Abstract:
A heater for depositing a thin film to deposit a thin film on a seated wafer by heating is provided. The heater for depositing a thin film includes: a wafer supporting plate on which a wafer is seated and a plurality of injection holes are disposed at the edge of the wafer supporting plate and in which a heat generating member is included; a shaft disposed at the lower side of the wafer supporting plate which comprises an inert gas pathway through which inert gas is provided; and a flow channel forming cover bonded to the lower part of the wafer supporting plate, and comprising an inner space formed between the flow channel forming cover and the wafer supporting plate, wherein the injection holes and the inert gas pathway are connected via the inner space.
Abstract:
There is provided a method of depositing a Ge—Sb—Te thin film, including: a Ge—Sb—Te thin-film forming step of feeding and purging a first precursor including any one of Ge, Sb and Te, a second precursor including another one of Ge, Sb and Te and a third precursor including the other one of Ge, Sb and Te into and from a chamber in which a wafer is mounted and forming the Ge—Sb—Te thin film on the wafer; and a reaction gas feeding step of feeding reaction gas while any one of the first to third precursors is fed.
Abstract:
The present invention relates to a semiconductor manufacturing device, which can be applied in a semiconductor metal interconnection process, and a manufacturing method thereof. The semiconductor manufacturing device includes a loadlock chamber, at least one process chamber, a transfer chamber, and an oxidation preventing gas supply unit. The process chamber processes an annealing process by receiving a substrate. The transfer chamber transfers the substrate between the loadlock chamber and the process chamber. The oxidation preventing gas supply unit supplies oxidation preventing gas into either the transfer chamber or the loadlock chamber.
Abstract:
In one embodiment, a redundancy circuit may include a comparison unit configured to record a first repair address through fuse cutting, compare a comparison address with the first repair address, and output a comparison result signal; a first fuse enable unit configured to output a first fuse enable signal for repairing the first repair address; a second fuse enable unit configured to output a second fuse enable signal for repairing a second repair address; a first determination unit configured to output a first repair determination signal in response to receipt of the first fuse enable signal and the comparison result signal; and a second determination unit configured to output a second repair determination signal in response to receipt of an inverted signal of a value of the comparison result signal corresponding to the certain bit, remaining bits, and the second fuse enable signal.
Abstract:
This invention relates to a composition for the prevention and treatment of acute graft-versus-host disease comprising prodigiosin isolated from Serratia marcescence B-1231 KCTC 0386BP, as an effective ingredient. The prodigiosin is immunosup-pressive by selectively suppressing the proliferation of T-cells through the suppression of the expression of IL-2 receptors, which is needed for the activation of T-cells. Prodigiosin can be used either alone or in conjunction with cyclosporin A for greater effect, since the two substances have different mode of actions. These make prodigiosin effective for the prevention and treatment of acute graft-versus-host disease.
Abstract:
A method of manufacturing a capacitor includes sequentially forming a storage electrode, a high dielectric layer, a plate electrode, and an interdielectric layer over a semiconductor substrate. A first post-annealing of the substrate is performed under an inert atmosphere at a first temperature, and then a second post-annealing is performed at a second temperature. The first and second post annealings can be performed after forming the high dielectric layer, the plate electrode, or the interdielectric layer, or any combination thereof, as long as the second post-annealing is performed after the first post-annealing. The post-annealings are not necessarily performed in a same place or stage. The first temperature may be about 600° C. to 900° C., and the second temperature about 100° C. to 600° C. As a result, the dielectric constant of the high dielectric layer is increased, and leakage current is reduced.
Abstract:
The present invention relates to a compound inhibiting HF-1 activity, a preparation method of the same, and a pharmaceutical composition comprising the same as an active ingredient. The compound of the present invention demonstrates anticancer activity not by non-selective cytotoxicity but by inhibiting the activity of HIF-1, the transcription factor playing an important role in cancer cell growth and metastasis.Accordingly, the compound or the pharmaceutically acceptable salt thereof according to the present invention inhibits HIF-1 activity, and therefore can be used as a therapeutic agent for solid tumors such as colon cancer, liver cancer, stomach cancer and breast cancer. In addition, the compound or the pharmaceutically acceptable salt thereof according to the present invention can be used as an active ingredient for a therapeutic agent for diabetic retinopathy or arthritis which may become worse when hypoxia-induced VEGF expression by HIF-1 increases.
Abstract:
An apparatus and method for providing a game service in cloud computing environment. A method may be provided for providing a streaming game service using a plurality of cloud computing servers. The method may include receiving user inputs from at least one user equipments, executing and progressing at least one game program in response to the user inputs, capturing audio and video data as progress results of the executed at least one game program, and streaming the captured audio and video data to a respective user equipment.
Abstract:
The present invention concerns a method of forming a chalcogenide thin film for a phase-change memory. In the method of forming a chalcogenide thin film according to the present invention, a substrate with a pattern formed is loaded into a reactor, and a source gas is supplied onto the substrate. Here, the source gas includes at least one source gas selected from germanium (Ge) source gas, gallium (Ga) source gas, indium (In) source gas, selenium (Se) source gas, antimony (Sb) source gas, tellurium (Te) source gas, tin (Sn) source gas, silver (Ag) source gas, and sulfur (S) source gas. A first purge gas is supplied onto the substrate in order to purge the source gas supplied onto the substrate, a reaction gas for reducing the source gas is then supplied onto the substrate, and a second purge gas is supplied onto the substrate in order to purge the reaction gas supplied onto the substrate. At least one operation, namely changing the supply time of the first purge gas and/or adjusting the internal pressure of the reactor is performed in such a way as to ensure that the deposition rate at an inner portion of the pattern is greater than the deposition rate at an upper portion of the pattern. According to the present invention, it is possible to form a chalcogenide thin film having an excellent gap-fill property by changing the purge time of the source gas or adjusting the internal pressure of the reactor in such a way as to ensure that the film forming rate at the inner portion of the pattern is greater than the film forming rate at the upper portion of the pattern.
Abstract:
The present invention relates to a communication method for upgrading software in a wireless network. The communication method according to one aspect of the present invention relates to a communication method for upgrading software on a specific device on a wireless network, and comprises a step wherein a first message that includes information indicating versions of one or more pieces of software being used by said device is transmitted to a controller of said wireless network and a step wherein said device receives from said controller a second message that includes indication information indicating whether it is necessary to perform a software upgrade.