Abstract:
A method for the in situ cleaning of a semiconductor deposition chamber utilized for the deposition of a semiconductor material such as titanium or titanium nitride comprising, between wafers, introducing chlorine gas into the chamber at elevated temperature, purging the chamber with an inert gas and evacuating it before introduction of the next wafer. A two-stage between wafer cleaning process is carried out by introducing chlorine into the chamber at elevated temperature, thereafter initiating a plasma without removing the chlorine, purging the chamber with an inert gas and evacuating it before introduction of the next wafer. In a preferred embodiment, a thin protective film of titanium is deposited on the inner surfaces of the chamber prior to utilizing the chamber for the deposition of such material. The protective layer is replenished following each two-stage cleaning.
Abstract:
Tungsten carbide cobalt and tungsten-containing materials are recycled using a single high-temperature oxidation with standard dilution chemistry. The scrap material is ground, oxidized, and subjected to an acid digestion, preferably in hydrochloric acid. This causes the cobalt to form cobalt chloride while the tungsten remains insoluble. The pH is then increased to about 7.0 which causes the cobalt chloride to form cobalt hydroxide which precipitates out of solution. The cobalt and tungsten are separated and dissolved in a high-pH ammonia solution which can then be spray dried to form a precursor powder for subsequent carburization to form tungsten carbide-cobalt powders.
Abstract:
An optical isolator includes a birefringent material and a Faraday rotator. The birefringent material receives a forward light propagating in a forward direction and a backward light propagating opposite to the forward direction. The birefringent material has an optical axis, wherein the forward light has a first polarization aligned perpendicular to the optical axis and is configured to pass the first birefringent material substantially along the forward direction. At least a portion of the backward light has a second polarization not perpendicular to the optical axis. The first birefringent material can displace the backward light to form a first displaced backward light. A Faraday rotator can rotate the forward light, and the backward light or the first displaced backward light by a same predetermined angle along the rotation direction.
Abstract:
One or more features of multiple patterned layers formed on a semiconductor are determined by obtaining a first measured diffraction signal measured from a first patterned layer before a second patterned layer is formed on top of the first patterned layer. One or more features of the first patterned layer are determined using the first measured diffraction signal. Values of one or more profile parameters of a hypothetical profile of the second patterned layer in combination with the first patterned layer are fixed. A second measured diffraction signal measured from the second patterned layer after the second patterned layer has been formed on top of the first patterned layer is obtained. One or more features of the second patterned layer are determined based on the second measured diffraction signal and the fixed values of the one or more profile parameters.
Abstract:
An intra-cavity frequency-doubling laser device includes a first mirror and a second mirror defining a resonance cavity therein, a gain media to produce a first lasing light in response to an excitation energy received from outside of the resonance cavity, a non-linear optical material to generate a second lasing light in response to the first lasing light. The second lasing light and the first lasing light have different frequencies. The first mirror is reflective to the first lasing light and the second lasing light. The second mirror is reflective to the first lasing light and at least partially transmissive to the second lasing light. A birefringent optical material in the resonance cavity can rotate the polarization direction of at least one of the first lasing light and the second lasing light. An optical axis of the birefringent optical material and an optical axis of the non-linear optical material have an angle between 30 and 60 degrees.
Abstract:
Generally, a method and apparatus for processing a substrate. In one embodiment, the method provides a first relative motion between at least a first substrate and a polishing material. A second relative motion is provided between at least a second substrate and the polishing material. The changing in direction of the relative motion extends the interval between conditioning procedures used to return the polishing material to a state that produces uniform polishing results.
Abstract:
Tungsten CMP is conducted with improved alignment mark integrity and reduced edge residue by employing a retaining ring having a mechanical hardness greater than about 85 durometer and a relatively soft polishing pad. Embodiments of the present invention include conducting CMP employing a carrier comprising a retaining ring additionally having a wear rate during CMP of less than about 1 mil per hour and a polishing pad having a hardness less than about 60 durometer. Suitable retaining ring materials include ceramics, quartz, polymers and fiber reinforced polymers.
Abstract:
Method for passivating a layer of titanium that has been deposited on a substrate in a reaction chamber to coat the titanium thereby reducing the likelihood of contamination by byproducts of the deposition process or ambient oxygen or similar reactants. The method includes adding a flow of hydrogen and a flow of nitrogen to the chamber. The flows of hydrogen and nitrogen are approximately 800 sccm and continue for approximately 10-30 seconds respectively. The method may further comprise the step of forming a nitrogen plasma in the chamber for approximately 10 seconds wherein such case the flows of hydrogen and nitrogen continue for approximately 8 seconds respectively. The plasma is formed by applying RF power to an electrode located within said chamber or by a remote plasma source and channeled to said reactor chamber. Alternately, the passivation layer may be formed just by using a nitrogen plama alone for approximately 10-30 seconds at the same RF power level. The plasma in either case may further comprise hydrogen and argon and the layer of titanium has been deposited by CVD.