METHODS AND APPARATUS FOR REDUCING FLOW SPLITTING ERRORS USING ORIFICE RATIO CONDUCTANCE CONTROL
    21.
    发明申请
    METHODS AND APPARATUS FOR REDUCING FLOW SPLITTING ERRORS USING ORIFICE RATIO CONDUCTANCE CONTROL 审中-公开
    减少流量分解误差的方法和装置

    公开(公告)号:US20110265883A1

    公开(公告)日:2011-11-03

    申请号:US12907942

    申请日:2010-10-19

    CPC classification number: H01J37/3244 Y10T137/0357 Y10T137/877

    Abstract: Methods and apparatus for gas delivery to a process chamber are provided herein. In some embodiments, an apparatus for processing substrates may include a mass flow controller to provide a desired total fluid flow; a first flow control manifold comprising a first inlet, a first outlet, and a first plurality of orifices selectably coupled therebetween, wherein the first inlet is coupled to the mass flow controller; and a second flow control manifold comprising a second inlet, a second outlet, and a second plurality of orifices selectably coupled therebetween, wherein the second inlet is coupled to the mass flow controller; wherein a desired flow ratio between the first outlet and the second outlet is selectably obtainable when causing the fluid to flow through one or more of the first plurality of orifices of the first manifold and one or more of the second plurality of orifices of the second manifold.

    Abstract translation: 本文提供了用于气体输送到处理室的方法和装置。 在一些实施例中,用于处理衬底的装置可以包括质量流量控制器以提供期望的总流体流量; 第一流量控制歧管,包括第一入口,第一出口和可选择地联接在其间的第一多个孔,其中所述第一入口联接到所述质量流量控制器; 以及第二流量控制歧管,包括第二入口,第二出口和可选择地联接在其间的第二多个孔,其中所述第二入口联接到所述质量流量控制器; 其中当所述流体流过所述第一歧管的所述第一多个孔中的一个或多个并且所述第二歧管的所述第二多个孔中的一个或多个时,可选择地获得所述第一出口和所述第二出口之间的期望流量比 。

    Full wave rectified power water treatment device
    22.
    发明授权
    Full wave rectified power water treatment device 有权
    全波整流动力水处理装置

    公开(公告)号:US07704364B2

    公开(公告)日:2010-04-27

    申请号:US11248776

    申请日:2005-10-11

    CPC classification number: C02F1/48 C02F2201/483

    Abstract: A fluid treatment device includes an AC power source connected to first, second and third conductors. A electromagnetic field generating device is positioned adjacent to a fluid conduit, electrically connected to the first and third conductors to form a first circuit. A second electromagnetic field generating device is positioned adjacent to a second fluid conduit, electrically connected to the second and third electrical conductors to form a second circuit. A circuit element in the first circuit initiates a high frequency electromagnetic field at said first electromagnetic field generating device during a first half of the AC wave form in the first circuit, and a circuit element in the second circuit initiates a high frequency electromagnetic field at said first electromagnetic field generating device during a second half of the AC wave form in the second circuit.

    Abstract translation: 流体处理装置包括连接到第一,第二和第三导体的AC电源。 电磁场产生装置邻近流体导管定位,电连接到第一和第三导体以形成第一电路。 第二电磁场产生装置邻近第二流体导管定位,电连接到第二和第三电导体以形成第二电路。 第一电路中的电路元件在第一电路的AC波形的前半部分期间在所述第一电磁场产生装置处发起高频电磁场,并且第二电路中的电路元件在所述第一电路中启动高频电磁场 在第二电路中的交流波形的第二半期间的第一电磁场产生装置。

    Lighting system with multiple beam shapes
    25.
    发明授权
    Lighting system with multiple beam shapes 失效
    具有多个波束形状的照明系统

    公开(公告)号:US5665305A

    公开(公告)日:1997-09-09

    申请号:US557743

    申请日:1995-11-13

    CPC classification number: F21V5/04 F21S10/007 F21V14/06 F21W2131/406

    Abstract: Overlapping lenses for use in a light fixture provided to project a beam of light in a first beam shape having a first cross-sectional geometry. A first lens device is supported in the fixture and movable into a position to interrupt the beam of light for selecting beam shape by altering the first projected beam shape from the first cross-sectional geometry to a second cross-sectional geometry different from the first geometry. The first lens device includes at least one lenticular lens element having lenticules oriented in a first direction. A second lens device, separate from the first device, is supported in the fixture and movable into a position to interrupt the beam of light for selecting beam shape by altering the second projected beam shape from the second cross-sectional geometry to a third cross-sectional geometry different from the first and second geometries. The second lens device includes another lenticular lens element overlapping the one lenticular lens element of the first lens device and has lenticules oriented in a second direction, different from the first direction. The lens elements may be carried by discs rotatably mounted in the fixture. Each disc may carry a plurality of lens elements which can be combined by overlapping to change beam angle and beam shape.

    Abstract translation: 用于照明器具的重叠透镜,被设置成以具有第一横截面几何形状的第一光束形状投影光束。 第一透镜装置被支撑在固定装置中并且可移动到通过将第一投影光束形状从第一横截面几何形状改变为不同于第一几何形状的第二横截面几何形状来中断光束以选择光束形状的位置 。 第一透镜装置包括至少一个双凸透镜元件,其具有沿第一方向取向的微透镜。 与第一装置分离的第二透镜装置被支撑在固定装置中并且可移动到通过将第二投影光束形状从第二横截面几何形状改变为第三截面来中断光束以选择光束形状的位置, 截面几何形状与第一和第二几何形状不同。 第二透镜装置包括与第一透镜装置的一个双凸透镜元件重叠的另一个双凸透镜元件,并且具有沿与第一方向不同的第二方向定向的微透镜。 透镜元件可以由可旋转地安装在固定装置中的盘承载。 每个盘可以携带多个透镜元件,这些透镜元件可以通过重叠而组合以改变光束角度和光束形状。

    Methods and apparatus for enhanced gas flow rate control
    26.
    发明授权
    Methods and apparatus for enhanced gas flow rate control 有权
    提高气体流量控制的方法和装置

    公开(公告)号:US09004107B2

    公开(公告)日:2015-04-14

    申请号:US13591212

    申请日:2012-08-21

    Abstract: The present invention provides methods and apparatus for controlling gas flow to a semiconductor-processing chamber. The invention includes deactivating ratio setpoint feedback control in a flow ratio controller; initiating gas flow through the flow ratio controller; moving valves of the flow ratio controller to a preset position based on a stored position when an upstream pressure reaches a stored upstream pressure value, wherein the stored position and the stored upstream pressure value were stored during a prior process run; determining that steady state flow ratio controller output flows have been reached; and activating ratio setpoint feedback control in the flow ratio controller. Numerous additional features are disclosed.

    Abstract translation: 本发明提供了用于控制到半导体处理室的气流的方法和装置。 本发明包括流量比控制器中的停用比率设定点反馈控制; 启动气流通过流量比控制器; 当上游压力达到存储的上游压力值时,基于存储位置,将流量比控制器的阀移动到预设位置,其中在先前的处理运行期间存储所存储的位置和存储的上游压力值; 确定稳态流量比控制器输出流量已达到; 和流量比控制器中的启动比设定点反馈控制。 公开了许多附加特征。

    METHODS AND APPARATUS FOR PROCESSING SUBSTRATES USING MODEL-BASED CONTROL
    28.
    发明申请
    METHODS AND APPARATUS FOR PROCESSING SUBSTRATES USING MODEL-BASED CONTROL 有权
    使用基于模型的控制处理基板的方法和装置

    公开(公告)号:US20130018500A1

    公开(公告)日:2013-01-17

    申请号:US13183520

    申请日:2011-07-15

    CPC classification number: G05D16/2046 G05B17/02 H01L21/67017 H01L21/67253

    Abstract: Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state.

    Abstract translation: 本文公开了方法和装置。 在一些实施例中,控制处理室的方法可以包括根据处理参数预先确定处理容积中的压力与排气门的位置之间的关系; 将所述处理室设定为处理容积中具有第一压力的第一状态和所述处理参数的第一值,其中所述排气阀基于所述预定关系设定在第一位置以产生所述第一值的所述第一压力; 当所述处理室改变为具有来自所述第一状态的第二压力和第二过程参数值的第二状态时,确定压力控制曲线以控制所述压力; 以及通过在将处理室改变到第二状态的同时改变排气门的位置来施加压力控制曲线来控制压力。

    Real time lead-line characterization for MFC flow verification
    29.
    发明授权
    Real time lead-line characterization for MFC flow verification 有权
    MFC流量验证的实时引线特性

    公开(公告)号:US08205629B2

    公开(公告)日:2012-06-26

    申请号:US12427947

    申请日:2009-04-22

    CPC classification number: G01F25/003 G01F25/0038 Y10T137/0324 Y10T137/7759

    Abstract: A method and apparatus that solve the problem of accurate measurement of gas flow so that the delivery of gases in semiconductor processing may be performed with greater confidence and accuracy by performing real-time characterization of a lead-line for mass flow controller (MFC) flow verification are provided. In one embodiment a mass flow verifier (MFV) provides rate of rise information to a controller via a digital interface without correcting for lead-line influences. After receiving the rate of rise data, the tool host computer computes a gas mass correction factor in real-time based on at least one of the following: MFC temperature sensor data, lead-line temperature sensor data, lead-line pressure transducer data, and lead-line volume. The rate of rise data and gas mass correction factor are used to compute accurate mass flow. The accurate mass flow information may be used to calibrate the MFC.

    Abstract translation: 一种解决气体流量精确测量问题的方法和装置,可以通过对质量流量控制器(MFC)流程的引线进行实时表征,以更高的置信度和准确性进行半导体处理中的气体输送 提供验证。 在一个实施例中,质量流量验证器(MFV)通过数字接口向控制器提供上升信息速率,而不会对引线影响进行校正。 在收到上升数据率之后,工具主机基于以下至少一个实时计算气体质量校正因子:MFC温度传感器数据,引线温度传感器数据,引线压力传感器数据, 和引线量。 上升率和气体质量校正因子用于计算精确质量流量。 准确的质量流量信息可用于校准MFC。

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