Electronic devices having circuitry in housing attachment structures

    公开(公告)号:US11050452B2

    公开(公告)日:2021-06-29

    申请号:US16589643

    申请日:2019-10-01

    Applicant: Apple Inc.

    Abstract: An electronic device housing may be formed from housing members. A first housing member may form a display cover layer that overlaps pixels. During operation, the pixels may display an image that is viewable through the display cover layer. The second housing member may have a rear wall portion and a sidewall. A band may be coupled to the sidewall or other portion of the second housing member. The first and second housing members may be attached together using a housing member attachment structure. The housing member attachment structure may have layers of adhesive and printed circuit structures. The printed circuit structures may include metal traces that form an antenna and that form capacitive force sensor electrodes on opposing sides of a compressible member.

    Packaged devices with antennas
    29.
    发明授权

    公开(公告)号:US10411329B2

    公开(公告)日:2019-09-10

    申请号:US15002236

    申请日:2016-01-20

    Applicant: Apple Inc.

    Abstract: A packaged device may include electrical components such as integrated circuits that are mounted to a substrate such as a printed circuit substrate. Plastic may be molded to the printed circuit substrate over the integrated circuits. The molded plastic may include one or more shots of plastic and may include laser-sensitizable plastic material. Antenna structures may be supported by molded plastic such as molded plastic in a packaged device. The antenna structures may be formed from metal foil, flexible printed circuit substrate material with metal antenna traces, and metal traces that are formed on exposed surfaces of the plastic. The metal traces may be electroplated metal traces that are formed on regions of a laser-sensitizable plastic material that have been exposed to laser light. A package may have a protrusion that supports an antenna structure.

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