Abstract:
Provided is a wavelength selective switch. The wavelength selective switch includes a first wavelength division multiplexer, an M number of optical switches, an (M+N−1) number of optical combiners, and a second wavelength division multiplexer. The first wavelength division multiplexer receives optical signals of an M number of wavelength channels to divide the received optical signals according to each channel, thereby outputting the divided optical signals. The M number of optical switches changes a path of on an optical signal outputted by an M number of wavelength channels from the first wavelength division multiplexer into one of an N number of output ports. The (M+N−1) number of optical combiners is respectively connected to the N number of output ports of the optical switches. The (M+N−1) number of optical combiners couple the N number of inputted optical signals to one output port. The second wavelength division multiplexer has an (M+N−1) number of input ports and an N number of output ports. The (M+N−1) number of output signals of the optical combiners is connected to the input ports, respectively, and the inputted signals are multiplexed to output the multiplexed signals from any of the N number of output ports.
Abstract:
Provided are a method and structure for optical connection between an optical transmitter and an optical receiver. The method includes the steps of: forming on a substrate a light source device, an optical detection device, an optical transmission unit electrically connected with the light source device, and an optical detection unit electrically connected with the optical detection device; preparing a flexible optical transmission-connection medium to optically connect the light source device with the optical detection device; cutting the prepared optical transmission-connection medium and surface-finishing it; and connecting one end of the surface-finished optical transmission-connection medium with the light source device and the other end with the optical detection device. Fabrication of an optical package having a 3-dimensional structure is facilitated and fabrication time is reduced, thus improving productivity. In addition, since the optical transmission-connection medium is directly connected with the light source device and the optical detection device, a polishing operation or additional connection block is not required, thus facilitating mass production.
Abstract:
Provided is an optical connection apparatus for a parallel optical interconnect module and a parallel optical interconnect module using the same for reducing a coupling loss generated due to an alignment error when coupled with an optical fiber, comprising: a 2D reflector in a prism shape and having at least two rows of cylinder type lens attached thereto; a 2D optical waveguide having at least two layers of core arrays; at least two rows of 2D optical benches; and a 2D ferrule capable of loading at least two layers of optical fibers so as to facilitate the fixing of the 2D optical waveguide for optical interconnection.
Abstract:
Provided is a differential pair interconnection apparatus for providing a differential signal on a printed circuit board having signal paths for high-speed differential signals to an external circuit and providing a signal inputted from the external circuit to the printed circuit board without any signal distortion. According to the differential pair interconnection apparatus of the present invention, there can be provided two separate physical channels without impedance mismatching.
Abstract:
Disclosed is a terahertz wave generator which includes a dual mode semiconductor laser device configured to generate at least two laser lights having different wavelengths and to beat the generated laser lights; and a photo mixer formed on the same chip as the dual mode semiconductor laser device and to generate a continuous terahertz wave when excited by the beat laser light.
Abstract:
Disclosed is a terahertz wave generator which includes a dual mode semiconductor laser device configured to generate at least two laser lights having different wavelengths and to beat the generated laser lights; and a photo mixer formed on the same chip as the dual mode semiconductor laser device and to generate a continuous terahertz wave when excited by the beat laser light.
Abstract:
Provided is a multiple distributed feedback laser device which includes a first distributed feedback region, a modulation region, a second distributed feedback region, and an amplification region. An active layer is disposed on the substrate of the first distributed feedback region, the modulation region, the second distributed feedback region, and the amplification region. A first diffraction grating is disposed in the first distributed feedback region to be coupled to the active layer in the first distributed feedback region. A second diffraction grating is disposed in the second distributed feedback region to be coupled to the active layer in the second distributed feedback region. The multiple distributed feedback laser device further includes a first micro heater configured to supply heat to the first diffraction grating and a second micro heater configured to supply heat to the second diffraction grating.
Abstract:
Provided is a multiple distributed feedback laser device which includes a first distributed feedback region, a modulation region, a second distributed feedback region, and an amplification region. An active layer is disposed on the substrate of the first distributed feedback region, the modulation region, the second distributed feedback region, and the amplification region. A first diffraction grating is disposed in the first distributed feedback region to be coupled to the active layer in the first distributed feedback region. A second diffraction grating is disposed in the second distributed feedback region to be coupled to the active layer in the second distributed feedback region. The multiple distributed feedback laser device further includes a first micro heater configured to supply heat to the first diffraction grating and a second micro heater configured to supply heat to the second diffraction grating.
Abstract:
Provided are a method and structure for optical connection between an optical transmitter and an optical receiver. The method includes the steps of: forming on a substrate a light source device, an optical detection device, an optical transmission unit electrically connected with the light source device, and an optical detection unit electrically connected with the optical detection device; preparing a flexible optical transmission-connection medium to optically connect the light source device with the optical detection device; cutting the prepared optical transmission-connection medium and surface-finishing it; and connecting one end of the surface-finished optical transmission-connection medium with the light source device and the other end with the optical detection device. Fabrication of an optical package having a 3-dimensional structure is facilitated and fabrication time is reduced, thus improving productivity. In addition, since the optical transmission-connection medium is directly connected with the light source device and the optical detection device, a polishing operation or additional connection block is not required, thus facilitating mass production.
Abstract:
Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.