公开(公告)号：US07026710B2

公开(公告)日：2006-04-11

申请号：US09760517

申请日：2001-01-10

申请人： Anthony L. Coyle ,  George A. Bednarz

发明人： Anthony L. Coyle ,  George A. Bednarz

IPC分类号： H01L23/12

CPC分类号： B81C1/00333 ,  H01L24/45 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16245 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： According to the present invention, a plastic land-grid array package, a plastic ball-grid package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by placing a sheet-like protector on the surface of the components during the molding phase, selectively encapsulating the bonding pads and coupling members of the chip while leaving empty space above the components, removing the protector and attaching a lid over the components. A molding method as well as a molding apparatus are provided compatible with the sensitivity of the micromechanical devices, yet flexible with regard to the technique used to assemble the chip and the substrate. Furthermore, the method disclosed is flexible with regard to the material and the properties of the substrate. The invention is applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In a key embodiment of the invention, the micromechanical components are micromirrors for a digital mirror device.

摘要翻译： 根据本发明，通过成型工艺制造用于微机械部件的塑料格栅阵列封装，塑料球栅格封装和塑料引线封装，其特征在于将片状保护器放置在元件表面上 模制阶段，在组件上方留下空白空间的同时选择性地封装焊盘和连接件，同时移除保护器并将盖子连接在部件上。 提供了与微机械装置的灵敏度兼容的成型方法以及模制装置，但是对于用于组装芯片和基板的技术而言，它是灵活的。 此外，所公开的方法对于基材的材料和性质是柔性的。 本发明可应用于各种不同的半导体微机械装置，例如致动器，马达，传感器，空间光调制器和可变形反射镜装置。 在本发明的关键实施例中，微机械组件是用于数字镜装置的微镜。

公开(公告)号：US06858910B2

公开(公告)日：2005-02-22

申请号：US10271815

申请日：2002-10-16

申请人： Anthony L. Coyle ,  George A. Bednarz

发明人： Anthony L. Coyle ,  George A. Bednarz

IPC分类号： B29C45/14 ,  B81B7/00 ,  H01L21/56 ,  H01L23/31 ,  H01L29/82

CPC分类号： B81C1/00333 ,  B29C45/14655 ,  B29C2045/14663 ,  B81C2203/0154 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/05599 ,  H01L2924/01004 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012

摘要： A plastic land-grid array package, a ball-grid array package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by lining the cavity surfaces of the top and bottom mold halves with a protective plastic film, which also protects the surfaces of the components during the molding phase, selectively encapsulating the bonding pads and coupling members of the chip while leaving empty space above the components, and attaching a lid over the components. A molding method as well as a molding apparatus are provided compatible with the sensitivity of the micromechanical devices, yet flexible with regard to the technique used to assemble the chip and the substrate. Furthermore, the method disclosed is flexible with regard to the material and the properties of the substrate.It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.

摘要翻译： 用于微机械部件的塑料格栅阵列封装，球栅阵列封装和塑料引线封装通过模制工艺制造，其特征在于用保护性塑料膜对顶部和底部半模的空腔表面进行衬里，其也是 在模制阶段期间保护部件的表面，选择性地封装芯片的焊盘和耦合部件，同时在部件之上留下空的空间，以及在组件上安装盖子。 提供了与微机械装置的灵敏度兼容的成型方法以及模制装置，但是对于用于组装芯片和基板的技术而言，它是灵活的。 此外，所公开的方法对于基材的材料和性质是柔性的。本发明的一个方面可应用于各种不同的半导体微机械装置，例如致动器，马达，传感器，空间光调制器 ，和可变形反射镜装置。 在所有应用中，本发明实现了技术优点以及显着的成本降低和产量增加。

公开(公告)号：US06541832B2

公开(公告)日：2003-04-01

申请号：US09766197

申请日：2001-01-19

申请人： Anthony L. Coyle

发明人： Anthony L. Coyle

IPC分类号： H01L2978

CPC分类号： B81B7/0077 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/01029

摘要： Low-cost plastic cavity-up land-grid array packages and ball-grid array packages are provided, suitable for wire-bonded chips having micromechanical components. The packages feature a thermal heat spreader and a protective lid. The package structure disclosed is flexible with regard to materials and geometrical detail, and provides solutions to specific functions such as storage space for chemical compounds within the enclosed cavity of the package.