公开(公告)号：US11482460B2

公开(公告)日：2022-10-25

申请号：US16703385

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Yun Hsu ,  Ying-Chung Chen

IPC: H01L23/04 ,  H01L31/0203 ,  H01L31/02 ,  H01L23/00 ,  H01L23/10

Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.

公开(公告)号：US10770625B1

公开(公告)日：2020-09-08

申请号：US16413472

申请日：2019-05-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen

IPC: H01L33/48 ,  H01L33/64 ,  H01L31/173 ,  H01L31/024 ,  H01L33/58 ,  H01L31/0203 ,  H01L33/62 ,  H01L31/0232

Abstract: A semiconductor device package includes a substrate, a heat dissipation structure disposed on the substrate, and a first optical module disposed on the heat dissipation structure. The heat dissipation structure includes a housing, an optical component disposed on the housing, and a light-emitting device disposed in the housing and capable of emitting light toward the first optical component.

公开(公告)号：US10720751B2

公开(公告)日：2020-07-21

申请号：US16118228

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan Tsai ,  Lu-Ming Lai ,  Ying-Chung Chen ,  Shih-Chieh Tang

IPC: G02B6/02 ,  H04B10/50 ,  G02B6/35 ,  G02B6/42 ,  H04B10/80 ,  H01S5/022 ,  H01L31/0203 ,  H01L33/62 ,  H01L23/00 ,  H01L23/538 ,  H01S5/40 ,  H01L33/48 ,  H01S5/02 ,  H01L25/075 ,  H01S5/183 ,  H01L25/04 ,  H01L31/02 ,  H01L25/16

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

公开(公告)号：US10121918B2

公开(公告)日：2018-11-06

申请号：US14795613

申请日：2015-07-09

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Jung-Hsuan Chang ,  Ying-Chung Chen

IPC: G01S7/499 ,  H01S5/026 ,  H01L27/144 ,  H01L31/0232 ,  H01L31/18 ,  G01S17/02 ,  G01S7/481 ,  H01S5/183

Abstract: The present disclosure relates to an optical module. In an embodiment, the optical module includes a carrier, a light source, a light detector, and a first polarizer. The light source and the light detector are disposed adjacent to a first surface of the carrier. The first polarizer is disposed on the light detector. The optical module is configured to polarize light emitted from the light source into a first polarization direction substantially perpendicular to a second polarization direction of light permitted through the first polarizer.

公开(公告)号：US09905722B1

公开(公告)日：2018-02-27

申请号：US15391648

申请日：2016-12-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsu-Liang Hsiao ,  Sung-Fu Yang

IPC: H01L31/12 ,  H01L31/16 ,  H01L31/0232

CPC classification number: H01L31/16 ,  H01L31/02325

Abstract: An optical module structure includes a light source, a light receiver, a dielectric layer, a circuit layer, an encapsulant and a light shielding structure. The light source is embedded in the encapsulant, and a first surface of the light source is exposed from a first surface of the encapsulant. The light receiver is embedded in the encapsulant, and a first surface of the light receiver is exposed from the first surface of the encapsulant. The dielectric layer is disposed on the first surface of the encapsulant. The circuit layer is disposed on the dielectric layer and electrically connected to the light source and the light receiver. The light shielding structure is disposed in the dielectric layer corresponding to a location between the light source and the light receiver.

公开(公告)号：US11276797B2

公开(公告)日：2022-03-15

申请号：US16384847

申请日：2019-04-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng Tsai ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Ying-Chung Chen

IPC: H01L31/12 ,  H01L31/0203 ,  H01L31/0232

Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.

公开(公告)号：US11264367B2

公开(公告)日：2022-03-01

申请号：US14835280

申请日：2015-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung-Hsuan Chang ,  Ying-Chung Chen ,  Chao-Lin Shih

IPC: G01J1/04 ,  H01L25/16 ,  G06F1/3231 ,  G01S7/481 ,  H01L31/167 ,  G01S17/04 ,  G01J1/02 ,  H01L23/00 ,  H01L27/146

Abstract: The present disclosure relates to an optical module, including: a carrier, a emitter, a detector and an encapsulant. The carrier has a first surface. The emitter is disposed above the first surface. The detector is disposed above the first surface. The encapsulant is disposed on the first surface and exposes at least a portion of the emitter.

公开(公告)号：US10686105B2

公开(公告)日：2020-06-16

申请号：US16011555

申请日：2018-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Ying-Chung Chen ,  Hsin-Ying Ho

IPC: H01L33/56 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/62

Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.

公开(公告)号：US10508910B2

公开(公告)日：2019-12-17

申请号：US14975083

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.