公开(公告)号：US20220026817A1

公开(公告)日：2022-01-27

申请号：US17379707

申请日：2021-07-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

IPC: G03F7/20 ,  G06N20/00

Abstract: A method for training a machine learning model to predict metrology measurements of a current substrate being processed at a manufacturing system is provided. Training data for the machine learning model is generated. A first training input including historical spectral data and/or historical non-spectral data associated with a surface of a prior substrate previously processed at the manufacturing system is generated. A first target output for the first training input is generated. The first target output includes historical metrology measurements associated with the prior substrate previously processed at the manufacturing system. Data is provided to train the machine learning model on (i) a set of training inputs including the first training input, and (ii) a set of target outputs including a first target output.

公开(公告)号：US12216455B2

公开(公告)日：2025-02-04

申请号：US17584318

申请日：2022-01-25

Applicant: Applied Materials, Inc.

Inventor： Chunlei Zhang ,  Zhaozhao Zhu ,  Michael Kutney

IPC: G05B19/418 ,  H01L21/66 ,  H01L21/67

Abstract: A substrate processing system includes a process chamber, one or more robot, a substrate measurement system, and a computing device. The process chamber may process a substrate that will comprise a film and/or feature after the processing. The one or more robot, to move the substrate from the process chamber to a substrate measurement system. The substrate measurement system may measure the film and/or feature on the substrate and generate a profile map of the film and/or feature. The computing device may process data from the profile map using a first trained machine learning model, wherein the first trained machine learning model outputs a first chamber component condition estimation for a first chamber component of the process chamber. The computing device may then determine whether to perform maintenance on the first chamber component of the process chamber based at least in part on the first chamber component condition estimation.

公开(公告)号：US12191176B2

公开(公告)日：2025-01-07

申请号：US18335899

申请日：2023-06-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

IPC: H01L21/67 ,  H01L21/66

Abstract: A process recipe associated with a substrate at a manufacturing system is identified. A first set of measurements for the substrate is obtained from a substrate measurement subsystem. A second set of measurements for the substrate is obtained from one or more sensors of a chamber of the manufacturing system. A determination is made based on the obtained first set of measurements and the obtained second set of measurements of whether to modify the process recipe by at least one of modifying an operation of the process recipe or generating an instruction to prevent completion of execution of one or more operations of the process recipe.

公开(公告)号：US20230258500A1

公开(公告)日：2023-08-17

申请号：US18138914

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Blake Erickson ,  Keith Berding ,  Michael Kutney ,  Zhaozhao Zhu ,  Tsung Feng Wu ,  Michael D. Willwerth ,  Jeffrey Ludwig

IPC: G01J3/32 ,  G01J3/02 ,  G01N21/25 ,  G01N21/68 ,  G01N21/95

CPC classification number: G01J3/32 ,  G01J3/0291 ,  G01N21/255 ,  G01N21/68 ,  G01N21/9501

Abstract: An apparatus includes a base component and a plurality of collimators housed within the base component. Each collimator of the plurality of collimators corresponds to a respective location of a plurality of locations of a wafer in an etch chamber. The plurality of locations includes a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.

公开(公告)号：US11719952B2

公开(公告)日：2023-08-08

申请号：US16947639

申请日：2020-08-11

Applicant: Applied Materials, Inc.

Inventor： Pengyu Han ,  John Anthony O'Malley ,  Michael N. Grimbergen ,  Lei Lian ,  Upendra Ummethala ,  Michael Kutney

IPC: G02B27/30 ,  G02B9/12 ,  G02B27/00

CPC classification number: G02B27/30 ,  G02B9/12 ,  G02B27/005

Abstract: Implementations disclosed describe a collimator assembly having a collimator housing that includes an interface configured to optically couple to a process chamber that has a target surface, and a port to receive an optical fiber to deliver, to an enclosure formed by the collimator housing, a first (second) plurality of spectral components of light belonging to a first (second) range of wavelengths, and an achromatic lens located, at least partially, within the enclosure formed by the collimator housing, the achromatic lens to direct the first (second) plurality of spectral components of light onto the target surface to illuminate a first (second) region on the target surface, wherein the second region is substantially the same as the first region.

公开(公告)号：US11668602B2

公开(公告)日：2023-06-06

申请号：US17234940

申请日：2021-04-20

Applicant: Applied Materials, Inc.

Inventor： Blake Erickson ,  Keith Berding ,  Michael Kutney ,  Zhaozhao Zhu ,  Tsung Feng Wu ,  Michael D. Willwerth ,  Jeffrey Ludwig

IPC: G01J3/32 ,  G01J3/02 ,  G01N21/25 ,  G01N21/68 ,  G01N21/95

CPC classification number: G01J3/32 ,  G01J3/0291 ,  G01N21/255 ,  G01N21/68 ,  G01N21/9501

Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.

公开(公告)号：USD977504S1

公开(公告)日：2023-02-07

申请号：US29743600

申请日：2020-07-22

Applicant: APPLIED MATERIALS, INC.

Designer： Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

公开(公告)号：US20220349833A1

公开(公告)日：2022-11-03

申请号：US17242569

申请日：2021-04-28

Applicant: Applied Materials, Inc.

Inventor： Blake Erickson ,  Keith Berding ,  Michael Kutney ,  Soumendra Barman ,  Zhaozhao Zhu ,  Michelle SanPedro ,  Suresh Polali Narayana Rao

IPC: G01N21/95 ,  G01N21/21 ,  G01B11/06

Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.

公开(公告)号：US20220028716A1

公开(公告)日：2022-01-27

申请号：US17379677

申请日：2021-07-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

IPC: H01L21/67 ,  G01N21/25 ,  G01N21/95 ,  G01B11/00

Abstract: A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.

公开(公告)号：US11150120B2

公开(公告)日：2021-10-19

申请号：US16578371

申请日：2019-09-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael Kutney ,  Ashley M. Okada

IPC: G01F1/684 ,  G01F1/74 ,  G01F15/02 ,  G01F1/698

Abstract: Methods and apparatus for a flow ratio controller are provided herein. In some embodiments, a flow ratio controller includes an inlet; a plurality of channels extending from the inlet to a corresponding plurality of outlets; a bypass pipe extending from each channel of the plurality of channels that diverts a small portion of a flow from that channel and then returns the small portion of the flow back to that channel; and a thermal mass flow meter coupled to the bypass pipe having a first temperature sensor, a second temperature sensor, and a heating element disposed therebetween. A controller is configured to determine a flow rate through each of the plurality of channels based on a measured temperature difference between the first temperature sensor and the second temperature sensor.