公开(公告)号：US08585830B2

公开(公告)日：2013-11-19

申请号：US12698870

申请日：2010-02-02

申请人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

发明人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

IPC分类号： B08B3/00 ,  H01L21/31 ,  G03F7/00 ,  G03F1/00

CPC分类号： G03F7/70991 ,  G03F7/70341

摘要： A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of: forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying washing processing to the substrate by said second processing unit after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device and transporting the substrate after the washing processing to said exposure device. The method further includes transporting the substrate from said exposure device and applying development processing by said third processing unit to the substrate transported after the exposure processing by said exposure device.

摘要翻译： 一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括以下步骤：通过所述第一处理在基板上形成由感光材料制成的感光膜 所述曝光装置进行曝光处理之前的单元。 该方法还包括在由所述第一处理单元形成所述感光膜之后并且在所述曝光装置进行曝光处理之前，通过所述第二处理单元对所述基板进行洗涤处理，并将所述基板在所述清洗处理之后传送到所述曝光装置。 所述方法还包括从所述曝光装置运送所述基板并将所述第三处理单元的显影处理应用于由所述曝光装置进行曝光处理之后运送的所述基板。

公开(公告)号：US20100136492A1

公开(公告)日：2010-06-03

申请号：US12698870

申请日：2010-02-02

申请人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

发明人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

IPC分类号： G03F7/20

CPC分类号： G03F7/70991 ,  G03F7/70341

摘要： A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of: forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying washing processing to the substrate by said second processing unit after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device and transporting the substrate after the washing processing to said exposure device. The method further includes transporting the substrate from said exposure device and applying development processing by said third processing unit to the substrate transported after the exposure processing by said exposure device.

摘要翻译： 一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括以下步骤：通过所述第一处理在基板上形成由感光材料制成的感光膜 所述曝光装置进行曝光处理之前的单元。 该方法还包括在由所述第一处理单元形成所述感光膜之后并且在所述曝光装置进行曝光处理之前，通过所述第二处理单元对所述基板进行洗涤处理，并将所述基板在所述清洗处理之后传送到所述曝光装置。 所述方法还包括从所述曝光装置运送所述基板并将所述第三处理单元的显影处理应用于由所述曝光装置进行曝光处理之后运送的所述基板。

公开(公告)号：US20090073394A1

公开(公告)日：2009-03-19

申请号：US12208925

申请日：2008-09-11

申请人： Tadashi Miyagi ,  Masashi Kanaoka ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Masakazu Sanada

发明人： Tadashi Miyagi ,  Masashi Kanaoka ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Masakazu Sanada

IPC分类号： G03B27/32 ,  B08B13/00

CPC分类号： H01L21/67034 ,  H01L21/67051 ,  H01L21/67225

摘要： After a substrate is cleaned, a liquid supply nozzle moves outward from above the center of the substrate while discharging a rinse liquid with the substrate rotated. In this case, a drying region where no rinse liquid exists expands on the substrate. When the liquid supply nozzle moves to above a peripheral portion of the substrate, the rotational speed of the substrate is reduced. The movement speed of the liquid supply nozzle is maintained as it is. Thereafter, the discharge of the rinse liquid is stopped while the liquid supply nozzle moves outward from the substrate. Thus, the drying region spreads over the whole substrate so that the substrate is dried.

摘要翻译： 在清洁基板之后，液体供应喷嘴从衬底的中心向外移动，同时在衬底旋转的同时排出冲洗液体。 在这种情况下，不存在冲洗液的干燥区域在基板上膨胀。 当液体供给喷嘴移动到基板的周边部分上方时，基板的旋转速度降低。 液体供应喷嘴的运动速度保持原样。 此后，在液体供给喷嘴从基板向外移动的同时停止冲洗液的排出。 因此，干燥区域遍及整个基板，使得基板被干燥。

公开(公告)号：US20070190437A1

公开(公告)日：2007-08-16

申请号：US11670108

申请日：2007-02-01

申请人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Tetsuya Hamada

发明人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Tetsuya Hamada

IPC分类号： G03C5/00

CPC分类号： G03F7/70925 ,  G03F7/168 ,  G03F7/7075 ,  G03F7/70916 ,  G03F7/70991 ,  G11B5/8404 ,  G11B7/261 ,  H01L21/67051 ,  H01L21/67225 ,  Y10S134/902

摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a blush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.

摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，抗蚀剂覆盖膜处理块，抗蚀剂覆盖膜去除块，清洁/干燥处理块，以及 一个接口块。 曝光装置被布置成与基板处理装置中的界面块相邻。 曝光装置通过浸渍方法使基板进行曝光处理。 在清洁/干燥处理块中的边缘清洁单元中，腮红与旋转基板的端部抵接，从而清洁曝光处理之前的基板的边缘。 此时，校正基板被清洁的位置。

公开(公告)号：US20060291854A1

公开(公告)日：2006-12-28

申请号：US11474614

申请日：2006-06-21

申请人： Koji Kaneyama ,  Kazuhito Shigemori ,  Akiko Harumoto ,  Tadashi Miyagi

发明人： Koji Kaneyama ,  Kazuhito Shigemori ,  Akiko Harumoto ,  Tadashi Miyagi

IPC分类号： G03D5/00

CPC分类号： G03D7/00 ,  G03F7/11 ,  G03F7/2041 ,  H01L21/0206 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742

摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block and an interface block. These blocks are arranged in the substrate processing apparatus in the above order. An exposure device is arranged adjacent to the interface block of the substrate processing apparatus. A hydrophobic processing unit is arranged in the resist cover film processing block and applies hydrophobic processing to the substrate before exposure processing.

摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，抗蚀剂覆盖膜处理块，抗蚀剂覆盖膜去除块，清洁/干燥处理块和 界面块 这些块按照上述顺序排列在基板处理装置中。 曝光装置被布置成与基板处理装置的界面块相邻。 在抗蚀剂覆盖膜处理块中设置疏水处理单元，在曝光处理之前对基板进行疏水处理。

公开(公告)号：US20060159449A1

公开(公告)日：2006-07-20

申请号：US11295257

申请日：2005-12-06

申请人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

发明人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

IPC分类号： G03D5/00

CPC分类号： H01L21/67034 ,  G03F7/38 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67207

摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The drying processing block comprises a drying processing group. The interface block comprises an interface transport mechanism. A substrate is subjected to exposure processing by the exposure device, and subsequently transported to the drying processing group by the interface transport mechanism. The substrate is subjected to cleaning and drying processing by the drying processing group.

摘要翻译： 基板处理装置包括分度器块，防反射膜处理块，抗蚀剂膜处理块，显影处理块，干燥处理块和界面块。 曝光装置设置在接口块附近。 干燥处理块包括干燥处理组。 接口块包括接口传送机制。 基板经曝光装置进行曝光处理，随后通过界面输送机构输送到干燥处理组。 通过干燥处理组对基板进行清洗和干燥处理。

公开(公告)号：US20060152693A1

公开(公告)日：2006-07-13

申请号：US11294727

申请日：2005-12-06

申请人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

发明人： Shuichi Yasuda ,  Masashi Kanaoka ,  Koji Kaneyama ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Toru Asano ,  Yukio Toriyama ,  Takashi Taguchi ,  Tsuyoshi Mitsuhashi ,  Tsuyoshi Okumura

IPC分类号： G03B27/52

CPC分类号： G03F7/70991 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178

摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a processing block for liquid immersion exposure processing, and an interface block. An exposure device is arranged adjacent to the interface block. The processing block for liquid immersion exposure processing comprises a coating processing group for resist cover film and a removal processing group for resist cover film. The resist cover film is formed in the processing block for liquid immersion exposure processing before the exposure processing. The resist cover film is removed in the processing block for liquid immersion exposure processing after the exposure processing.

摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，用于液浸曝光处理的处理块和界面块。 曝光装置设置在接口块附近。 用于液浸曝光处理的处理块包括用于抗蚀剂覆盖膜的涂覆处理组和抗蚀剂覆盖膜的去除处理组。 在曝光处理之前，在用于液浸曝光处理的处理块中形成抗蚀剂覆盖膜。 在曝光处理之后，在用于液浸曝光处理的处理块中去除抗蚀剂覆盖膜。

公开(公告)号：US20060067682A1

公开(公告)日：2006-03-30

申请号：US11226750

申请日：2005-09-14

申请人： Koji Kaneyama ,  Kazuhito Shigemori

发明人： Koji Kaneyama ,  Kazuhito Shigemori

IPC分类号： G03D5/00

CPC分类号： G03F7/11 ,  G03F7/168

摘要： An application processing unit forms a cover film of a component soluble in an aqueous alkaline solution on the surface of a substrate formed with a resist film. The application processing unit can supply a developer used in a development processing unit as a remover for removing a cover film component adhering to the peripheral edge of the substrate. Thus, it is possible to selectively remove the cover film from the peripheral edge of the substrate without influencing the resist film.

摘要翻译： 应用处理单元在形成有抗蚀剂膜的基板的表面上形成可溶于碱性水溶液的成分的覆盖膜。 应用处理单元可以提供用于显影处理单元中的显影剂，作为去除附着在基板周边的覆盖膜成分的去除剂。 因此，可以在不影响抗蚀剂膜的情况下从基板的周缘选择性地去除覆盖膜。

公开(公告)号：US06558053B2

公开(公告)日：2003-05-06

申请号：US10125229

申请日：2002-04-18

申请人： Kazuhito Shigemori ,  Masakazu Sanada ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama ,  Yukihiko Inagaki ,  Yoshihisa Yamada

发明人： Kazuhito Shigemori ,  Masakazu Sanada ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama ,  Yukihiko Inagaki ,  Yoshihisa Yamada

IPC分类号： G03D500

CPC分类号： H01L21/67161 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67178

摘要： A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.

公开(公告)号：US10134610B2

公开(公告)日：2018-11-20

申请号：US12208992

申请日：2008-09-11

申请人： Tadashi Miyagi ,  Masashi Kanaoka ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Masakazu Sanada

发明人： Tadashi Miyagi ,  Masashi Kanaoka ,  Kazuhito Shigemori ,  Shuichi Yasuda ,  Masakazu Sanada

IPC分类号： B05D3/04 ,  H01L21/67 ,  B05C11/08 ,  B05C13/02 ,  G03F7/30

摘要： After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is increased. The increase in the rotational speed of the substrate causes a centrifugal force to be slightly greater than tension, thereby causing the liquid layer to be held on the substrate with the thickness thereof in its peripheral portion increased and the thickness thereof at the center thereof decreased. Then, gas is discharged toward the center of the liquid layer from a gas supply nozzle, so that a hole is formed at the center of the liquid layer. This causes tension that is balanced with a centrifugal force exerted on the peripheral portion of the liquid layer to disappear. Furthermore, the rotational speed of the substrate is further increased while the gas is discharged. Thus, the liquid layer moves outward from the substrate.