FEEDFORWARD CONTROL OF MULTI-LAYER STACKS DURING DEVICE FABRICATION

    公开(公告)号:US20220165593A1

    公开(公告)日:2022-05-26

    申请号:US17103847

    申请日:2020-11-24

    IPC分类号: H01L21/67 H01L27/108 G06N3/08

    摘要: A method of forming a multi-layer stack on a substrate comprises: processing a substrate in a first process chamber using a first deposition process to deposit a first layer of a multi-layer stack on the substrate; removing the substrate from the first process chamber; measuring a first thickness of the first layer using an optical sensor; determining, based on the first thickness of the first layer, a target second thickness for a second layer of the multi-layer stack; determining one or more process parameter values for a second deposition process that will achieve the second target thickness for the second layer; and processing the substrate in a second process chamber using the second deposition process with the one or more process parameter values to deposit the second layer of the multi-layer stack approximately having the target second thickness over the first layer.

    ETCH FEEDBACK FOR CONTROL OF UPSTREAM PROCESS

    公开(公告)号:US20220165541A1

    公开(公告)日:2022-05-26

    申请号:US17103845

    申请日:2020-11-24

    IPC分类号: H01J37/32 H01L21/66

    摘要: A substrate processing system comprises an etch chamber configured to perform an etch process on a substrate, the etch chamber comprising an optical sensor to generate one or more optical measurements of a film on the substrate during and/or after the etch process. The system further comprises a computing device operatively connected to the etch chamber, wherein the computing device is to: receive the one or more optical measurements of the film; determine, for each optical measurement of the one or more optical measurements, a film thickness of the film; determine an etch rate of the film based on the one or more optical measurements using the determined film thickness of each optical measurement of the one or more optical measurements; and determine a process parameter value of at least one process parameter for a previously performed process that was performed on the substrate based on the etch rate.

    Endpoint detection system for enhanced spectral data collection

    公开(公告)号:US11965798B2

    公开(公告)日:2024-04-23

    申请号:US17344791

    申请日:2021-06-10

    发明人: Pengyu Han Lei Lian

    摘要: An endpoint detection system for enhanced spectral data collection is provided. An optical bundle is coupled to a light source configured to generate incident light. The optical bundle includes two or more sets of optical fibers that each include an emitting optical fiber and a receiving optical fiber. The receiving optical fibers are disposed within the optical bundle at a pairing angle relative to a respective emitting optical fiber. The optical bundle is also coupled to a collimator assembly that includes an achromatic lens. The achromatic lens receives a first light beam of incident light from a first emitting optical fiber and directs spectral components of the first light beam to a first and second portion of a surface of a substrate. The first portion of the substrate surface is substantially the same as the second portion. The achromatic lens collects reflected spectral components that are produced by the spectral components directed to the first and second portions of the substrate surface. The achromatic lens transmits the reflected spectral components to a first receiving fiber of the optical fiber bundle, which transmits the reflected spectral components to a light detection component. A processing device coupled to the light detection component determines a reflectance of the substrate surface based on the reflected spectral components.

    ENDPOINT DETECTION SYSTEM FOR ENHANCED SPECTRAL DATA COLLECTION

    公开(公告)号:US20220397482A1

    公开(公告)日:2022-12-15

    申请号:US17344791

    申请日:2021-06-10

    发明人: Pengyu Han Lei Lian

    摘要: An endpoint detection system for enhanced spectral data collection is provided. An optical bundle is coupled to a light source configured to generate incident light. The optical bundle includes two or more sets of optical fibers that each include an emitting optical fiber and a receiving optical fiber. The receiving optical fibers are disposed within the optical bundle at a pairing angle relative to a respective emitting optical fiber. The optical bundle is also coupled to a collimator assembly that includes an achromatic lens. The achromatic lens receives a first light beam of incident light from a first emitting optical fiber and directs spectral components of the first light beam to a first and second portion of a surface of a substrate. The first portion of the substrate surface is substantially the same as the second portion. The achromatic lens collects reflected spectral components that are produced by the spectral components directed to the first and second portions of the substrate surface. The achromatic lens transmits the reflected spectral components to a first receiving fiber of the optical fiber bundle, which transmits the reflected spectral components to a light detection component. A processing device coupled to the light detection component determines a reflectance of the substrate surface based on the reflected spectral components.

    Eliminating internal reflections in an interferometric endpoint detection system

    公开(公告)号:US11421977B2

    公开(公告)日:2022-08-23

    申请号:US16165544

    申请日:2018-10-19

    发明人: Lei Lian Pengyu Han

    摘要: A method is disclosed for operating an endpoint detection system of a processing chamber having a ceiling formed therein, a substrate support located internal to the processing chamber, and a substrate resting on the substrate support. A transparent panel is located in the ceiling of the processing chamber, the panel oriented at a first acute angle relative to the substrate and the substrate support. The transparent panel receives an incident light beam from the endpoint detection system at a second acute angle relative to the panel. The transparent panel transmits the incident light beam to the substrate within the processing chamber at an angle perpendicular to the substrate and the substrate support.

    AUTONOMOUS SUBSTRATE PROCESSING SYSTEM
    9.
    发明公开

    公开(公告)号:US20230305531A1

    公开(公告)日:2023-09-28

    申请号:US18325918

    申请日:2023-05-30

    IPC分类号: G05B19/4155 G06N20/00

    摘要: A cool cluster comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device of the tool cluster. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine learning model; after maintenance has been performed on the first process chamber, receive second measurements generated by the sensors during or after a seasoning process is performed within the first process chamber; and determine that the first process chamber is ready to be brought back into service based on processing the second measurements using a second trained machine learning model.