公开(公告)号：US11631813B2

公开(公告)日：2023-04-18

申请号：US16806511

申请日：2020-03-02

Applicant: Applied Materials, Inc.

Inventor： Kevin Moraes ,  Alexander N. Lerner

IPC: H01L51/00 ,  C23C14/04 ,  C23C14/02 ,  C23C14/12 ,  H01L51/42

Abstract: Generally, examples described herein relate to deposition masks and methods of manufacturing and using such deposition masks. An example includes a method for forming a deposition mask. A mask layer is deposited on a substrate. Mask openings are patterned through the mask layer. A central portion of the substrate is removed to define a substrate opening through a periphery portion of the substrate. The mask layer with the mask openings through the mask layer extending across the substrate opening.

公开(公告)号：USD967351S1

公开(公告)日：2022-10-18

申请号：US29755419

申请日：2020-10-20

Applicant: Applied Materials, Inc.

Designer： Alexander N. Lerner ,  Graeme Jamieson Scott ,  Prashanth Kothnur

公开(公告)号：US11195756B2

公开(公告)日：2021-12-07

申请号：US14491856

申请日：2014-09-19

Applicant: APPLIED MATERIALS, INC.

Inventor： James M. Holden ,  Alexander N. Lerner ,  Ajay Kumar ,  Aparna Iyer ,  Alan Hiroshi Ouye

IPC: H01J37/32 ,  H01L21/78 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  H01L21/308

Abstract: Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a cover ring for protecting a carrier and substrate assembly during an etch process includes an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly. An outer frame surrounds the inner opening. The outer frame has a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly.

公开(公告)号：US11158540B2

公开(公告)日：2021-10-26

申请号：US15606456

申请日：2017-05-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Wenguang Li ,  James S. Papanu ,  Wei-Sheng Lei ,  Prabhat Kumar ,  Brad Eaton ,  Ajay Kumar ,  Alexander N. Lerner

IPC: H01L21/78 ,  H01L21/311 ,  H01L21/02 ,  H01L21/268 ,  H01L21/3065 ,  H01L21/308

Abstract: Light-absorbing masks and methods of dicing semiconductor wafers are described. In an example, a method of dicing a semiconductor wafer including a plurality of integrated circuits involves forming a mask above the semiconductor wafer. The mask includes a water-soluble matrix based on a solid component and water, and a light-absorber species throughout the water-soluble matrix. The mask and a portion of the semiconductor wafer are patterned with a laser scribing process to provide a patterned mask with gaps and corresponding trenches in the semiconductor wafer in regions between the integrated circuits. The semiconductor wafer is plasma etched through the gaps in the patterned mask to extend the trenches and to singulate the integrated circuits. The patterned mask protects the integrated circuits during the plasma etching.

公开(公告)号：US10692765B2

公开(公告)日：2020-06-23

申请号：US14536318

申请日：2014-11-07

Applicant: APPLIED MATERIALS, INC.

Inventor： James M. Holden ,  Alexander N. Lerner ,  Ajay Kumar ,  Brad Eaton ,  Aparna Iyer

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/677 ,  H01L21/78 ,  H01L21/311 ,  H01L21/3065 ,  H01L21/67 ,  H01J37/32 ,  H01L21/3213 ,  H01L21/308

Abstract: Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma etch apparatus includes a plasma etch chamber. The plasma etch chamber includes a plasma source disposed in an upper region of the plasma etch chamber, a cathode assembly disposed below the plasma source, and a support pedestal for supporting a substrate carrier below the plasma source. The plasma etch apparatus also includes a transfer chamber coupled to the plasma etch chamber. The transfer chamber includes a transfer arm for supporting a substantial portion of a dicing tape of the substrate carrier, the transfer arm configured to transfer a sample from the support pedestal following an etch singulation process.

公开(公告)号：USD969980S1

公开(公告)日：2022-11-15

申请号：US29755418

申请日：2020-10-20

Applicant: Applied Materials, Inc.

Designer： Alexander N. Lerner ,  Graeme Jamieson Scott ,  Prashanth Kothnur

公开(公告)号：US20200378000A1

公开(公告)日：2020-12-03

申请号：US16854893

申请日：2020-04-21

Applicant: Applied Materials, Inc.

Inventor： Alexander N. Lerner ,  Roey Shaviv ,  Prashanth Kothnur ,  Satish Radhakrishnan ,  Xiaozhou Che

IPC: C23C16/448 ,  C23C16/52 ,  C23C16/455 ,  C23C16/458

Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.

公开(公告)号：US09564349B2

公开(公告)日：2017-02-07

申请号：US13656158

申请日：2012-10-19

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/68 ,  H01L21/687 ,  C23C16/46 ,  H01L21/683

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

公开(公告)号：US09209049B2

公开(公告)日：2015-12-08

申请号：US14189696

申请日：2014-02-25

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Alexander N. Lerner

IPC: H01L21/00 ,  H01L21/67 ,  C30B31/14 ,  H01L21/30 ,  H01L21/66

CPC classification number: H01L21/67098 ,  C30B31/14 ,  H01L21/30 ,  H01L21/67109 ,  H01L21/67115 ,  H01L22/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In one embodiment, a substrate processing apparatus includes a chamber having an interior volume with an upper portion and a lower portion, a cooling source disposed in the upper portion of the interior volume, a heating source opposing the cooling source, a magnetically movable substrate support that moves between the upper portion and the lower the portion, and a plurality of sensors coupled to the chamber to detect the position of the substrate support relative to the heating source and the cooling source.

Abstract translation: 在一个实施例中，衬底处理设备包括具有内部容积的腔室，其具有上部和下部，设置在内部容积的上部的冷却源，与冷却源相对的加热源，可磁性的衬底支撑 其在上部和下部之间移动，并且多个传感器耦合到室以检测衬底支撑件相对于加热源和冷却源的位置。

公开(公告)号：US11538706B2

公开(公告)日：2022-12-27

申请号：US16848645

申请日：2020-04-14

Applicant: Applied Materials, Inc.

Inventor： Alexander N. Lerner ,  Michael P. Karazim ,  Andrew J. Constant ,  Jeffrey A. Brodine ,  Kim Ramkumar Vellore ,  Kevin Moraes ,  Roey Shaviv

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/673 ,  H01L21/677 ,  C23C16/04

Abstract: An alignment module for positioning a mask on a substrate comprises a mask stocker, an alignment stage, and a transfer robot. The mask stocker houses a mask cassette that stores a plurality of masks. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer one of the one or more masks from the mask stocker to the alignment stage and position the mask over the substrate. The alignment module may be part of an integrated platform having one or more transfer chambers, a factory interface having a substrate carrier chamber and one or more processing chambers. A carrier may be coupled to a substrate within the substrate carrier chamber and moved between the processing chambers to generate a semiconductor device.