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    OLED PANEL WITH ADVANCED SUB-PIXEL OVERHANGS
    4.
    发明公开
    OLED PANEL WITH ADVANCED SUB-PIXEL OVERHANGS 审中-公开

    公开(公告)号：US20230263014A1

    公开(公告)日：2023-08-17

    申请号：US18183822

    申请日：2023-03-14

    Applicant: Applied Materials, Inc.

    Inventor： Yu-hsin LIN ,  Ji Young CHOUNG ,  Chung-chia CHEN ,  Jungmin LEE ,  Wen-Hao WU ,  Takashi ANJIKI ,  Takuji KATO ,  Dieter HAAS ,  Si Kyoung KIM ,  Stefan KELLER

    IPC: H10K59/122 ,  H10K59/173

    CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K71/16

    Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.

    EVAPORATOR, DEPOSITION ARRANGEMENT, DEPOSITION APPARATUS AND METHODS OF OPERATION THEREOF
    5.
    发明申请
    EVAPORATOR, DEPOSITION ARRANGEMENT, DEPOSITION APPARATUS AND METHODS OF OPERATION THEREOF 审中-公开

    公开(公告)号：US20190071772A1

    公开(公告)日：2019-03-07

    申请号：US16180800

    申请日：2018-11-05

    Applicant: Applied Materials, Inc.

    Inventor： Stefan KELLER ,  Uwe SCHÜSSLER ,  Jose Manuel DIEGUEZ-CAMPO ,  Stefan BANGERT ,  Byung-Sung KWAK

    IPC: C23C16/448 ,  C23C16/52 ,  C23C16/455 ,  C23C14/24 ,  C23C16/06

    Abstract: A depositing arrangement for evaporation of a material is disclosed herein. The depositing arrangement has an alkali metal or alkaline earth metal for deposition of the material on a substrate. The deposition arrangement has a first chamber configured for liquefying the material; a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve. The deposition arrangement has an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; a heating unit to heat the material to higher temperatures before providing the liquid material in the evaporation zone; and one or more outlets for directing the vaporized material towards the substrate.

    SPUTTER DEPOSITION SOURCE, APPARATUS FOR SPUTTER DEPOSITION AND METHOD OF ASSEMBLING THEREOF
    6.
    发明申请
    SPUTTER DEPOSITION SOURCE, APPARATUS FOR SPUTTER DEPOSITION AND METHOD OF ASSEMBLING THEREOF 审中-公开
    溅射沉积源，溅射沉积装置及其组装方法

    公开(公告)号：US20160268109A1

    公开(公告)日：2016-09-15

    申请号：US15033868

    申请日：2013-11-05

    Applicant: Applied Materials Inc.

    Inventor： Stefan KELLER ,  Uwe SCHÜßLER ,  Dieter HAAS ,  Stefan BANGERT

    IPC: H01J37/34 ,  H01J37/32 ,  C23C14/35

    Abstract: A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.

    Abstract translation: 描述了用于在真空室中溅射沉积的溅射沉积源。 源包括真空室的壁部分; 在溅射沉积期间提供要沉积的材料的靶; 用于向目标提供RF功率的RF电源; 用于将目标与RF电源连接的电源连接器; 以及导体杆，其通过所述壁部从所述真空室的内部延伸到所述真空室的外部，其中所述导体杆连接到所述真空室内部的一个或多个部件，并且其中所述导体杆连接到所述RF电源 在真空室外部，以产生通过导体棒的限定的RF返回路径。

    SUBSTRATE CARRIER FOR A REDUCED TRANSMISSION OF THERMAL ENERGY
    7.
    发明申请
    SUBSTRATE CARRIER FOR A REDUCED TRANSMISSION OF THERMAL ENERGY 审中-公开
    用于减少热能传输的基板载体

    公开(公告)号：US20160276142A1

    公开(公告)日：2016-09-22

    申请号：US15031138

    申请日：2013-11-25

    Applicant: Applied Materials, Inc.

    Inventor： Andreas Ewald LOPP ,  Stefan KELLER ,  Uwe SCHÜßLER ,  Stefan BANGERT ,  Thomas GEBELE ,  Norbert SPATZ

    IPC: H01J37/32 ,  C23C16/458 ,  C23C14/50 ,  H01L21/673

    CPC classification number: H01J37/32724 ,  C23C14/50 ,  C23C16/4581 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01L21/67316 ,  H01L21/67346 ,  H01L31/1876 ,  H01L31/1896

    Abstract: According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

    Abstract translation: 根据本公开，提供了半导体衬底处理系统和衬底载体。 用于保持待处理的基板和用于在输送装置中或通过处理区域传送基板的基板载体包括用于保持基板的主要部分; 适于由所述运送装置支撑的第一端部; 以及将主要部分与第一端部连接起来的至少一个第一中间部分。 所述至少一个第一中间部分包括一个或多个切口，其适于减小主体部分和第一端部部分之间的热能传递。

    MATERIAL DEPOSITION ARRANGEMENT, VACUUM DEPOSITION SYSTEM AND METHOD THEREFOR
    10.
    发明申请
    MATERIAL DEPOSITION ARRANGEMENT, VACUUM DEPOSITION SYSTEM AND METHOD THEREFOR 审中-公开

    公开(公告)号：US20190338412A1

    公开(公告)日：2019-11-07

    申请号：US15544891

    申请日：2017-01-31

    Applicant: Applied Materials, Inc.

    Inventor： Srinivas SALUGU ,  Stefan BANGERT ,  Stefan KELLER

    IPC: C23C14/54 ,  C23C14/24

    Abstract: A material deposition arrangement for depositing a material on a substrate in a vacuum deposition chamber is described. The material deposition arrangement comprises at least one material deposition source having a crucible configured to evaporate the material, a distribution assembly connected to the crucible, wherein the distribution assembly is configured for providing the evaporated material to the substrate, and a valve configured to control a flow of the evaporated material from the crucible to the distribution assembly.

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