DEFORMABLE SEAL FOR AN ELECTRONIC DEVICE
    21.
    发明申请
    DEFORMABLE SEAL FOR AN ELECTRONIC DEVICE 有权
    电子设备的可变密封

    公开(公告)号:US20170063420A1

    公开(公告)日:2017-03-02

    申请号:US14842728

    申请日:2015-09-01

    Applicant: Apple Inc.

    CPC classification number: H04B1/3888 G06F1/16 H04M1/026 H04M1/0266 H04M1/18

    Abstract: An electronic device that includes a deformable feature designed to seal two or more parts of the electronic device is disclosed. The deformable feature may be designed to deform, in response to a force applied to the deformable feature, with little or no compression. The deformable feature may include a cavity or relief volume extending along the deformable feature to define a space or void in the deformable feature. In response to a force, the deformable feature may deform such that a material (or materials) defining the deformable feature occupies or extends into the space or void, or in a location previously occupied by the space or void. The deformable feature may provide a protective seal between two or more parts that prevents ingress of contaminants, such as a liquid.

    Abstract translation: 公开了一种包括设计成密封电子设备的两个或多个部分的可变形特征的电子设备。 可变形特征可以被设计成响应于施加到可变形特征的力而变形,几乎没有或没有压缩。 可变形特征可以包括沿着可变形特征延伸的空腔或释放空间,以限定可变形特征中的空间或空隙。 响应于力,可变形特征可以变形,使得限定可变形特征的材料(或材料)占据或延伸到空间或空隙中,或在先前由空间或空隙占据的位置。 可变形特征可以在两个或更多个部件之间提供防止密封,防止诸如液体的污染物进入。

    ANTENNA RELATED FEATURES OF A MOBILE PHONE OR COMPUTING DEVICE
    23.
    发明申请
    ANTENNA RELATED FEATURES OF A MOBILE PHONE OR COMPUTING DEVICE 有权
    移动电话或计算设备的天线相关功能

    公开(公告)号:US20150061941A1

    公开(公告)日:2015-03-05

    申请号:US14253779

    申请日:2014-04-15

    Applicant: Apple Inc.

    CPC classification number: H01Q1/38 H01Q1/2258 H01Q1/2291 H01Q1/243 H01Q9/14

    Abstract: Antenna related features of a mobile phone or computing device are disclosed. In one embodiment, wireless control and signal are fed separately through difference types of flexes to optimize performance and cost. In one embodiment, active switching and processing of differing conductive trace lengths are performed on an antenna flex so that antenna performance can be optimized for multiple wireless technologies covering a wide range of wavelengths. In one embodiment, a cantilever arm affixed to a ground screw can provide double grounding in a region with no available screw points due to high z constraint. In one embodiment, a device can provide double feed for antenna through a single screw. In one embodiment, a short pin can be configured to support thinner metal. In one embodiment, a “vibrator bracket/LDS short pin” structure can be used to share a common screw point.

    Abstract translation: 公开了一种移动电话或计算设备的天线相关特征。 在一个实施例中,无线控制和信号通过不同类型的挠曲单独馈送以优化性能和成本。 在一个实施例中,在天线弯曲上执行不同导电迹线长度的有源切换和处理,使得能够针对覆盖宽范围波长的多种无线技术优化天线性能。 在一个实施例中,固定在接地螺钉上的悬臂可以由于高z约束而在没有可用螺钉点的区域中提供双重接地。 在一个实施例中,设备可以通过单个螺钉提供用于天线的双馈。 在一个实施例中,短销可以被配置为支撑更薄的金属。 在一个实施例中,可以使用“振动器支架/ LDS短针”结构来共享共同的螺钉点。

    METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE
    24.
    发明申请
    METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE 有权
    从水分屏蔽电子元件的方法

    公开(公告)号:US20150060110A1

    公开(公告)日:2015-03-05

    申请号:US14230639

    申请日:2014-03-31

    Applicant: Apple Inc.

    Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

    Abstract translation: 公开了将疏水涂层施加到计算装置内的各种部件的方法。 更具体地,疏水涂层可以通过等离子体辅助化学气相沉积(PACVD)方法施加到完全组装的电路板上。 通常,完全组装的电路板可以具有各种部件,例如覆盖水敏电子器件的电磁干扰(EMI)屏蔽。 公开了一种用于穿透覆盖水敏电子器件的EMI屏蔽部分的穿孔方法。 还公开了板对板连接器的密封方法。 在一个实施例中,板对板连接器的焊接引线可以被硅树脂密封覆盖。

Patent Agency Ranking