Abstract:
A combination signal receiving device includes a printed circuit board, a light source, a light cover, a receiving cover, and at least one signal receiver. The light source is mounted on the printed circuit board. The light cover is lighttight except a light transmissive logo. The light cover covers the light source. The receiving cover surrounds the light cover. The signal receiver is mounted on the printed circuit board beneath the receiving cover, configured for receiving outside signal passing through the receiving cover. Light emitted by the light source is incapable of reaching the signal receiver. The combination signal receiving device does not negatively influence the appearance of an electronic apparatus.
Abstract:
A multi-display digital photo frame is provided. The multi-display digital photo frame includes a front cover, a rear cover, and a body. The front cover includes at least two apertures, the body includes at least two holding components for placing LCDs, the bottom of each holding component mounted a LCD further for mounting a processor, wherein the processor is connected to the corresponding LCD through a bus.
Abstract:
A combination signal receiving device includes a printed circuit board, a light source, a light cover, a receiving cover, and at least one signal receiver. The light source is mounted on the printed circuit board. The light cover is lighttight except a light transmissive logo. The light cover covers the light source. The receiving cover surrounds the light cover. The signal receiver is mounted on the printed circuit board beneath the receiving cover, configured for receiving outside signal passing through the receiving cover. Light emitted by the light source is incapable of reaching the signal receiver. The combination signal receiving device does not negatively influence the appearance of an electronic apparatus.
Abstract:
A system and method are provided for scheduling a monitor job for a tool in a semiconductor manufacturing environment and for optimizing the scheduling of jobs in such an environment. In one example, the method includes receiving a monitor job and monitoring a status of the tool to determine when a predefined event occurs. A position in a buffer in which to place the monitor job may be identified in response to the event occurring, where placing the monitor job in the identified position will cause the monitor job to be executed at a correct time.
Abstract:
A method for switch dual Id verification systems for installing another carrier ID system on an equipment installation complying with SEMI E87. A first identification access system has internally installed on an equipment installation on which a second identification access system is then installed. Both systems are switched using a control flow and a wafer carrier ID is obtained by the chosen verification system.
Abstract:
A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.
Abstract:
The chip package and the process thereof are disclosed. In the chip package, a rigid cover is disposed on the active surface of the chip to protect the active surface of the chip and enhance the structural strength of the chip package. Further, if the material of the rigid cover is a thermal conductive material such as Cu or Al alloy, the heat-spread ability of the chip package can be enhanced. If the rigid cover is made of an electrical conductive material and electrically connected to the ground, the electromagnetic interference (EMI) to the chip package can be reduced. It should be noted that the chip packaging process can form a plurality of the terminal pads on the backside of the chip so that the chip package can be connected to the PCB or substrate via these terminal pads.
Abstract:
A transport system within a fabrication system. The fabrication system contains a plurality of tool bays, each of which has a plurality of processing tools for processing articles. The transport system contains a plurality of intrabay transport subsystems, an interbay transport subsystem, a plurality of stockers, and at least one linking subsystem. Each intrabay transport subsystem is dedicated to transporting articles within a particular tool bay. The interbay transport subsystem, linking the tool bays, transports articles between the tool bays. The stockers, located between the intrabay and interbay transport subsystems, store articles between processing and transfer articles between the intrabay and interbay transport subsystems. The linking subsystem, located between two adjacent intrabay transport subsystems, provides direct transport between the two corresponding tool bays.
Abstract:
Fatty acid-based, pre-cure-derived biomaterials, methods of making the biomaterials, and methods of using them as drug delivery carriers are described. The fatty acid-derived biomaterials can be utilized alone or in combination with a medical device for the release and local delivery of one or more therapeutic agents. Methods of forming and tailoring the properties of said biomaterials and methods of using said biomaterials for treating injury in a mammal are also provided.