公开(公告)号：US10068322B2

公开(公告)日：2018-09-04

申请号：US15107216

申请日：2013-12-22

Applicant: Analogic Corporation

Inventor： John P. O'Connor ,  Charles Shaughnessy ,  Eric Zanin ,  Nicholas A. Accomando

IPC: G06K9/00 ,  G06T7/00 ,  G06K9/46 ,  G06T3/60 ,  G06T7/32

Abstract: One or more techniques and/or systems are described for inspecting an object, such as a tire. The system comprises a radiation imaging system configured to examine the object via radiation to generate a radiation image depicting an interior aspect of the object and a machine vision system configured to measure visible light and/or infrared wavelengths to generate a vision image depicting an exterior aspect of the object. The radiation image and the vision image may be correlated to facilitate an inspection of the object which includes an inspection of the exterior aspect as well as the interior aspect.

公开(公告)号：US10007008B2

公开(公告)日：2018-06-26

申请号：US14907611

申请日：2013-07-26

Applicant: ANALOGIC CORPORATION

Inventor： Randy Luhta ,  Daniel Abenaim ,  Martin Choquette ,  Ruvin Deych ,  Chris Vrettos

IPC: G01T1/24 ,  H01L27/146 ,  G01T1/20

CPC classification number: G01T1/244 ,  G01T1/2018 ,  H01L27/14618 ,  H01L27/14661 ,  H01L2224/16225

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

公开(公告)号：US09898678B2

公开(公告)日：2018-02-20

申请号：US15412618

申请日：2017-01-23

Applicant: Analogic Corporation

Inventor： Zhengrong Ying ,  Baoming Hong ,  Ram Naidu

IPC: G06K9/00 ,  G06K9/34 ,  G06T7/10 ,  G06T15/20 ,  G06K9/62 ,  G01V5/00

CPC classification number: G06K9/34 ,  G01V5/0008 ,  G01V5/0016 ,  G01V5/0041 ,  G01V5/005 ,  G06K9/00771 ,  G06K9/342 ,  G06K9/6201 ,  G06K9/6267 ,  G06T7/10 ,  G06T7/11 ,  G06T15/20 ,  G06T2200/04 ,  G06T2219/004

Abstract: Representations of an object in an image generated by an imaging apparatus can comprise two or more separate sub-objects, producing a compound object. Compound objects can negatively affect the quality of object visualization and threat identification performance. As provided herein, a compound object can be separated into sub-objects. Three-dimensional image data of a potential compound object is projected into a two-dimensional manifold projection, and segmentation is performed on the two-dimensional manifold projection of the compound object to identify sub-objects. Once sub-objects are identified, the two-dimensional, segmented manifold projection is projected into three-dimensional space. A three-dimensional segmentation may then be performed to identify additional sub-objects of the compound object that were not identified by the two-dimensional segmentation.

公开(公告)号：US20170181723A1

公开(公告)日：2017-06-29

申请号：US14982368

申请日：2015-12-29

Applicant: Analogic Corporation

Inventor： Douglas Abraham ,  Peter Daniel Shippen ,  Carl DeVincent

IPC: A61B6/00 ,  A61B6/03

CPC classification number: A61B6/56 ,  A61B6/032 ,  A61B6/035 ,  H01F38/18 ,  H01L2223/6677 ,  H01Q1/2283 ,  H04B5/0031 ,  H04B5/0037

Abstract: A receiving antenna for wirelessly receiving data between a stator of a computed tomography (CT) imaging modality and a rotor of the CT imaging modality is provided. The rotor rotates about a rotational axis. The receiving antenna includes a dielectric portion and a conductive portion coupled to the dielectric portion. A second surface of the conductive portion extends between a first end and a second end along a conductive axis that is substantially perpendicular to the rotational axis. The second surface of the conductive portion has a first length at a first length location along a first length axis that is substantially parallel to the conductive axis. The second surface of the conductive portion has a second length at a second length location along a second length axis that is substantially parallel to the conductive axis. The first length is different than the second length.

公开(公告)号：US20170132485A1

公开(公告)日：2017-05-11

申请号：US15412618

申请日：2017-01-23

Applicant: Analogic Corporation

Inventor： Zhengrong Ying ,  Baoming Hong ,  Ram Naidu

IPC: G06K9/34 ,  G06T15/20 ,  G06K9/62 ,  G06T7/10

CPC classification number: G06K9/34 ,  G01V5/0008 ,  G01V5/0016 ,  G01V5/0041 ,  G01V5/005 ,  G06K9/00771 ,  G06K9/342 ,  G06K9/6201 ,  G06K9/6267 ,  G06T7/10 ,  G06T7/11 ,  G06T15/20 ,  G06T2200/04 ,  G06T2219/004

Abstract: Representations of an object in an image generated by an imaging apparatus can comprise two or more separate sub-objects, producing a compound object. Compound objects can negatively affect the quality of object visualization and threat identification performance. As provided herein, a compound object can be separated into sub-objects. Three-dimensional image data of a potential compound object is projected into a two-dimensional manifold projection, and segmentation is performed on the two-dimensional manifold projection of the compound object to identify sub-objects. Once sub-objects are identified, the two-dimensional, segmented manifold projection is projected into three-dimensional space. A three-dimensional segmentation may then be performed to identify additional sub-objects of the compound object that were not identified by the two-dimensional segmentation.

公开(公告)号：US20170099725A1

公开(公告)日：2017-04-06

申请号：US14873599

申请日：2015-10-02

Applicant: Analogic Corporation

Inventor： Richard A. Maillet, JR. ,  Garry Allen Fellows

IPC: H05K1/02 ,  G01R33/34 ,  H05K1/18

CPC classification number: H05K1/021 ,  G01R33/3614 ,  G01R33/3804 ,  H05K1/0206 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/10416

Abstract: Among other things, an electronics assembly within an imaging system is provided. The electronics assembly includes a circuit board assembly through which a signal is delivered. The circuit board assembly defines a heat transfer opening between a first side and a second side. An electronics component is electrically coupled to the first side of the circuit board assembly. A heat transfer component supports the electronics component. The heat transfer component includes a base portion coupled to the electronics component and to the circuit board assembly. The heat transfer component includes a heat dissipation portion extending through the heat transfer opening of the circuit board assembly. The heat dissipation portion dissipates heat generated by the electronics component.

公开(公告)号：US20160372223A1

公开(公告)日：2016-12-22

申请号：US15114206

申请日：2014-01-31

Applicant: ANALOGIC CORPORATION

Inventor： Patrick Splinter ,  Steven Weed

IPC: G21F3/00 ,  G01N23/04 ,  G01V5/00

CPC classification number: G21F3/00 ,  G01N23/04 ,  G01N2223/643 ,  G01V5/0016

Abstract: A transport apparatus (114) of an X-ray inspection system (100) includes an inspection region (122) with an entrance (121) and an exit (123). The transport apparatus further includes a loading region (120) disposed at the entrance of the inspection region, the loading region. The loading region includes a first set of X-ray attenuating curtains (228, 230, 232, 234) and a first curtain mover (223), which moves the curtains of the first set of X-ray attenuating curtains into and out of the loading region between areas that support objects for inspection. The transport apparatus further includes a conveyor device (128) which moves an object for inspection residing in one of the areas from the loading region to the inspection region for inspection.

Abstract translation: X射线检查系统（100）的输送装置（114）包括具有入口（121）和出口（123）的检查区域（122）。 输送装置还包括设置在检查区域的入口处的装载区域（120）。 加载区域包括第一组X射线衰减帘（228,230,232,234）和第一帘式移动器（223），其将第一组X射线衰减帘的窗帘移入和移出 在支持检查对象的区域之间加载区域。 输送装置还包括输送装置（128），该输送装置将驻留在从装载区域到其中一个区域的检查对象移动到检查区域进行检查。

公开(公告)号：US20160317115A1

公开(公告)日：2016-11-03

申请号：US14699488

申请日：2015-04-29

Applicant: Analogic Corporation

Inventor： Peter Daniel Shippen

IPC: A61B6/00 ,  A61B6/03 ,  H05K1/14

CPC classification number: A61B6/56 ,  A61B6/035 ,  H05K1/142 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/09018

Abstract: A computed tomography (CT) imaging modality includes a stator and a rotor that rotates relative to the stator. The CT imaging modality includes a radiation source and a detector array for detecting at least some of the radiation. A first data communication component is coupled to the stator or the rotor for transmitting data between the stator and the rotor. The first data communication component includes a first circuit board assembly including a first conductive layer and a first dielectric layer and a second circuit board assembly including a second conductive layer and a second dielectric layer. The second conductive layer of the second circuit board assembly faces the first conductive layer of the first circuit board assembly. An insulating layer is disposed between the first conductive layer of the first circuit board assembly and the second conductive layer of the second circuit board assembly.

Abstract translation: 计算机断层摄影（CT）成像模式包括定子和相对于定子旋转的转子。 CT成像模式包括用于检测至少一些辐射的辐射源和检测器阵列。 第一数据通信部件耦合到定子或转子，用于在定子和转子之间传输数据。 第一数据通信部件包括包括第一导电层和第一介电层的第一电路板组件和包括第二导电层和第二介电层的第二电路板组件。 第二电路板组件的第二导电层面对第一电路板组件的第一导电层。 绝缘层设置在第一电路板组件的第一导电层和第二电路板组件的第二导电层之间。

公开(公告)号：US20160210511A1

公开(公告)日：2016-07-21

申请号：US14598480

申请日：2015-01-16

Applicant: Analogic Corporation

Inventor： David L. Leong ,  Nicholas A. Accomando ,  John P. O'Connor

IPC: G06K9/00 ,  G06K9/62 ,  G06T7/00 ,  G06K9/46

CPC classification number: G06K9/00624 ,  A61B5/0073 ,  A61B5/066 ,  G06K9/3233 ,  G06K9/46 ,  G06K9/4661 ,  G06K9/6201 ,  G06K2009/4666 ,  G06T7/0014 ,  G06T7/246 ,  G06T7/33 ,  G06T2207/10132 ,  G06T2207/20221

Abstract: A method includes obtaining real-time imaging data of a least a sub-portion of an object and a region of interest therein. The method further includes displaying the real-time imaging data as the real-time imaging is obtained. The method further includes tracking extraction of a sample from the region of interest by an extraction device based on the real-time imaging data. The method further includes identifying an extraction location for the extracted sample based on the tracking and the real-time imaging data and generating a signal indicative thereof.

Abstract translation: 一种方法包括获得物体的至少一个子部分和其中的感兴趣区域的实时成像数据。 该方法还包括当获得实时成像时显示实时成像数据。 该方法还包括基于实时成像数据通过提取装置跟踪从感兴趣区域提取样本。 该方法还包括基于跟踪和实时成像数据识别提取的样本的提取位置，并产生指示其的信号。

公开(公告)号：US20160154124A1

公开(公告)日：2016-06-02

申请号：US14907611

申请日：2013-07-26

Applicant: ANALOGIC CORPORATION

Inventor： Randy LUHTA ,  Daniel ABENAIM ,  Martin CHOQUETTE ,  Ruvin DEYCH ,  Chris VRETTOS

IPC: G01T1/24 ,  G01T1/20

CPC classification number: G01T1/244 ,  G01T1/2018 ,  H01L27/14618 ,  H01L27/14661 ,  H01L2224/16225

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Abstract translation: 提供了一种用于辐射成像模式的检测器阵列的检测器单元。 在一些实施例中，检测器单元包括辐射检测子组件和电子子组件。 在一些实施例中，可以经由半导体制造技术形成检测器单元的至少一些部分，例如电子学子组件。 作为示例，电子子组件可以经由半导体制造技术形成，并且可以包括嵌入模制化合物中的电子电路。 在一些实施例中，这种电子电路可以通过导电迹线和/或通孔电耦合在一起。