公开(公告)号：US20230124732A1

公开(公告)日：2023-04-20

申请号：US17745809

申请日：2022-05-16

Applicant: Unimicron Technology Corp.

Inventor： Heng-Ming Nien ,  Chih-Chiang Lu ,  Cho-Ying Wu ,  Shih-Lian Cheng

IPC: C25D5/00

Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.

公开(公告)号：US11631626B2

公开(公告)日：2023-04-18

申请号：US17206108

申请日：2021-03-18

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Po-Hsiang Wang ,  Chi-Chun Po

IPC: H01L23/06 ,  H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L25/065

Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

公开(公告)号：US11600936B2

公开(公告)日：2023-03-07

申请号：US17322906

申请日：2021-05-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pei-Wei Wang ,  Ching-Ho Hsieh ,  Shao-Chien Lee ,  Kuo-Wei Li

IPC: H05K1/14 ,  H01R12/62 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

公开(公告)号：US20230058180A1

公开(公告)日：2023-02-23

申请号：US17505686

申请日：2021-10-20

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Yu-Shen Chen ,  Chung-Yu Lan

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/32 ,  H05K3/02 ,  H05K3/42

Abstract: A substrate is manufactured by drilling a chip containing groove in a composite inner layer circuit structure, having a component connecting end of a circuit layer protruding from a mounting side wall in the chip containing groove, mounting a chip component in the chip containing groove, and connecting the surface bonding pad to the component connecting end. The chip component in the present invention penetrates at least two circuit layers, and the surface bonding pad is bonded to the component connecting end of the circuit layer directly, reducing the occupied area of the chip component in each one of the circuit layers, and increasing the area for circuit disposing and the possible amount of chip components that may be mounted in the substrate.

公开(公告)号：US11562972B2

公开(公告)日：2023-01-24

申请号：US17463559

申请日：2021-09-01

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Yu-Chi Shen ,  Tzyy-Jang Tseng ,  Chen-Hua Cheng ,  Pei-Wei Wang

IPC: H01L21/56 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01Q1/22

Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.

公开(公告)号：US11516910B1

公开(公告)日：2022-11-29

申请号：US17371114

申请日：2021-07-09

Applicant: Unimicron Technology Corp.

Inventor： Chia-Yu Peng ,  John Hon-Shing Lau ,  Kai-Ming Yang ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  Tzyy-Jang Tseng

IPC: H01R12/52 ,  H05K1/02 ,  H05K1/11 ,  H05K3/24 ,  H05K3/06 ,  H05K3/40

Abstract: A circuit board structure includes a redistribution structure layer, a build-up circuit structure layer, and a connection structure layer. The redistribution structure layer has a first and second surface, and includes an inner and outer dielectric layer, first connecting pads, and chip pads. A bottom surface of each first connecting pad is aligned with the first surface, and the chip pads are protruded from and located on the second surface. The build-up circuit structure layer includes second connecting pads. The connection structure layer is disposed between the redistribution structure layer and the build-up circuit structure layer and includes a substrate and conductive paste pillars penetrating the substrate. The first connecting pads are electrically connected to the second connecting pads via the conductive paste pillars, respectively. A top surface of each conductive paste pillar is aligned with the first surface of the redistribution structure layer.

公开(公告)号：US20220367307A1

公开(公告)日：2022-11-17

申请号：US17875443

申请日：2022-07-28

Applicant: Unimicron Technology Corp.

Inventor： Pu-Ju Lin ,  Kai-Ming Yang ,  Cheng-Ta Ko

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78

Abstract: A manufacturing method of a chip package structure includes the following steps. A plurality of chips is disposed on a first insulating layer. The back surface of each of the chips is in direct contact with the first insulating layer. A stress buffer layer is formed to extend and cover the active surface and the peripheral surface of each of the chips, and a bottom surface of the stress buffer layer is aligned with the back surface of each of the chips. The stress buffer layer has an opening exposing a part of the active surface of each of the chips, and the redistribution layer is electrically connected to each of the chips through the opening. A plurality of solder balls is electrically connected to the redistribution layer exposed by the blind holes. A singularizing process is performed to form a plurality of chip package structures separated from each other.

公开(公告)号：US11477886B2

公开(公告)日：2022-10-18

申请号：US17367419

申请日：2021-07-05

Applicant: Unimicron Technology Corp.

Inventor： Yunn-Tzu Yu ,  Ching-Ho Hsieh ,  Wang-Hsiang Tsai

IPC: H05K1/14 ,  H05K1/11

Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

公开(公告)号：US11462452B2

公开(公告)日：2022-10-04

申请号：US17156626

申请日：2021-01-24

Applicant: Unimicron Technology Corp.

Inventor： Pu-Ju Lin ,  Kai-Ming Yang ,  Cheng-Ta Ko

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L21/56 ,  H01L21/78

Abstract: A chip package structure including a chip, a stress buffer layer, a first insulating layer, a redistribution layer, a second insulating layer, and a solder ball is provided. The chip has an active surface, a back surface and a peripheral surface. The stress buffer layer covers the active surface and the peripheral surface, and the first insulating layer is disposed on the back surface. A bottom surface of the stress buffer layer is aligned with the back surface of the chip. The redistribution layer is electrically connected to the chip through an opening of the stress buffer layer. The second insulating layer covers the stress buffer layer and the redistribution layer. The solder ball is disposed in a blind hole of the second insulating layer and electrically connected to the redistribution layer. A top surface of the solder ball protrudes from an upper surface of the second insulating layer.

公开(公告)号：US11445596B2

公开(公告)日：2022-09-13

申请号：US17153856

申请日：2021-01-20

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Pei-Chang Huang

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.