公开(公告)号：US20090022198A1

公开(公告)日：2009-01-22

申请号：US12173763

申请日：2008-07-15

Applicant: PIN CHUAN CHEN ,  CHAO HSIUNG CHANG ,  SHEN BO LIN ,  LUNG HSIN CHEN ,  WEN LIANG TSENG

Inventor： PIN CHUAN CHEN ,  CHAO HSIUNG CHANG ,  SHEN BO LIN ,  LUNG HSIN CHEN ,  WEN LIANG TSENG

IPC: H01S5/028 ,  H01L33/00 ,  H01L31/18 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L24/73 ,  H01L31/18 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package structure of a compound semiconductor device comprises a thin conductive film with a pattern, a die, at least one metal wire or metal bump and a transparent encapsulation material. The die is mounted on the first surface of the thin conductive film, and is electrically connected to the thin conductive film through the metal wire or the metal bump. The transparent encapsulation material is overlaid on the first surface of the conductive film and the die. A second surface of the conductive film is not covered by the transparent encapsulation material, and is opposite the first surface.

Abstract translation: 化合物半导体器件的封装结构包括具有图案的薄导电膜，裸片，至少一个金属线或金属凸块和透明封装材料。 芯片安装在薄导电膜的第一表面上，并通过金属线或金属凸块与薄导电膜电连接。 透明封装材料覆盖在导电膜和模具的第一表面上。 导电膜的第二表面不被透明封装材料覆盖，并且与第一表面相对。

公开(公告)号：US08344406B2

公开(公告)日：2013-01-01

申请号：US12970976

申请日：2010-12-17

Applicant: Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Jian-Shihn Tsang

Inventor： Min-Tsun Hsieh ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Chih-Yung Lin ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Jian-Shihn Tsang

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.

Abstract translation: 在发光器件封装及其制造方法中，将多层结构分配在基板上，其中至少两个具有不同折射率的膜交替堆叠在一起。

公开(公告)号：US20120280639A1

公开(公告)日：2012-11-08

申请号：US13300619

申请日：2011-11-20

Applicant: CHIH-YUNG LIN ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHING-LIEN YEH ,  MIN-TSUN HSIEH ,  CHUAN-FU YANG

Inventor： CHIH-YUNG LIN ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHING-LIEN YEH ,  MIN-TSUN HSIEH ,  CHUAN-FU YANG

IPC: H05B37/02

CPC classification number: F21S8/06 ,  F21V15/01 ,  F21V23/005 ,  F21V2200/20 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: A planar lighting module comprises a substrate, at least one light guide device and a driver. A frame is located on the substrate for fastening the at least one light guide device and the driver. By manipulation and binding, the planar lighting module can be easily assembled or dismantled, no screws or welded joints are used, and it is also convenient to service.

Abstract translation: 平面照明模块包括基板，至少一个导光装置和驱动器。 框架位于基板上，用于紧固至少一个导光装置和驱动器。 通过操作和装订，可以容易地组装或拆卸平面照明模块，不使用螺丝或焊接接头，也方便使用。

公开(公告)号：US20120075858A1

公开(公告)日：2012-03-29

申请号：US13172728

申请日：2011-06-29

Applicant: MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH ,  CHUAN-FU YANG

Inventor： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH ,  CHUAN-FU YANG

IPC: F21S4/00 ,  F21V29/00

CPC classification number: F21K9/23 ,  F21V3/00 ,  F21V29/74 ,  F21Y2115/10

Abstract: An exemplary LED bulb includes a holder, a housing, a heat spreader, a power module and an LED module. The housing connects to the holder. The heat spreader detachably engages with the housing. The power module detachably engages with the housing and is received in the housing. The LED module is arranged on the heat spreader. The LED module electrically connects to the holder via the power module. The LED module is physically separated from the power module.

Abstract translation: 示例性的LED灯泡包括保持器，壳体，散热器，功率模块和LED模块。 外壳连接到支架。 散热器可拆卸地与壳体接合。 电源模块可拆卸地与壳体接合并被容纳在壳体中。 LED模块布置在散热器上。 LED模块通过电源模块电连接到支架。 LED模块与电源模块物理分离。

公开(公告)号：US20110291135A1

公开(公告)日：2011-12-01

申请号：US13038385

申请日：2011-03-02

Applicant: MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

Inventor： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

IPC: H01L33/58

CPC classification number: H01L33/641 ,  H01L33/486 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/00012

Abstract: A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.

Abstract translation: 发光二极管封装包括具有第一表面和与第一表面相对的第二表面的硅衬底，其中第一表面包括空腔，固定在空腔底部的发光二极管芯片和固定到 硅衬底并覆盖发光二极管芯片。

公开(公告)号：US20110266570A1

公开(公告)日：2011-11-03

申请号：US12970976

申请日：2010-12-17

Applicant: MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH ,  CHI-WEI LIAO ,  JIAN-SHIHN TSANG

Inventor： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH ,  CHI-WEI LIAO ,  JIAN-SHIHN TSANG

IPC: H01L33/46 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.

Abstract translation: 在发光器件封装及其制造方法中，将多层结构分配在基板上，其中至少两个具有不同折射率的膜交替堆叠在一起。

公开(公告)号：USD644189S1

公开(公告)日：2011-08-30

申请号：US29375805

申请日：2010-09-28

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

公开(公告)号：US20110206079A1

公开(公告)日：2011-08-25

申请号：US12900676

申请日：2010-10-08

Applicant: MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

Inventor： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

IPC: H01S5/02 ,  H01L33/48

CPC classification number: H01L25/0756 ,  H01L25/167 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01S5/4025 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.

Abstract translation: 侧面发射半导体封装包括形成在封装的硅衬底上的双面电路和接合在电路的两个双面上的多个半导体发光器件，以提供具有两个发光侧的表面安装器件。

公开(公告)号：USD642998S1

公开(公告)日：2011-08-09

申请号：US29380580

申请日：2010-12-08

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Lung-Hsin Chen ,  Wen-Liang Tseng

公开(公告)号：USD642995S1

公开(公告)日：2011-08-09

申请号：US29375808

申请日：2010-09-28

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng