Predictive control systems and methods
    23.
    发明授权

    公开(公告)号:US10671131B2

    公开(公告)日:2020-06-02

    申请号:US14871526

    申请日:2015-09-30

    Applicant: Apple Inc.

    Abstract: Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

    Dynamic master assignment in distributed wireless audio system for thermal and power mitigation

    公开(公告)号:US10306363B2

    公开(公告)日:2019-05-28

    申请号:US16033020

    申请日:2018-07-11

    Applicant: APPLE INC.

    Abstract: A method for operating a distributed wireless audio system including several loudspeaker cabinets all of which can communicate with each other as part of a computer network. The method receives temperature data that is indicative of temperature of a first loudspeaker cabinet, which has a network master responsibility of obtaining an audio signal from an audio source and wirelessly transmitting some of the audio signal to a second loudspeaker cabinet of several loudspeaker cabinets, for playback by the second loudspeaker cabinet, while playing back some of the audio signal by the first loudspeaker cabinet. The method determines whether a thermal threshold of the first loudspeaker cabinet has been reached, based on the temperature data. The method, in response to the thermal threshold being reached, gives up the network master responsibility from the first loudspeaker cabinet to the second loudspeaker cabinet, where doing so reduces temperature in the first loudspeaker cabinet.

    Electronic Devices With Ventilation Systems
    28.
    发明申请
    Electronic Devices With Ventilation Systems 有权
    带通风系统的电子设备

    公开(公告)号:US20170060201A1

    公开(公告)日:2017-03-02

    申请号:US14834217

    申请日:2015-08-24

    Applicant: Apple Inc.

    Abstract: An electronic device such as a portable computer may be provided with a lower housing and an upper housing. The electronic device may include hinge structures which allow the upper housing to rotate about a rotational axis relative to the lower housing. The electronic device may include a ventilation port structure with intake openings that allow air to be drawn into the electronic device. The ventilation structure may also include exhaust openings that are used to expel air from the lower housing. When the electronic device is in an open position, it may be desirable for the ventilation structure to form more exhaust openings than when the electronic device is in a closed position. The ventilation structure may form lower exhaust openings when the electronic device is in the closed position and form upper and lower exhaust openings when the electronic device is in the open position.

    Abstract translation: 诸如便携式计算机的电子设备可以设置有下壳体和上壳体。 电子设备可以包括允许上壳体相对于下壳体绕旋转轴线旋转的铰链结构。 电子设备可以包括具有允许空气被吸入电子设备的进气口的通风口结构。 通风结构还可以包括用于从下壳体排出空气的排气口。 当电子设备处于打开位置时,与电子设备处于关闭位置相比,通风结构可能希望形成更多的排气口。 当电子设备处于关闭位置时,通风结构可以形成较低的排气口,并且当电子设备处于打开位置时形成上下排气口。

    Gaskets for thermal ducting around heat pipes
    29.
    发明授权
    Gaskets for thermal ducting around heat pipes 有权
    用于热管周围热管的垫圈

    公开(公告)号:US09423841B2

    公开(公告)日:2016-08-23

    申请号:US15012661

    申请日:2016-02-01

    Applicant: Apple Inc.

    Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

    Abstract translation: 所公开的实施例提供了用于便携式电子设备的部件。 该部件包括垫圈,其包含围绕热管的底部设置的刚性部分,其中刚性部分在电子设备的风扇和排气口之间形成管道。 垫圈还包括结合到刚性部分的第一柔性部分,其中第一柔性部分包括在热管在电子装置中组装期间打开并且封闭在热管和刚性部分上以将管道密封 热管组装后。

    SHROUDED FAN IMPELLER WITH REDUCED COVER OVERLAP
    30.
    发明申请
    SHROUDED FAN IMPELLER WITH REDUCED COVER OVERLAP 有权
    具有减少覆盖面的风扇叶轮

    公开(公告)号:US20150152883A1

    公开(公告)日:2015-06-04

    申请号:US14559672

    申请日:2014-12-03

    Applicant: Apple Inc.

    CPC classification number: F04D25/0613 F04D29/162 F04D29/4226

    Abstract: The described embodiments relate to improving efficiency of a low-profile cooling fan. In one embodiment, an impeller of the cooling fan includes a shroud which covers a central portion of the impeller, thereby allowing a central inlet portion of the blades to have an increased fan blade height when compared to a cooling fan constrained by minimum part tolerances between the fan blades and a portion of the fan housing. In some embodiments, the impeller includes splitter blades that can improve performance of the low-profile cooling fan.

    Abstract translation: 所描述的实施例涉及提高低轮廓冷却风扇的效率。 在一个实施例中,冷却风扇的叶轮包括覆盖叶轮的中心部分的护罩,从而允许叶片的中心入口部分与风扇叶片高度相比具有增加的风扇叶片高度, 风扇叶片和风扇壳体的一部分。 在一些实施例中,叶轮包括可提高低轮廓冷却风扇性能的分流叶片。

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