Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition
    22.
    发明授权
    Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition 有权
    图案形成工艺,化学放大正性抗蚀剂组合物和抗蚀剂改性组合物

    公开(公告)号:US08658346B2

    公开(公告)日:2014-02-25

    申请号:US12850266

    申请日:2010-08-04

    IPC分类号: G03F7/38 G03F7/20

    摘要: A pattern is formed by (1) coating a first positive resist composition onto a substrate, baking, patternwise exposing, PEB, and developing to form a first positive resist pattern including a large area feature, (2) applying a resist-modifying composition comprising a basic nitrogen-containing compound and heating to modify the first resist pattern, and (3) coating a second positive resist composition thereon, patternwise exposing, and developing to form a second resist pattern. The large area feature in the first resist pattern has a film retentivity of at least 50% after the second pattern formation.

    摘要翻译: 通过(1)将第一正性抗蚀剂组合物涂布在基材上,烘烤,图案曝光,PEB和显影以形成包括大面积特征的第一正性抗蚀剂图案,(2)涂覆抗蚀剂改性组合物,形成图案,所述抗蚀剂改性组合物包含 碱性含氮化合物和加热以改性第一抗蚀剂图案,和(3)在其上涂覆第二正性抗蚀剂组合物,图案曝光和显影以形成第二抗蚀剂图案。 第一抗蚀剂图案中的大面积特征在第二图案形成之后具有至少50%的膜保持性。

    RESIST POLYMER, PREPARING METHOD, RESIST COMPOSITION AND PATTERNING PROCESS
    24.
    发明申请
    RESIST POLYMER, PREPARING METHOD, RESIST COMPOSITION AND PATTERNING PROCESS 审中-公开
    耐候聚合物,制备方法,耐蚀组合物和图案处理方法

    公开(公告)号:US20110054133A1

    公开(公告)日:2011-03-03

    申请号:US12940511

    申请日:2010-11-05

    IPC分类号: C08F224/00

    摘要: A polymer for resist use is prepared by previously charging a reactor with a solution containing a chain transfer agent and holding at a polymerization temperature, and continuously or discontinuously adding dropwise a solution containing monomers and a polymerization initiator to the reactor for radical polymerization. The polymer has a minimized content of a substantially insoluble component. A resist composition using the polymer as a base resin produces a minimized number of defects when processed by photolithography and is useful in forming microscopic patterns.

    摘要翻译: 通过预先向反应器中加入含有链转移剂并保持在聚合温度的反应器,并连续地或不连续地向反应器中滴加含有单体和聚合引发剂的溶液进行自由基聚合来制备抗蚀剂用聚合物。 聚合物具有基本上不溶性组分的最小化含量。 使用该聚合物作为基础树脂的抗蚀剂组合物通过光刻处理产生最小数目的缺陷,并且可用于形成微观图案。

    Polymer, resist composition and patterning process
    27.
    发明授权
    Polymer, resist composition and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US07601479B2

    公开(公告)日:2009-10-13

    申请号:US10936753

    申请日:2004-09-09

    CPC分类号: G03F7/0397 Y10S430/111

    摘要: A polymer comprising recurring units of formulae (1) to (4) wherein R1, R3, R4 and R7 are hydrogen or methyl, R2 is an acid labile group, R5 and R6 are hydrogen or hydroxyl, and R8 is a lactone structure group and having a Mw of 1,000-50,000 is provided. A resist composition comprising the inventive polymer has a sensitivity to high-energy radiation, improved resolution and etching resistance and lends itself to lithographic micropatterning with electron beams or deep UV.

    摘要翻译: 包含式(1)至(4)的重复单元的聚合物,其中R1,R3,R4和R7是氢或甲基,R2是酸不稳定基团,R5和R6是氢或羟基,R8是内酯结构基团, 提供Mw为1,000-50,000的Mw。 包含本发明聚合物的抗蚀剂组合物对高能量辐射具有敏感性,改进的分辨率和耐蚀刻性,并且使其自身适用于具有电子束或深紫外线的光刻微图案。

    DOUBLE PATTERNING PROCESS
    28.
    发明申请
    DOUBLE PATTERNING PROCESS 有权
    双重图案处理

    公开(公告)号:US20090208886A1

    公开(公告)日:2009-08-20

    申请号:US12370901

    申请日:2009-02-13

    IPC分类号: G03F7/20

    摘要: Double patterns are formed by coating a first chemically amplified positive resist composition comprising an acid labile group-bearing resin and a photoacid generator and prebaking to form a resist film on a processable substrate, exposing the resist film to high-energy radiation, PEB, and developing with an alkaline developer to form a first positive resist pattern, treating the first resist pattern to be alkali soluble and solvent resistant, coating a second resist composition and prebaking to form a reversal film, and exposing the reversal film to high-energy radiation, PEB, and developing with an alkaline developer to form a second positive resist pattern. The last development step includes dissolving away the reversed first resist pattern and achieving reversal transfer.

    摘要翻译: 通过涂布第一化学放大的正型抗蚀剂组合物形成双重图案,该组合物包含含酸不稳定基团的树脂和光酸产生剂,并且预烘烤以在可加工的基材上形成抗蚀剂膜,将抗蚀剂膜暴露于高能辐射,PEB和 用碱性显影剂显影以形成第一正性抗蚀剂图案,将第一抗蚀剂图案处理为碱溶性和耐溶剂性,涂覆第二抗蚀剂组合物和预烘烤以形成反转膜,并将反转膜暴露于高能量辐射, PEB,并用碱性显影剂显影以形成第二正性抗蚀剂图案。 最后的发展步骤包括将反转的第一抗蚀剂图案溶解并实现反转印。

    Positive resist composition and patterning process
    29.
    发明授权
    Positive resist composition and patterning process 有权
    正抗蚀剂组成和图案化工艺

    公开(公告)号:US07541133B2

    公开(公告)日:2009-06-02

    申请号:US11984614

    申请日:2007-11-20

    IPC分类号: G03F7/004 G03F7/30

    摘要: A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid, and (B) an acid generator. The resin (A) is a polymer comprising tertiary alkyl protective group units having a hydrophobic tetracyclo[4.4.0.12,5.17,10]-dodecane structure, hydroxyadamantane units, monocyclic lactone units, and carboxylic acid units. The acid generator (B) is a specific sulfonium salt compound.

    摘要翻译: 正型抗蚀剂组合物包含(A)在酸作用下变得可溶于碱性显影剂的树脂组分和(B)酸产生剂。 树脂(A)是包含具有疏水性四环[4.4.0.12,5.17,10] - 十二烷结构的叔烷基保护基单元,羟基金刚烷单元,单环内酯单元和羧酸单元的聚合物。 酸产生剂(B)是特定的锍盐化合物。