公开(公告)号：US20230076050A1

公开(公告)日：2023-03-09

申请号：US18049825

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20220376204A1

公开(公告)日：2022-11-24

申请号：US17754233

申请日：2020-09-14

Applicant: Applied Materials, Inc.

Inventor： Yu Hsin LIN ,  Si Kyoung KIM ,  Jungmin LEE ,  Dieter HAAS

IPC: H01L51/52 ,  H01L51/56

Abstract: Methods and apparatus for forming organic light emitting diode (OLED) structures disposed on a substrate are provided. In one embodiment, a method for forming an organic light emitting diode (OLED) substrate is provided that includes forming a first conductive layer on a substrate in a first direction, forming a dielectric layer on a portion of the first conductive layer, wherein the dielectric layer includes a well having a portion of the first conductive layer exposed, depositing an organic material into the well and on the dielectric layer continuously in the second direction and between the two bus bars, and forming a second conductive layer on the organic material continuously in a second direction orthogonal to the first direction and between two bus bars, wherein the second conductive layer is in direct contact with the bus bars on opposing sides thereof; and depositing an encapsulating layer on the second conductive layer continuously in the second direction and fully cover the second conductive layer.

公开(公告)号：US20210269912A1

公开(公告)日：2021-09-02

申请号：US17207363

申请日：2021-03-19

Applicant: Applied Materials, Inc.

Inventor： Stefan BANGERT ,  Uwe SCHÜßLER ,  Jose Manuel DIEGUEZ-CAMPO ,  Dieter HAAS

IPC: C23C14/50 ,  C23C14/24 ,  C23C14/04 ,  C23C14/12 ,  C23C14/56

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

公开(公告)号：US20210214834A1

公开(公告)日：2021-07-15

申请号：US15733833

申请日：2018-06-26

Applicant: Applied Materials, Inc.

Inventor： Xi HUANG ,  Byung-Sung KWAK ,  Christopher Dennis BENCHER ,  Dieter HAAS ,  Brian E. LASSITER

IPC: C23C14/04 ,  C23C14/12 ,  C23C14/24 ,  C25D1/10

Abstract: Embodiments of the disclosure provide methods and apparatus for a shadow mask. In one embodiment, a shadow mask is provided and includes a frame made of a metallic material, and one or more mask patterns coupled to the frame, the one or more mask patterns comprising a metal having a coefficient of thermal expansion less than or equal to about 14 microns/meter/degrees Celsius and having a plurality of openings formed therein, the metal having a thickness of about 5 microns to about 50 microns and having borders formed therein each defining a fine opening having a recessed surface formed on a substrate contact surface thereof, wherein each of the one or more mask patterns have a flatness of less than about 150 microns across a surface area of about 70,000 square millimeters.

公开(公告)号：US20170346044A1

公开(公告)日：2017-11-30

申请号：US15399419

申请日：2017-01-05

Applicant: Applied Materials, Inc.

Inventor： Stefan BANGERT ,  Uwe SCHÜßLER ,  Jose Manuel DIEGUEZ-CAMPO ,  Dieter HAAS

IPC: H01L51/56 ,  C23C14/56 ,  C23C14/50 ,  C23C14/24 ,  C23C14/12 ,  H01L51/00 ,  C23C14/04

CPC classification number: C23C14/50 ,  C23C14/042 ,  C23C14/12 ,  C23C14/24 ,  C23C14/243 ,  C23C14/568

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

公开(公告)号：US20170022601A1

公开(公告)日：2017-01-26

申请号：US15039397

申请日：2014-08-19

Applicant: Jose Manuel DIEGUEZ-CAMPO ,  Stefan BANGERT ,  Uwe SCHÜßLER ,  Dieter HAAS ,  Applied Materials, Inc.

Inventor： Jose Manuel DIEGUEZ-CAMPO ,  Stefan BANGERT ,  Uwe SCHÜßLER ,  Dieter HAAS

IPC: C23C14/24 ,  C23C14/12 ,  H01L51/56 ,  C23C14/04

CPC classification number: C23C14/243 ,  C23C14/042 ,  C23C14/12 ,  C23C14/246 ,  C23C14/50 ,  C23C14/56 ,  C23C14/562 ,  C23C14/564 ,  C23C14/566 ,  H01L51/001 ,  H01L51/0011 ,  H01L51/56

Abstract: A processing apparatus for processing devices, particularly devices including organic materials therein, is described. The processing apparatus includes a processing vacuum chamber; at least one evaporation source for organic material, wherein the at least one evaporation source includes at least one evaporation crucible, wherein the at least one evaporation crucible is configured to evaporate the organic material, and at least one distribution pipe with one or more outlets, wherein the at least one distribution pipe is in fluid communication with the at least one evaporation crucible; and a maintenance vacuum chamber connected with the processing vacuum chamber, wherein the at least one evaporation source can be transferred from the processing vacuum chamber to the maintenance vacuum chamber and from the maintenance vacuum chamber to the processing vacuum chamber.

Abstract translation: 描述了用于处理装置的处理装置，特别是包括其中的有机材料的装置。 处理装置包括处理真空室; 用于有机材料的至少一个蒸发源，其中所述至少一个蒸发源包括至少一个蒸发坩埚，其中所述至少一个蒸发坩埚被配置为蒸发所述有机材料，以及至少一个具有一个或多个出口的分配管， 其中所述至少一个分配管与所述至少一个蒸发坩埚流体连通; 以及与所述处理真空室连接的维护真空室，其中所述至少一个蒸发源可以从所述处理真空室转移到所述维护真空室，并且从所述维护真空室转移到所述处理真空室。

公开(公告)号：US20160268109A1

公开(公告)日：2016-09-15

申请号：US15033868

申请日：2013-11-05

Applicant: Applied Materials Inc.

Inventor： Stefan KELLER ,  Uwe SCHÜßLER ,  Dieter HAAS ,  Stefan BANGERT

IPC: H01J37/34 ,  H01J37/32 ,  C23C14/35

Abstract: A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.

Abstract translation: 描述了用于在真空室中溅射沉积的溅射沉积源。 源包括真空室的壁部分; 在溅射沉积期间提供要沉积的材料的靶; 用于向目标提供RF功率的RF电源; 用于将目标与RF电源连接的电源连接器; 以及导体杆，其通过所述壁部从所述真空室的内部延伸到所述真空室的外部，其中所述导体杆连接到所述真空室内部的一个或多个部件，并且其中所述导体杆连接到所述RF电源 在真空室外部，以产生通过导体棒的限定的RF返回路径。

公开(公告)号：US20250107353A1

公开(公告)日：2025-03-27

申请号：US18977548

申请日：2024-12-11

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

公开(公告)号：US20240147825A1

公开(公告)日：2024-05-02

申请号：US17974385

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Yu-Hsin LIN ,  Ji Young CHOUNG ,  Jungmin LEE ,  Wen-Hao WU ,  Dieter HAAS

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L27/3246 ,  H01L51/5253 ,  H01L2227/323 ,  H01L2251/5315

Abstract: Examples disclosed herein relate to device. The device includes a substrate, a plurality of adjacent pixel-defining layer (PDL structures disposed over the substrate, and a plurality of sub-pixels. The PDL structure have a top surface coupled to adjacent sidewalls of the PDL structure. The plurality of sub-pixels are defined by the PDL structures. Each sub-pixel includes an anode, an organic light emitting diode (OLED), a cathode, and an encapsulation layer. The organic light emitting diode (OLED) material disposed over the anode. The OLED material extends over the top surface of the PDL structure past the adjacent sidewalls. The cathode is disposed over the OLED material. The cathode extends over the top surface of the PDL structure past the adjacent sidewalls. The encapsulation layer is disposed over the cathode. The encapsulation layer has a first sidewall and a second sidewall.

公开(公告)号：US20240040831A1

公开(公告)日：2024-02-01

申请号：US18363574

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Jungmin LEE ,  Yu-hsin LIN ,  Ji Young CHOUNG ,  Wen-Hao WU ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/121 ,  H10K59/65 ,  H10K59/12

CPC classification number: H10K59/121 ,  H10K59/65 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein, include the sub-pixel circuits and at least one sensor opening adjacent to the overhang structure and an adjacent sub-pixel circuit. The at least one sensor opening includes a sensor disposed thereunder. Other configurations displays described herein, include sub-pixel circuits including OLED sub-pixels and a transparent sub-pixel such that a sensor is disposed thereunder. The configurations described herein utilize sensors that are integrated to increase the transmittance of the display while eliminating the need for bezels and reducing dead zones in the display.