公开(公告)号：US11769684B2

公开(公告)日：2023-09-26

申请号：US18080421

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67 ,  C23C16/458 ,  C23C16/455

CPC classification number: H01L21/6833 ,  C23C16/4585 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/67248 ,  C23C16/45544

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US20230113057A1

公开(公告)日：2023-04-13

申请号：US18080421

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01L21/683 ,  H01L21/67 ,  C23C16/458

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US11434569B2

公开(公告)日：2022-09-06

申请号：US16400054

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Tuan Anh Nguyen ,  Jason M. Schaller ,  Edward P. Hammond, IV ,  David Blahnik ,  Tejas Ulavi ,  Amit Kumar Bansal ,  Sanjeev Baluja ,  Jun Ma ,  Juan Carlos Rocha

IPC: C23C16/505 ,  C23C16/44 ,  C23C16/458

Abstract: Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates an outer volume of the processing volume.

公开(公告)号：US20220106683A1

公开(公告)日：2022-04-07

申请号：US17061015

申请日：2020-10-01

Applicant: Applied Materials, Inc.

Inventor： Sanjeev Baluja ,  Tejas Ulavi ,  Eric J. Hoffmann ,  Ashutosh Agarwal

IPC: C23C16/458 ,  C23C16/455

Abstract: Apparatus and methods for loading and unloading substrates from a spatial processing chamber are described. A support assembly has a rotatable center base and support arms extending therefrom. A support shaft is at the outer end of the support arms and a substrate support is on the support shaft. Primary lift pins are positioned within openings in the substrate support. Secondary lift pins are positioned within openings in the support arms and are aligned with the primary lift pins. An actuation plate within the processing volume causes, upon movement of the support assembly, the primary lift pins to elevate through contact with the secondary lift pins.

公开(公告)号：US11260432B2

公开(公告)日：2022-03-01

申请号：US17024955

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Arkaprava Dan ,  Sanjeev Baluja ,  Wei V. Tang

IPC: B08B7/00

Abstract: Substrate supports, substrate support assemblies and methods of using an arc generated between a first electrode and a second electrode to clean a support surface. The first electrode comprises a plurality of first branches which are interdigitated with a plurality of branches of the second electrode in a finger-joint like pattern creating a gap between the first electrode and the second electrode.

公开(公告)号：US20210111059A1

公开(公告)日：2021-04-15

申请号：US17066974

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01L21/683 ,  C23C16/458 ,  H01L21/67 ,  C23C16/455

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US20210111058A1

公开(公告)日：2021-04-15

申请号：US17066971

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Sanjeev Baluja ,  Dhritiman Subha Kashyap

IPC: H01L21/683 ,  H01L21/67

Abstract: Substrate supports comprising a top plate positioned on a shaft are described. The top plate including a primary heating element a first depth from the surface of the top plate, a inner zone heating element a second depth from the surface of the top plate and an outer zone heating element a third depth from the surface of the top plate. Substrate support assemblies comprising a plurality of substrate supports and methods of processing a substrate are also disclosed.

公开(公告)号：US12087555B2

公开(公告)日：2024-09-10

申请号：US18083301

申请日：2022-12-16

Applicant: Applied Materials, Inc.

Inventor： Kalyanjit Ghosh ,  Shailendra Srivastava ,  Tejas Ulavi ,  Yusheng Zhou ,  Amit Kumar Bansal ,  Sanjeev Baluja

IPC: H01J37/32 ,  B08B7/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  G03F7/42

CPC classification number: H01J37/32495 ,  H01J37/32862 ,  H01L21/67017 ,  B08B7/0021 ,  G03F7/427 ,  H01J37/32834 ,  H01L21/67028 ,  H01L21/6831 ,  H01L21/68742

Abstract: Implementations disclosed herein generally relate to systems and methods of protecting a substrate support in a process chamber from cleaning fluid during a cleaning process. The method of cleaning the process chamber includes positioning in the process chamber a cover substrate above a substrate support and a process kit that separates a purge volume from a process volume. The method of cleaning includes flowing a purge gas in the purge volume to protect the substrate support and flowing a cleaning fluid to a process volume above the cover substrate, flowing the cleaning fluid in the process volume to an outer flow path, and to an exhaust outlet in the chamber body. The purge volume is maintained at a positive pressure with respect to the process volume to block the cleaning fluid from the purge volume.

公开(公告)号：US12018376B2

公开(公告)日：2024-06-25

申请号：US17024946

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Ashutosh Agarwal ,  Tejas Ulavi ,  Sanjeev Baluja

IPC: C23C16/52 ,  C23C16/458 ,  H01L21/67 ,  H01L21/687

CPC classification number: C23C16/52 ,  C23C16/4583 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/68771

Abstract: Process chambers and methods for leveling a motor shaft and substrate support plane are described. The process chamber includes a motor shaft connected to the process chamber with a plurality of motor bolts. A first plurality of sensors is arranged at about the same radial distance from the rotational axis and at different angular positions relative to the rotational axis and a second plurality of sensors are arranged to measure the support plane. An angle-dependent motor leveling profile is determined and shim values for the motor bolts are determined to level the motor shaft. The support plane is measured using the second plurality of sensors to level the support plane perpendicular to the motor shaft.

公开(公告)号：US11682576B2

公开(公告)日：2023-06-20

申请号：US17845230

申请日：2022-06-21

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Sanjeev Baluja ,  Dhritiman Subha Kashyap

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103

Abstract: Substrate supports comprising a top plate positioned on a shaft are described. The top plate including a primary heating element a first depth from the surface of the top plate, a inner zone heating element a second depth from the surface of the top plate and an outer zone heating element a third depth from the surface of the top plate. Substrate support assemblies comprising a plurality of substrate supports and methods of processing a substrate are also disclosed.