ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM
    21.
    发明申请
    ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM 有权
    电极厚膜组合物(S),电极(S)及其形成的半导体器件(S)

    公开(公告)号:US20110006268A1

    公开(公告)日:2011-01-13

    申请号:US12834968

    申请日:2010-09-24

    IPC分类号: H01B1/22

    摘要: The present invention is directed to an electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu, Au, Ag, Pd and Pt; and (3) mixtures thereof; (3) glass frit wherein said glass frit is Pb-free; dispersed in (d) an organic medium, and wherein the average diameter of said electroconductive metal particles is in the range of 0.5-10.0 μm. The present invention is further directed to an electrode formed from the composition as detailed above and a semiconductor device(s) (for example, a solar cell) comprising said electrode.

    摘要翻译: 本发明涉及一种导电厚膜组合物,其包含:(a)选自(1)Al,Cu,Au,Ag,Pd和Pt中的导电金属颗粒; (2)Al,Cu,Au,Ag,Pd和Pt的合金; 和(3)它们的混合物; (3)玻璃料,其中所述玻璃料是无铅的; 分散在(d)有机介质中,并且其中所述导电金属颗粒的平均直径在0.5-10.0μm的范围内。 本发明还涉及由上述组合物形成的电极和包括所述电极的半导体器件(例如,太阳能电池)。

    Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices
    24.
    发明授权
    Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices 有权
    含有铋 - 氧化碲的厚膜糊剂及其在制造半导体器件中的应用

    公开(公告)号:US08845932B2

    公开(公告)日:2014-09-30

    申请号:US13438124

    申请日:2012-04-26

    IPC分类号: H01B1/02

    摘要: The present invention is directed to an electroconductive thick film paste composition comprising electrically conductive Ag, a second electrically conductive metal selected from the group consisting of Ni, Al and mixtures thereof and a Pb-free bismuth-tellurium-oxide all dispersed in an organic medium. The present invention is further directed to an electrode formed from the thick film paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode.

    摘要翻译: 本发明涉及一种导电厚膜糊组合物,其包含导电Ag,选自Ni,Al及其混合物的第二导电金属和全部分散在有机介质中的无铅铋 - 碲氧化物 。 本发明还涉及由厚膜糊剂组合物和半导体器件形成的电极,特别是包括这种电极的太阳能电池。

    Thick film paste containing lead—tellurium—lithium—titanium—oxide and its use in the manufacture of semiconductor devices
    25.
    发明授权
    Thick film paste containing lead—tellurium—lithium—titanium—oxide and its use in the manufacture of semiconductor devices 有权
    含铅 - 碲 - 锂 - 氧化钛的厚膜糊剂及其在制造半导体器件中的应用

    公开(公告)号:US08696948B2

    公开(公告)日:2014-04-15

    申请号:US13546223

    申请日:2012-07-11

    IPC分类号: H01B1/22 H01L31/0264

    CPC分类号: H01B1/22

    摘要: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a lead-tellurium-lithium-titanium-oxide both dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode.

    摘要翻译: 本发明涉及一种包含Ag和分散在有机介质中的铅 - 碲 - 锂 - 二氧化钛的导电厚膜糊组合物。 本发明还涉及由糊料组合物和半导体器件形成的电极,特别是包括这种电极的太阳能电池。

    ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM
    26.
    发明申请
    ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM 审中-公开
    电极厚膜组合物(S),电极(S)及其形成的半导体器件(S)

    公开(公告)号:US20120119165A1

    公开(公告)日:2012-05-17

    申请号:US13357073

    申请日:2012-01-24

    IPC分类号: H01B1/22

    摘要: The present invention is directed to an electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu, Au, Ag, Pd and Pt; and (3) mixtures thereof; (3) glass frit wherein said glass frit is Pb-free; dispersed in (d) an organic medium, and wherein the average diameter of said electroconductive metal particles is in the range of 0.5-10.0 μm. The present invention is further directed to an electrode formed from the composition as detailed above and a semiconductor device(s) (for example, a solar cell) comprising said electrode.

    摘要翻译: 本发明涉及导电厚膜组合物,其包含:(a)选自(1)Al,Cu,Au,Ag,Pd和Pt中的导电金属颗粒; (2)Al,Cu,Au,Ag,Pd和Pt的合金; 和(3)它们的混合物; (3)玻璃料,其中所述玻璃料是无铅的; 分散在(d)有机介质中,并且其中所述导电金属颗粒的平均直径在0.5-10.0μm的范围内。 本发明还涉及由上述组合物形成的电极和包括所述电极的半导体器件(例如,太阳能电池)。

    Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
    27.
    发明授权
    Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom 有权
    导电厚膜组合物,电极和由其形成的半导体器件

    公开(公告)号:US08123985B2

    公开(公告)日:2012-02-28

    申请号:US12834968

    申请日:2010-09-24

    IPC分类号: H01B1/22

    摘要: The present invention is directed to an electroconductive thick film composition comprising: (a) electroconductive metal particles selected from (1) Al, Cu, Au, Ag, Pd and Pt; (2) alloy of Al, Cu, Au, Ag, Pd and Pt; and (3) mixtures thereof; (3) glass frit wherein said glass frit is Pb-free; dispersed in (d) an organic medium, and wherein the average diameter of said electroconductive metal particles is in the range of 0.5-10.0 μm. The present invention is further directed to an electrode formed from the composition as detailed above and a semiconductor device(s) (for example, a solar cell) comprising said electrode.

    摘要翻译: 本发明涉及导电厚膜组合物,其包含:(a)选自(1)Al,Cu,Au,Ag,Pd和Pt中的导电金属颗粒; (2)Al,Cu,Au,Ag,Pd和Pt的合金; 和(3)它们的混合物; (3)玻璃料,其中所述玻璃料是无铅的; 分散在(d)有机介质中,并且其中所述导电金属颗粒的平均直径在0.5-10.0μm的范围内。 本发明还涉及由上述组合物形成的电极和包括所述电极的半导体器件(例如,太阳能电池)。

    Thick film conductor case compositions for LTCC tape
    29.
    发明授权
    Thick film conductor case compositions for LTCC tape 失效
    LTCC胶带厚膜导体盒组合物

    公开(公告)号:US07731812B2

    公开(公告)日:2010-06-08

    申请号:US11873866

    申请日:2007-10-17

    摘要: Methods of forming a multilayer circuit comprising: a) forming a patterned array of vias in a plurality of layers of green tape; b) filling the vias in one or more of the green tape layers from (a); c) printing over at least one surface of the green tape layers from step (b) with at least one patterned layer of a thick film composition consisting essentially of: i) electrically conductive powder; ii) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing and any one of the following compounds: Sb2O3, Co3O4, PbO, Fe2O3, SnO2, MnO, CuO and mixtures thereof; and iii) an organic medium,  wherein the total inorganic binder is in the range of 0.6 wt. % to about 2 wt. % of the total composition. d) laminating the printed green tape layers from step (d) to form an assemblage comprising a plurality of unfired interconnected functional layers separated by unfired green tape; and e) cofiring the assemblage from step (d).

    摘要翻译: 形成多层电路的方法包括:a)在多层生胶带中形成图案化的通路阵列; b)在(a)中的一个或多个生胶带层中填充通孔; c)在步骤(b)的生胶带层的至少一个表面上印刷至少一个图案化的厚膜组合物层,所述厚膜组合物主要由以下组成:i)导电粉末; ii)无机粘合剂,其中无机粘合剂选自TiO 2和任何在焙烧过程中可产生TiO 2的化合物,以及以下化合物中的任何一种:Sb 2 O 3,Co 3 O 4,PbO,Fe 2 O 3,SnO 2,MnO,CuO及其混合物; 和iii)有机介质,其中总无机粘合剂的范围为0.6wt。 %至约2wt。 占组合物总数的百分比。 d)从步骤(d)层压印刷的生胶带层以形成包括由未烧绿色带分隔的多个未烧结的互连功能层的组合件; 和e)从步骤(d)共同燃烧组合物。