公开(公告)号：US10916492B2

公开(公告)日：2021-02-09

申请号：US15977966

申请日：2018-05-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsann Huei Lee ,  Lu-Ming Lai

IPC: H01L23/49 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.

公开(公告)号：US10862014B2

公开(公告)日：2020-12-08

申请号：US14939331

申请日：2015-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Shih-Chieh Tang

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/46 ,  H01L33/48 ,  H01L33/62

Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.

公开(公告)号：US10436635B2

公开(公告)日：2019-10-08

申请号：US15267028

申请日：2016-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: G01J1/04 ,  H01L31/0203 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  H01L25/16 ,  G01J1/42

Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.

公开(公告)号：US11835363B2

公开(公告)日：2023-12-05

申请号：US17684374

申请日：2022-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

CPC classification number: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US11817397B2

公开(公告)日：2023-11-14

申请号：US17129641

申请日：2020-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Hui-Chung Liu ,  Yu-Che Huang

IPC: H01L23/00 ,  H01L23/538 ,  H01L21/50 ,  G01L1/26 ,  H01R12/61 ,  H01L21/60

CPC classification number: H01L23/562 ,  G01L1/26 ,  H01L21/50 ,  H01L23/5387 ,  H01L24/80 ,  H01R12/61 ,  H01L2021/60135

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.

公开(公告)号：US11535509B2

公开(公告)日：2022-12-27

申请号：US16685902

申请日：2019-11-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Wei Liu ,  Huei-Siang Wong ,  Lu-Ming Lai

IPC: B81B7/00 ,  B81C1/00 ,  G01N33/00

Abstract: A semiconductor package structure includes an electronic device having a first surface and an exposed region adjacent to the first surface; a dam disposed on the first surface and surrounding the exposed region of the electronic device; and a filter structure disposed on the dam.

公开(公告)号：US20220123192A1

公开(公告)日：2022-04-21

申请号：US17564065

申请日：2021-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Lu-Ming Lai ,  Yu-Ying Lee ,  Yung-Yi Chang

IPC: H01L33/62 ,  H01L33/48 ,  B81C1/00

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US11217499B2

公开(公告)日：2022-01-04

申请号：US16448970

申请日：2019-06-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Hui-Chung Liu

IPC: H01L23/31 ,  B81B7/00 ,  H01L23/10 ,  B06B1/06 ,  H01L21/56 ,  B81C1/00

Abstract: A semiconductor package structure includes a substrate; a first die on the substrate, wherein an active surface of the first die is facing away from the substrate; a second die on the active surface of the first die, electrically connected to the first die through a plurality of conductive terminals; and a sealing structure on the active surface of the first die, surrounding the plurality of conductive terminals and abutting the second die thereby forming a cavity between the first die and the second die. A method for manufacturing the semiconductor package structure is also provided.

公开(公告)号：US11174157B2

公开(公告)日：2021-11-16

申请号：US16452370

申请日：2019-06-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Yu-Hsuan Tsai ,  Yin-Hao Chen ,  Hsin Lin Wu ,  San-Kuei Yu

IPC: B81C1/00 ,  H01L23/498 ,  H01L23/00 ,  B81B7/00

Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.

公开(公告)号：US11014806B2

公开(公告)日：2021-05-25

申请号：US15599377

申请日：2017-05-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang Hsiao ,  Lu-Ming Lai ,  Ching-Han Huang ,  Chia-Hung Shen

IPC: B81C3/00 ,  B81C1/00

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.