Abstract:
The invention proposes a process for manufacturing a monolithic integrated circuit comprising at least one bipolar transistor in which the dopings of the regions are inserted into the substrate (2) exclusively by way of ion implantations. The invention deals with the problem of the current gain value variations during mass-production. This problem is solved in that during the implantation of the base dopings, in which the base area (32) is defined by means of a photoresist mask (5), the emitter area (11) is covered with an oxidation masking layer portion (71), with the ions of the base region (3) being implanted into the substrate surface once at a low accelerating energy and a great dose, with the oxidation masking layer portion (71) serving as the mask and, the next time, at a high accelerating energy and a relatively small dose, in the course of which the oxidation masking layer portion (1) is penetrated.
Abstract:
This relates to a method of producing a monolithic integrated I.sup.2 L circuit including a bipolar analog circuit part. In order to realize good current gain values in the I.sup.2 L transistors as well as high collector breakdown voltages in the analog circuit part, the base zone of the analog circuit part is prediffused prior to diffusion of the I.sup.2 L base and injector regions. After such prediffusion, excessive doping material from the diffusion masking layer is removed and simultaneously windows in the diffusion mask over the I.sup.2 L base and injector regions are opened. Next, doping material having a lower concentration than that which was used for the prediffusion of the analog base region is prediffused into the exposed regions of the substrate. This results in an expanded prediffused base region in the analog circuit part.
Abstract:
A technique for determining an offset-reduced Hall voltage (Uh), and/or an offset voltage (UH, offset) of a Hall sensor (1) includes applying a Hall sensor current (I) at first and second taps (a1, a2, a3) of the Hall sensor (1), and determining a first Hall voltage (Uh1) at third and fourth taps (a3, a4) displaced from the first and second taps (a1, a2, a5). A second Hall sensor current is applied modified relative to the first, and a second Hall voltage (Uh2) is determined. The Hall voltage (Uh) and/or Hall voltage offset (Uh,offset) are determined from the first and second Hall voltages. To compensate any offset present, a second measurement applies the second Hall sensor current I at taps (a3, a4) that are spatially displaced relative to the first and/or second taps.
Abstract translation:一种用于确定霍尔传感器(1)的偏移降低的霍尔电压(Uh)和/或偏移电压(UH,偏移)的技术包括在第一和第二抽头(a 1, a 1,a 2,a 3),并且确定在从第一和第二抽头(a 1,a 2,...)移位的第三和第四抽头(a 3,a 4)处的第一霍尔电压(Uh 1) a 5)。 施加相对于第一霍尔传感器电流的第二霍尔传感器电流,并确定第二霍尔电压(Uh 2)。 从第一和第二霍尔电压确定霍尔电压(Uh)和/或霍尔电压偏移(Uh,偏移)。 为了补偿存在的任何偏移,第二测量将第二霍尔传感器电流I应用于相对于第一和/或第二抽头在空间上移位的抽头(a 3,a 4)。
Abstract:
A device for detecting an angular position of a rotating object comprises a sensor that provides a sensor output signal dependent at least on the angular position (φ) of the object, and an evaluation circuit that receives the sensor output signal and a trip threshold and provides a detection signal when the level of the sensor output signal crosses the trip threshold. The trip threshold has levels in a range of values in which the level of the sensor output signal varies rapidly as a function of the angular position of the object.
Abstract:
The invention relates to a monolithic integrated sensor circuit, fabricated in CMOS technology, in which the circuit implemented on the semiconductor chip is connected to the ground connection via the substrate of the semiconductor chip, and in which the input signals are not referred to the potential of the ground connection.
Abstract:
In a CMOS circuit having at least a first subcircuit coupled between a first point of potential and a first circuit node, and having a second subcircuit coupled between a second circuit node and a second point of potential, said first and second circuit nodes being coupled together, the improvement in combination therewith, comprising: first circuit means coupled to the first point of potential for converting the first potential to a third potential as a function of the magnitude of said first potential, said third potential being of a value inbetween the first and second potentials; a FET having source, drain, gate and well terminals, said source terminal being coupled to said well terminal and to said first circuit node, said third potential being applied to said gate terminal, said drain terminal being coupled to said second circuit node; wherein said FET, in conjunction with said first circuit means, operates to selectively provide a difference in potential between said first and second circuit nodes, thereby preventing voltage breakdown within said subcircuits.
Abstract:
For improved offset compensation, a Hall sensor is provided with a device for orthogonally switching the Hall detector supply current and the Hall-voltage taps. A summing device determines an offset-compensated Hall-voltage value from first and second predetermined Hall-voltage values. The Hall-voltage values are formed by means of a Hall detector containing at least first and second Hall cells for offset-voltage precompensation. The first and second Hall cells are identical and are orthogonally switchable. The geometrical orientation of the first and second Hall cells includes an angle other than 0.degree. and 180.degree..
Abstract:
A method of producing an integrated insulated-gate field-effect transistor with an increased breakdown voltage provides in that at least one of the two zones, i.e. the source zone and/or the drain zone is surrounded by a relatively high-ohmic partial zone. This partial zone or the partial zones are first produced by way of ion implantation with the aid of a first implantation mask. After removal of this mask, the entire area of the field-effect transistor is covered with an oxidation masking layer comprising several selectively etchable partial layers, of which the lower partial layer is finally exposed and serves as the gate insulating layer. With the aid of the photoresist mask serving as an etching mask, openings are etched through the oxidation masking layer. The photoresist mask, together with the portions of the oxidation masking layer remaining therebelow, is used as an ion implantation mask for manufacturing both the source zone and the drain zone.
Abstract:
In the process according to the invention, in addition to the conventional two photoresist processes for opening the contact holes and for manufacturing the interconnecting pattern, two photoresist processes are used with one photoresist mask each for manufacturing the regions of the planar transistor. Without additional photoresist masks, further semiconductor components, such as integrated resistors and/or lateral transistors are capable of being manufactured. The process is characterized by the fact that, the first photoresist mask is used to manufacture a diffusion masking layer which leaves the base area of the planar transistor unmasked. In this area, the dopings of the collector region are introduced into the substrate and the collector region is diffused. Thereafter, at a relatively small dose rate, there is carried out an implantation of dopings of the base region. Upon removal of the diffusion masking layer and by employing a second photoresist mask, an oxidation masking layer is deposited which covers both the rim portion of the collector region and the emitter area. The oxidation masking layer serves as an implantation mask for the dopings of the external base partial region and for manufacturing an implantation mask of a thermally produced silicon oxide. Through the openings in this implantation mask there is effected the implantation of the dopings of the emitter region and those of the collector connecting region.