11517

Abstract: A memory device includes a semiconductor substrate with memory cell and logic regions. A floating gate is disposed over the memory cell region and has an upper surface terminating in opposing front and back edges and opposing first and second side edges. An oxide layer has a first portion extending along the logic region and a first thickness, a second portion extending along the memory cell region and has the first thickness, and a third portion extending along the front edge with the first thickness and extending along a tunnel region portion of the first side edge with a second thickness less than the first thickness. A control gate has a first portion disposed on the oxide layer second portion and a second portion vertically over the front edge and the tunnel region portion of the first side edge. A logic gate is disposed on the oxide layer first portion.

公开(公告)号：US11158374B2

公开(公告)日：2021-10-26

申请号：US16930777

申请日：2020-07-16

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Nhan Do ,  Vipin Tiwari ,  Mark Reiten

IPC: G11C16/04 ,  G06F17/16 ,  G06N3/063 ,  G06N3/08 ,  G06N3/04

Abstract: Numerous embodiments are disclosed for providing temperature compensation in a an analog memory array. The analog memory array optionally is a vector-by-matrix multiplier in an analog neuromorphic memory system used in a deep learning neural network. One embodiment comprises measuring an operating temperature within a memory array and applying, by a temperature compensation block, a bias voltage to a terminal of a memory cell in the array, wherein the bias voltage is a function of the operating temperature.

公开(公告)号：US20210193671A1

公开(公告)日：2021-06-24

申请号：US16724010

申请日：2019-12-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Serguei Jourba ,  Catherine Decobert ,  Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Nhan Do

IPC: H01L27/11517 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  H01L29/78

Abstract: A method of forming a device on a substrate with recessed first/third areas relative to a second area by forming a fin in the second area, forming first source/drain regions (with first channel region therebetween) by first/second implantations, forming second source/drain regions in the third area (defining second channel region therebetween) by the second implantation, forming third source/drain regions in the fin (defining third channel region therebetween) by third implantation, forming a floating gate over a first portion of the first channel region by first polysilicon deposition, forming a control gate over the floating gate by second polysilicon deposition, forming an erase gate over the first source region and a device gate over the second channel region by third polysilicon deposition, and forming a word line gate over a second portion of the first channel region and a logic gate over the third channel region by metal deposition.

公开(公告)号：US20210175240A1

公开(公告)日：2021-06-10

申请号：US17178520

申请日：2021-02-18

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Hung Quoc Nguyen ,  Nhan Do

IPC: H01L27/11526 ,  H01L27/11519 ,  H01L27/11521 ,  G11C16/04 ,  G11C16/14 ,  G11C16/26 ,  H01L29/423 ,  H01L29/788

Abstract: A memory device with memory cell pairs each having a single continuous channel region, first and second floating gates over first and second portions of the channel region, an erase gate over a third portion of the channel region between the first and second channel region portions, and first and second control gates over the first and second floating gates. For each of the pairs of memory cells, the first region is electrically connected to the second region of an adjacent pair of memory cells in the same active region, and the second region is electrically connected to the first region of an adjacent pair of the memory cells in the same active region.

公开(公告)号：US20210174185A1

公开(公告)日：2021-06-10

申请号：US17181656

申请日：2021-02-22

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Vipin Tiwari ,  Mark Reiten ,  Nhan Do

IPC: G06N3/063 ,  G06N3/08 ,  G06F3/06 ,  G06F17/16

Abstract: Numerous output circuits are disclosed for an analog neural memory system for a deep learning neural network. In one embodiment, an adaptable neuron circuit receives output current from a neuron and converts it into a voltage. In another embodiment, a current sample and hold circuit samples an input current and generates an output current. In another embodiment, a voltage sample and hold circuit samples an input voltage and generates an output voltage.