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公开(公告)号：US08255740B2
公开(公告)日：2012-08-28
申请号：US12891309
申请日：2010-09-27
IPC分类号： G06F11/00
CPC分类号： G06F11/0793 , G06F11/073
摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.
摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。
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公开(公告)号：US20110250048A1
公开(公告)日：2011-10-13
申请号：US12756472
申请日：2010-04-08
CPC分类号： F04D29/4226 , F04D29/422 , F04D29/462
摘要： Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.
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公开(公告)号：US07969736B1
公开(公告)日：2011-06-28
申请号：US12701640
申请日：2010-02-08
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.
摘要翻译： 通过在相邻DIMM之间定位导热底座来冷却DIMM。 诸如热管或金属杆的导热基座通过导热元件从DIMM接收热量，导热元件被选择性地偏压抵靠所安装的DIMM。 底座将热量传送到沿着DIMM端部延伸的液体导管，其中循环液体带走热量。 导热元件提供可调整的跨度以适应DIMM表面之间的距离的变化。 可以安装本发明的实施例而不延伸到DIMM的高度之上。
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24.发明授权公开(公告)号：US07660109B2
公开(公告)日：2010-02-09
申请号：US11957619
申请日：2007-12-17
CPC分类号： H05K7/20754 , F25D17/06 , F25D2317/0655 , F25D2317/0661 , Y10T29/49826
摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.
摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。
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25.发明授权Liquid cooling apparatus and method for facilitating cooling of an electronics system 失效用于促进电子系统冷却的液体冷却装置和方法公开(公告)号：US07639499B1
公开(公告)日：2009-12-29
申请号：US12168259
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.
摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。
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公开(公告)号：US20070293137A1
公开(公告)日：2007-12-20
申请号：US11425182
申请日：2006-06-20
申请人： Martin J. Crippen , Richard E. Harper , John P. Karidis , Albert V. Makley , Jason A. Matteson , William J. Piazza , Malcolm S. Ware
发明人： Martin J. Crippen , Richard E. Harper , John P. Karidis , Albert V. Makley , Jason A. Matteson , William J. Piazza , Malcolm S. Ware
CPC分类号： H05K7/20736 , G06F1/20 , G06F1/206 , H05K7/20836
摘要： A computer system includes a plurality of subsystems cooled by a cooling flow; at least one redirection device, a management module, and a blower for generating the cooling flow. The redirection device is associated with at least one subsystem and operable to redirect at least a portion of the cooling flow away from the subsystem. The subsystems, the at least one redirection device, and the blower are disposed along a common cooling flow path. The management module is configured to determine cooling requirements of the subsystems and to control the operation of the blower and the at least one redirection device to maintain a specified amount of cooling to the subsystems and to reduce acoustical noise generated by the blower.
摘要翻译： 计算机系统包括由冷却流冷却的多个子系统; 至少一个重定向装置，管理模块和用于产生冷却流的鼓风机。 重定向设备与至少一个子系统相关联并且可操作以将冷却流的至少一部分重新定向远离子系统。 子系统，至少一个重定向装置和鼓风机沿着共同的冷却流动路径设置。 管理模块被配置为确定子系统的冷却要求并且控制鼓风机和至少一个重定向装置的操作以维持对子系统的指定量的冷却并且降低由鼓风机产生的声音噪声。
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27.发明授权公开(公告)号：US06970355B2
公开(公告)日：2005-11-29
申请号：US10300615
申请日：2002-11-20
IPC分类号： H01L23/467 , H05K7/20 , H05H7/20
CPC分类号： H05K7/207 , H01L23/467 , H01L2924/0002 , H05K7/20781 , H01L2924/00
摘要： A hybrid cooling system is provided which is particularly useful for cooling electronic circuit components disposed on circuit boards arranged in a plurality of drawers within a cabinet or frame. Air cooling is provided locally with a supplementary, auxiliary, or secondary cooling system being provided at more distant frame level locations. This configuration permits optimal sizing of the respective hybrid cooling system components without negatively impacting the coefficient of performance (COP). Hybrid heat sinks are employed to accommodate the hybrid cooling system design.
摘要翻译： 提供了一种混合冷却系统，其特别适用于冷却布置在橱柜或框架内的多个抽屉中的电路板上的电子电路部件。 在本地提供空气冷却，在更远的框架水平位置处设置辅助，辅助或二次冷却系统。 这种配置允许相应的混合冷却系统部件的最佳尺寸，而不会不利地影响性能系数（COP）。 采用混合散热器来适应混合冷却系统设计。
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公开(公告)号：US09089076B2
公开(公告)日：2015-07-21
申请号：US13543089
申请日：2012-07-06
CPC分类号： H05K7/20454 , F28D15/04 , G06F1/20 , H05K7/20218 , H05K7/20336 , Y10T29/49826
摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要翻译： 提供了用于将热量从电子部件传送出去的装置和方法。 在一个实施例中，一种方法将适形的热界面元件定位成与电子部件进行热传导接触。 导热构件设置在适形的热界面元件内。 导热构件与歧管连接，使得导热构件与歧管热传导接触。 可以在不拆卸设备的情况下安装或移除电子部件。
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29.发明授权Airflow from a blower with one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower 有权来自具有一个或多个可调节导向叶片的鼓风机的气流，其在位于鼓风机出口处的一个或多个枢转点处固定到鼓风机公开(公告)号：US08591167B2
公开(公告)日：2013-11-26
申请号：US12756429
申请日：2010-04-08
IPC分类号： F04D27/00
CPC分类号： F04D29/4226 , F04D29/422 , F04D29/462
摘要： Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.
摘要翻译： 公开了用于改进离开鼓风机的气流的方法，装置和产品，所述风扇具有一个或多个可调导向叶片，所述导向叶片在位于鼓风机出口处的一个或多个枢转点处固定到鼓风机，包括： 鼓风机中的叶轮，并且根据叶轮的旋转速度来调整至少一个可调导叶的位置。
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公开(公告)号：US08451303B2
公开(公告)日：2013-05-28
申请号：US13022378
申请日：2011-02-07
IPC分类号： B41J2/315
CPC分类号： B41J2/315 , B41J2/32 , B41J11/009
摘要： A method is provided for detecting the type of print media provided to a thermal printer. A printer has a heat source disposed adjacent a temperature sensor to transfer heat upon activation across a portion of an introduced print media to the temperature sensor and a controller to receive a signal from the temperature sensor and to obtain a temperature signature generally identifying attributes of the introduced print media and to adjust print head settings in response to the identified attributes. The printer may further comprise a sensor to detect access to a print media storage compartment and to initiate examination of the heat transfer properties of the introduced print media upon detecting that the print storage compartment has been accessed.
摘要翻译： 提供了一种用于检测提供给热敏打印机的打印介质的类型的方法。 打印机具有设置在温度传感器附近的热源，以在激活时将热量传递到引入的打印介质的一部分到温度传感器，以及控制器，以接收来自温度传感器的信号，并且获得温度特征， 引入打印介质并根据识别的属性调整打印头设置。 打印机还可以包括传感器，用于检测对打印介质存储隔间的访问，并且在检测到已经访问了打印存储隔间时，开始检查引入的打印介质的传热特性。
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