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    INFRARED TEMPERATURE SENSOR
    21.
    发明申请
    INFRARED TEMPERATURE SENSOR 有权

    公开(公告)号：US20210364359A1

    公开(公告)日：2021-11-25

    申请号：US16924698

    申请日：2020-07-09

    Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

    Inventor： Chein-Hsun WANG ,  Chen-Tang HUANG ,  Yu-Chih LIANG ,  Jenping KU

    IPC: G01J5/12 ,  G01J5/20

    Abstract: An infrared temperature sensor comprises a thermopile sensing chip. The thermopile sensing chip includes a chip substrate, a thermopile sensing unit, a heater and a temperature sensing element. The thermopile sensing unit is disposed on the chip substrate, receives infrared thermal radiation from a target and outputs a corresponding infrared sensation signal. The heater is disposed on the chip substrate and used to heat the chip substrate to a working temperature. The temperature sensing element is disposed on the chip substrate, senses the working temperature of the chip substrate and outputs a corresponding working temperature signal. In operation, the infrared temperature sensor can maintain the thermopile sensing unit at the preset working temperature. Thereby, a single-point temperature calibration is sufficient to obtain more accurate measurement results in a broad environmental temperature range.

    ULTRASONIC BIOMETRIC SENSOR
    23.
    发明申请
    ULTRASONIC BIOMETRIC SENSOR 审中-公开

    公开(公告)号：US20180211081A1

    公开(公告)日：2018-07-26

    申请号：US15864326

    申请日：2018-01-08

    Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

    Inventor： Chein-Hsun Wang ,  Wen-Chie Huang

    IPC: G06K9/00

    CPC classification number: G06K9/0002 ,  G06F21/32 ,  G06K9/00107

    Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.

    NON-DISPERSIVE INFRARED GAS DETECTOR, AND METHOD OF STABILIZING INFRARED EMISSION OF AN INCANDESCENT LAMP
    25.
    发明申请
    NON-DISPERSIVE INFRARED GAS DETECTOR, AND METHOD OF STABILIZING INFRARED EMISSION OF AN INCANDESCENT LAMP 审中-公开
    不分散的红外气体检测器，以及稳定不良灯泡的红外辐射的方法

    公开(公告)号：US20140209800A1

    公开(公告)日：2014-07-31

    申请号：US13803775

    申请日：2013-03-14

    Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

    Inventor： Jin-Shown SHIE ,  Chien-Hsun WANG

    IPC: G01N21/61 ,  H05B39/04

    CPC classification number: H05B39/04 ,  G01N21/3504

    Abstract: An NDIR gas detector includes a photodetector for detecting a portion of stray visible light emitted from an incandescent lamp so as to generate an induced electrical signal, which is compared with a preset reference signal associated with a predetermined constant level of the stray visible light corresponding to a constant temperature of the lamp so as to obtain a level difference between the induced electrical signal and the reference signal. Electrical power supplied to the lamp is repeatedly regulated based on the level difference until the induced electrical signal and the reference signal have the same level, thereby stabilizing IR emission of the lamp in response to the lamp being kept at the constant temperature.

    Abstract translation: NDIR气体检测器包括用于检测从白炽灯发射的杂散可见光的一部分的光电检测器，以产生感应电信号，该感应电信号与预定的参考信号进行比较，该参考信号与对应于 灯的恒定温度，以便获得感应电信号和参考信号之间的电平差。 供电到灯的电力基于电平差反复调节，直到感应电信号和参考信号具有相同的电平，由此响应于灯被保持在恒定温度来稳定灯的IR发射。

    TEMPERATURE SENSING DEVICE
    27.
    发明公开
    TEMPERATURE SENSING DEVICE 审中-公开

    公开(公告)号：US20240133745A1

    公开(公告)日：2024-04-25

    申请号：US17970539

    申请日：2022-10-19

    Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

    Inventor： Chein-Hsun WANG ,  Ming LE ,  Tung-Yang LEE ,  Yu-Chih LIANG ,  Wen-Chie HUANG ,  Chen-Tang HUANG ,  Jenping KU

    IPC: G01J5/07 ,  G01J5/14

    CPC classification number: G01J5/07 ,  G01J5/14

    Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

    INFRARED TEMPERATURE SENSOR
    28.
    发明申请
    INFRARED TEMPERATURE SENSOR 有权

    公开(公告)号：US20220113203A1

    公开(公告)日：2022-04-14

    申请号：US17129074

    申请日：2020-12-21

    Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

    Inventor： Jenping Ku ,  Chein-Hsun Wang ,  Chein-Hsing Yu ,  Wen-Chang Yu

    IPC: G01K15/00 ,  G01J5/10 ,  G01K1/20

    Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

    GAS STOVE HAVING TEMPERATURE SENSING FUNCTION
    29.
    发明申请
    GAS STOVE HAVING TEMPERATURE SENSING FUNCTION 审中-公开

    公开(公告)号：US20170292711A1

    公开(公告)日：2017-10-12

    申请号：US15333806

    申请日：2016-10-25

    Applicant: Oriental System Technology Inc.

    Inventor： Li-Hwei Wang

    IPC: F24C3/12 ,  G08C17/02

    CPC classification number: F24C3/122 ,  F23D14/04 ,  F23D2208/10 ,  F23N1/002 ,  F23N1/005 ,  F23N5/082 ,  F23N2025/08 ,  F24C3/126 ,  G08C17/02 ,  H04L67/04 ,  H04L67/12

    Abstract: A gas stove having a temperature sensing function comprises a stove body, a temperature sensor and a gas controller. The stove body includes a burner assembly for heating a pot. The temperature sensor includes a thermopile sensor and a signal processor. The thermopile sensor senses infrared rays radiating from the pot and outputs a sensing signal. The signal processor is electrically connected with the thermopile sensor to process the sensing signal and outputs a control signal. The gas controller is electrically connected with the signal processor and adjusts a gas flow supplied to the burner assembly according to the control signal. The aforementioned gas stove senses the temperature of the pot with a non-contact manner.

    Chip-scale infrared emitter package
    30.
    发明授权
    Chip-scale infrared emitter package 有权
    芯片级红外发射器封装

    公开(公告)号：US08575578B1

    公开(公告)日：2013-11-05

    申请号：US13788757

    申请日：2013-03-07

    Applicant: Oriental System Technology Inc.

    Inventor： Jin-Shown Shie ,  Chen-Tang Huang ,  Chung-Nan Chen

    IPC: G01N21/35 ,  G01N21/00

    CPC classification number: G01N21/3504

    Abstract: A chip-scale infrared emitter package comprises an emitter chip and an enclosure. The emitter chip includes: a base having a central cavity; a membrane having a peripheral end, the peripheral end being isolated from a periphery of the central cavity by a loop-shaped gap; an electric resistor formed on the membrane; at least one slim supporting beam extending from the peripheral end of the membrane through the loop-shaped gap to the base; and a reflective material coated on the membrane. The enclosure has a can housing and a transparent window plate. The window plate cooperates with the can housing to define an enclosed vacuum chamber. The emitter chip is mounted in the enclosed vacuum chamber. The enclosed vacuum chamber has a pressure less than 0.01 torr.

    Abstract translation: 芯片级红外发射器封装包括发射极芯片和外壳。 发射极芯片包括：具有中心腔的基座; 具有外周端的膜，所述外周端通过环形间隙与所述中心腔的周边隔离; 形成在膜上的电阻器; 至少一个细长的支撑梁，从膜的周边端部延伸穿过环形间隙到基部; 和涂覆在膜上的反射材料。 外壳具有罐壳和透明窗板。 窗板与罐壳体配合以限定封闭的真空室。 发射极芯片安装在封闭的真空室中。 封闭的真空室的压力小于0.01乇。

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