公开(公告)号：US11183411B2

公开(公告)日：2021-11-23

申请号：US17157428

申请日：2021-01-25

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar Vellore ,  Alexander N. Lerner ,  Steven Trey Tindel

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/683 ,  H01L21/687

Abstract: A method includes aligning and positioning a carrier in a predetermined orientation and location within a first front opening pod (FOUP) of a cluster tool, transferring the carrier to a charging station of the cluster tool, transferring a substrate from a second front opening pod (FOUP) of the cluster tool to the charging station and chucking the substrate onto the carrier, transferring the carrier having the substrate thereon from the charging station to a factory interface of the cluster tool, aligning the carrier having the substrate thereon in the factory interface of the cluster tool such that during substrate processing within a processing platform of the cluster tool the carrier is properly oriented and positioned relative to components of the processing platform, where the processing platform comprises one or more processing chambers, transferring the aligned carrier having the substrate thereon from the factory interface to the processing platform of the cluster tool for substrate processing, and transferring the aligned carrier having the processed substrate thereon from the processing platform to the factory interface.

公开(公告)号：US20180342422A1

公开(公告)日：2018-11-29

申请号：US15606456

申请日：2017-05-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Wenguang Li ,  James S. Papanu ,  Wei-Sheng Lei ,  Prabhat Kumar ,  Brad Eaton ,  Ajay Kumar ,  Alexander N. Lerner

IPC: H01L21/78 ,  H01L21/308 ,  H01L21/3065 ,  H01L21/268 ,  H01L21/02

Abstract: Light-absorbing masks and methods of dicing semiconductor wafers are described. In an example, a method of dicing a semiconductor wafer including a plurality of integrated circuits involves forming a mask above the semiconductor wafer. The mask includes a water-soluble matrix based on a solid component and water, and a light-absorber species throughout the water-soluble matrix. The mask and a portion of the semiconductor wafer are patterned with a laser scribing process to provide a patterned mask with gaps and corresponding trenches in the semiconductor wafer in regions between the integrated circuits. The semiconductor wafer is plasma etched through the gaps in the patterned mask to extend the trenches and to singulate the integrated circuits. The patterned mask protects the integrated circuits during the plasma etching.

公开(公告)号：US09793132B1

公开(公告)日：2017-10-17

申请号：US15154790

申请日：2016-05-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Wenguang Li ,  James S. Papanu ,  Ramesh Krishnamurthy ,  Prabhat Kumar ,  Brad Eaton ,  Ajay Kumar ,  Alexander N. Lerner

IPC: H01L21/00 ,  H01L21/308 ,  H01L21/78 ,  H01L21/3065

CPC classification number: H01L21/3086 ,  H01L21/02057 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/3085 ,  H01L21/78

Abstract: Etch masks and methods of dicing semiconductor wafers are described. In an example, an etch mask for a wafer singulation process includes a water-soluble matrix based on a solid component and water. The etch mask also includes a plurality of particles dispersed throughout the water-soluble matrix. The plurality of particles has an average diameter approximately in the range of 5-100 nanometers. A ratio of weight % of the solid component to weight % of the plurality of particles is approximately in the range of 1:0.1-1:4.

公开(公告)号：US09390950B2

公开(公告)日：2016-07-12

申请号：US14529848

申请日：2014-10-31

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

公开(公告)号：US20150170955A1

公开(公告)日：2015-06-18

申请号：US14109808

申请日：2013-12-17

Applicant: Applied Materials, Inc.

Inventor： Alan Hiroshi Ouye ,  Alexander N. Lerner

IPC: H01L21/687 ,  H01L21/3065 ,  H01L21/67

CPC classification number: H01L21/68785 ,  H01J37/32522 ,  H01J37/32651 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207

Abstract: Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a shadow ring assembly for a plasma processing chamber includes a shadow ring having an annular body and an inner opening. The shadow ring assembly further includes a cooling channel disposed in the annular body for cooling fluid transport. The cooling channel is coupled to a pair of supply/return openings at a surface of the annular body.

Abstract translation: 对具有多个集成电路的各晶片的切割半导体晶片的方法和装置进行说明。 在一个示例中，用于等离子体处理室的阴影环组件包括具有环形体和内部开口的阴影环。 阴影环组件还包括设置在环形体中用于冷却流体输送的冷却通道。 冷却通道联接到环形体的表面处的一对供应/返回开口。

公开(公告)号：US08900889B2

公开(公告)日：2014-12-02

申请号：US13656150

申请日：2012-10-19

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/66 ,  H01L21/687 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

公开(公告)号：US08888916B2

公开(公告)日：2014-11-18

申请号：US14088013

申请日：2013-11-22

Applicant: Applied Materials, Inc.

Inventor： Ming-Kuei (Michael) Tseng ,  Norman L. Tam ,  Yoshitaka Yokota ,  Agus S. Tjandra ,  Robert Navasca ,  Mehran Behdjat ,  Sundar Ramamurthy ,  Kedarnath Sangam ,  Alexander N. Lerner

IPC: C23C16/00 ,  H01L21/00 ,  H01L21/67 ,  F27D7/06

CPC classification number: H01L21/67115 ,  F27D7/06 ,  H01L21/67017 ,  H01L21/67098

Abstract: Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.

Abstract translation: 本发明的实施例提供了用于改善热处理期间气体分布的装置和方法。 本发明的一个实施例提供了一种用于处理衬底的装置，其包括限定处理体积的室主体，设置在处理容积中的衬底支撑件，其中衬底支撑件构造成支撑和旋转衬底;气体入口组件， 室主体的入口并且被配置为向处理容积提供第一气流，以及联接到室主体的出口的排气组件，其中气体入口组件和排气组件设置在室主体的相对侧上 ，并且排气组件限定了被配置为延长处理量的排气量。