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    REFLECTIVE UNIT AND LIGHT SOURCE MODULE HAVING THE SAME
    21.
    发明申请
    REFLECTIVE UNIT AND LIGHT SOURCE MODULE HAVING THE SAME 审中-公开
    反射单元和具有相同功能的光源模块

    公开(公告)号：US20130114266A1

    公开(公告)日：2013-05-09

    申请号：US13291814

    申请日：2011-11-08

    Applicant: Shih-Jen CHUANG ,  Han-Chi Chang ,  Dien-Jen Tsai

    Inventor： Shih-Jen CHUANG ,  Han-Chi Chang ,  Dien-Jen Tsai

    IPC: F21V7/00

    CPC classification number: G02B6/0008 ,  F21S6/001 ,  F21V3/00 ,  F21V5/04 ,  F21V7/0091 ,  F21V7/05 ,  F21V9/00 ,  F21V13/04 ,  F21V17/101 ,  F21Y2115/10 ,  G02B6/0006

    Abstract: A reflective unit (16, 26, 26a) for using with a light guiding element (14, 24, 24a) is disclosed. The light guiding element (14, 24, 24a) includes a light entrance portion (144, 244) and a light exit portion (148, 248, 248a). The light exit portion (148, 248, 248a) has a first concave portion (1482, 2482, 2482a) dented toward the light entrance portion (144, 244). The reflective unit (16, 26, 26a) includes a fixing member (162, 262, 262a) and a reflective member (164, 264). The fixing member (162, 262, 262a) is arranged around the perimeter of the upper end of the light exit portion (148, 248, 248a). The reflective member (164, 264) is arranged on the fixing member (162, 264, 262a) for covering the first concave portion (1482, 2482, 2482a) and forming a conical-shaped light propagating space (19, 29).

    Abstract translation: 公开了一种用于与导光元件（14,24,24）一起使用的反射单元（16,26,26a）。 导光元件（14,24,24a）包括光入射部分（144,244）和光出射部分（148,248,248a）。 光出射部分（148,248,248a）具有朝向光入射部分（144,244）凹陷的第一凹部（1482,2482,2482a）。 反射单元（16,26,26a）包括固定构件（162,262,262a）和反射构件（164,264）。 固定构件（162,262,262a）围绕光出射部分（148,248,248a）的上端的周边布置。 反射构件（164,264）布置在用于覆盖第一凹部（1482,2482,2482a）的固定构件（162,264,262a）上并形成圆锥形的光传播空间（19,29）。

    Light emitting diode package
    23.
    发明申请
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US20080013319A1

    公开(公告)日：2008-01-17

    申请号：US11635046

    申请日：2006-12-07

    Applicant: Chien-Chang Pei ,  Shih-Jen Chuang

    Inventor： Chien-Chang Pei ,  Shih-Jen Chuang

    IPC: F21V29/00

    CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2924/0002 ,  H05K3/3442 ,  Y10S362/80 ,  H01L2924/00

    Abstract: A light emitting diode package is disclosed. It includes a chip, a slug, a PCB, a lens and a reflector. The chip is mounted on the slug. The slug transmits the heat of the chip out of the light emitting diode package. The PCB connects the chip with circuits or wires. The lens transmits the emitting light of the chip out of the light emitting diode package. The reflector reflects the emitting light of the chip, and combines the slug, the PCB and the lens together.

    Abstract translation: 公开了一种发光二极管封装。 它包括芯片，芯片，PCB，透镜和反射器。 芯片安装在芯片上。 芯片将芯片的热量传送出发光二极管封装。 PCB将芯片与电路或电线连接。 透镜将芯片的发光发射出发光二极管封装。 反射器反射芯片的发光，并将芯片，PCB和透镜组合在一起。

    Circuit apparatus of LED vehicle lamp
    24.
    发明授权
    Circuit apparatus of LED vehicle lamp 有权
    LED车灯电路设备

    公开(公告)号：US07893622B2

    公开(公告)日：2011-02-22

    申请号：US12046895

    申请日：2008-03-12

    Applicant: Abram Chang ,  Shih-Jen Chuang

    Inventor： Abram Chang ,  Shih-Jen Chuang

    IPC: H05B37/00

    CPC classification number: B60Q1/2696 ,  H05B33/0821 ,  H05B33/0887 ,  Y02B20/341

    Abstract: A circuit apparatus of an LED vehicle lamp is disclosed. The circuit apparatus includes an input unit, an LED unit and a current limiting unit. The LED unit includes at least one light-emitting device. Each light-emitting device includes at least one LED and a protection device. The protection device and each one LED are connected in parallel. The circuit apparatus of an LED vehicle lamp protects the element of the LEDs from being damaged, increases traveling safety and simplifies maintenance.

    Abstract translation: 公开了一种LED车灯的电路装置。 电路装置包括输入单元，LED单元和限流单元。 LED单元包括至少一个发光装置。 每个发光装置包括至少一个LED和保护装置。 保护装置和每个LED并联连接。 LED车灯的电路装置保护LED的元件免受损坏，提高行驶安全性并简化维护。

    Electronic device
    25.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号：US07855897B2

    公开(公告)日：2010-12-21

    申请号：US11848238

    申请日：2007-08-30

    Applicant: Shi-Tan Lin ,  Shih-Jen Chuang ,  Chien-Hsu Hou ,  Hsiang-Li Yu ,  Pei-Chin Wang

    Inventor： Shi-Tan Lin ,  Shih-Jen Chuang ,  Chien-Hsu Hou ,  Hsiang-Li Yu ,  Pei-Chin Wang

    IPC: H05K9/00

    CPC classification number: G06F1/169 ,  G06F1/1616 ,  G06F3/03547

    Abstract: An electronic device including a first portion, a second portion, and a circuit board is provided. The first portion has a first surface including a first conductive region. The second portion has a second surface including a second conductive region and a second nonconductive region. The second conductive region and the second nonconductive region are respectively in contact with a part of the first conductive region. The circuit board has a plurality of electronic components thereon, and the circuit board is disposed at one side of the first portion and the second portion.

    Abstract translation: 提供了包括第一部分，第二部分和电路板的电子设备。 第一部分具有包括第一导电区域的第一表面。 第二部分具有包括第二导电区域和第二非导电区域的第二表面。 第二导电区域和第二非导电区域分别与第一导电区域的一部分接触。 电路板上具有多个电子元件，电路板设置在第一部分和第二部分的一侧。

    Method of manufacturing photo couplers
    26.
    发明授权
    Method of manufacturing photo couplers 有权
    制造光耦合器的方法

    公开(公告)号：US07666710B2

    公开(公告)日：2010-02-23

    申请号：US11510716

    申请日：2006-08-28

    Applicant: Ming-Jing Lee ,  Shih-Jen Chuang ,  Chih-Hung Hsu ,  Yi-Hu Chao

    Inventor： Ming-Jing Lee ,  Shih-Jen Chuang ,  Chih-Hung Hsu ,  Yi-Hu Chao

    IPC: H01L21/76

    CPC classification number: H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of manufacturing photo couplers is provided. At first, a receiver lead-frame array is cut from a lead-frame matrix having a transmitter lead-frame array and the receiver lead-frame array. Then, the receiver lead-frame array is overturned and placed on the lead-frame matrix to allow light-receiver elements on the receiver lead-frame array to face light-emitting elements on the transmitter lead-frame array of the lead-frame matrix. Finally, the receiver lead-frame array and the lead-frame matrix are connected.

    Abstract translation: 提供一种制造光耦合器的方法。 首先，从具有发射器引线框阵列和接收器引线框架阵列的引线框矩阵切割接收器引线框架阵列。 然后，接收器引线框架阵列被翻转并放置在引线框矩阵上，以使接收器引线框架阵列上的光接收器元件面对引线框矩阵的发射器引线框架阵列上的发光元件 。 最后，连接接收器引线框架阵列和引线框矩阵。

    REDUNDANT SYSTEM
    28.
    发明申请
    REDUNDANT SYSTEM 审中-公开
    冗余系统

    公开(公告)号：US20080184066A1

    公开(公告)日：2008-07-31

    申请号：US11751091

    申请日：2007-05-21

    Applicant: Shih-Jen Chuang ,  Chang-Cheng Yap ,  Bo-Yuan Shih

    Inventor： Shih-Jen Chuang ,  Chang-Cheng Yap ,  Bo-Yuan Shih

    IPC: G06F11/00

    CPC classification number: G06F11/2028 ,  G06F11/1645 ,  G06F11/2051

    Abstract: A redundant system comprising at least two hosts is provided. The redundant system randomly selects one active host under normal operating conditions, and sets the other hosts on stand-by. The active host controls the other hosts and peripheral devices connecting thereto through buses.

    Abstract translation: 提供了包括至少两个主机的冗余系统。 冗余系统在正常工作条件下随机选择一台活动主机，并将其他主机置于待机状态。 主动主机通过总线控制与其连接的其他主机和外围设备。

    Light emitting diode packaging structure
    30.
    发明申请
    Light emitting diode packaging structure 审中-公开
    发光二极管封装结构

    公开(公告)号：US20070164408A1

    公开(公告)日：2007-07-19

    申请号：US11489496

    申请日：2006-07-20

    Applicant: Robert Yeh ,  Shih-Jen Chuang

    Inventor： Robert Yeh ,  Shih-Jen Chuang

    IPC: H01L23/495

    CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/00014

    Abstract: A light emitting diode (LED) packaging structure includes a package body, a lead frame and a reflective wall. The package body includes a chip accommodating space for an LED chip, and a portion of the lead frame is exposed to the chip accommodating space. The reflective wall is connected with the lead frame and extendedly bends from the lead frame to cover a sidewall of the accommodating space so that rays of the LED chip can reflect from the reflective wall mostly.

    Abstract translation: 发光二极管（LED）封装结构包括封装体，引线框架和反射壁。 封装体包括用于LED芯片的芯片容纳空间，并且引线框架的一部分暴露于芯片容纳空间。 反射壁与引线框架连接并从引线框架延伸弯曲以覆盖容纳空间的侧壁，使得LED芯片的光线可以大部分从反射壁反射。

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