公开(公告)号：US20060229694A1

公开(公告)日：2006-10-12

申请号：US11392163

申请日：2006-03-29

申请人： Joseph Schulman ,  Charles Byers ,  John Gord ,  Rajiv Shah ,  Lyle Canfield

发明人： Joseph Schulman ,  Charles Byers ,  John Gord ,  Rajiv Shah ,  Lyle Canfield

IPC分类号： A61N1/05

CPC分类号： A61N1/36585 ,  A61B5/0031 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/14865 ,  A61B5/4839 ,  A61B2560/0219 ,  A61M5/1723 ,  A61N1/05 ,  A61N1/372 ,  A61N1/3754 ,  H01L23/3107 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

摘要： An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensor may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.

摘要翻译： 可植入衬底传感器具有形成在衬底的相对侧上的电子电路和电极。 保护涂层覆盖基材，有效地气密地密封涂层下的电子电路。 电极的暴露区域选择性地被保护涂层覆盖，从而当传感器植入生物体组织时允许这样的电极暴露于身体组织和流体。 其上形成有电子电路和电极的基板是与其上形成集成电路（IC）的相同的基板或“芯片”，该集成电路包含所需的电子电路。 这种方法消除了密封的盖或盖以覆盖混合电子电路的需要，并且允许传感器制造得比其他可能的薄得多。 在一个实施例中，两个这样的衬底传感器可以背靠背放置，电极面向外。 根据需要，通过将金属化层和电介质放置在基板表面的空的区域中，形成在传感器的电子电路的一部分的电容器。

公开(公告)号：US20050160187A1

公开(公告)日：2005-07-21

申请号：US10758723

申请日：2004-01-16

申请人： Charles Byers ,  Todd Keaffaber ,  Andrew Scott

发明人： Charles Byers ,  Todd Keaffaber ,  Andrew Scott

IPC分类号： G06F1/18 ,  G06F3/00

CPC分类号： G06F1/181

摘要： An electronic shelf includes a plurality of system circuit boards including a first system circuit board containing a first central processing unit (CPU) providing decision-making intelligence for end-user services supported by the first system circuit board. An auxiliary circuit board is connected to the first circuit board and provides input and output communications between the CPU and devices external to both the first system circuit board and auxiliary circuit board. The CPU is solely responsible for decision-making intelligence for management control for at least a predetermined number of system circuit boards while also being responsible for the decision-making intelligence for end-user services supported by the first system circuit board.

摘要翻译： 电子货架包括多个系统电路板，包括第一系统电路板，第一系统电路板包含第一中央处理单元（CPU），为第一系统电路板支持的最终用户服务提供决策智能。 辅助电路板连接到第一电路板，并且在CPU和与第一系统电路板和辅助电路板之间的外部设备之间提供输入和输出通信。 CPU对至少预定数量的系统电路板的管理控制的决策智能负责，同时还负责第一系统电路板支持的最终用户服务的决策智能。

公开(公告)号：US20050106366A1

公开(公告)日：2005-05-19

申请号：US10969758

申请日：2004-10-20

申请人： Joseph Schulman ,  Joseph Lucisano ,  Rajiv Shah ,  Charles Byers ,  Shaun Pendo

发明人： Joseph Schulman ,  Joseph Lucisano ,  Rajiv Shah ,  Charles Byers ,  Shaun Pendo

IPC分类号： A61L2/00 ,  A61N1/02 ,  B05D3/00 ,  B32B9/00 ,  C23C14/00 ,  C23C14/04 ,  G03F1/00 ,  G03F7/20 ,  H01L21/308 ,  H01L23/29 ,  H05K3/28 ,  B32B15/04 ,  C23C14/32

CPC分类号： G03F7/70641 ,  A61N1/02 ,  A61N1/375 ,  C23C14/042 ,  H01L21/308 ,  H01L23/291 ,  H01L2924/0002 ,  H05K3/284 ,  Y10T29/49144 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/265 ,  H01L2924/00

摘要： A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zerconia, or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.

公开(公告)号：US06671554B2

公开(公告)日：2003-12-30

申请号：US10033720

申请日：2001-12-27

申请人： Scott R. Gibson ,  Rajiv Shah ,  Edward Chernoff ,  Charles Byers

发明人： Scott R. Gibson ,  Rajiv Shah ,  Edward Chernoff ,  Charles Byers

IPC分类号： A61N1375

CPC分类号： A61N1/3752 ,  A61N1/05 ,  Y10S439/909

摘要： An implantable coaxial lead includes a cable with male and female connectors. The cable includes inner and outer helical coils separated by an inner insulator tube, with an outer insulator tube surrounding the outer helical coil. The male connector includes an outer conductive cylinder, a conductive pin and an insulator molded in between. For increased strength, a braided cylinder, infused with rubber, is included at the juncture of the male connector and the cable. The female connector includes a cylinder formed by two conducting body elements and an intervening insulating body element. The female connector includes respective conductive tension elements configured to engage the male connector. A first seal is provided between the conductive tension members for electrical isolation and tactile feedback. An insertion tool includes a cylinder with a hollow bore and detachable head, and a rod for pulling the lead through the cylinder.