公开(公告)号：US12103888B2

公开(公告)日：2024-10-01

申请号：US17040204

申请日：2019-04-02

Applicant: CORNING INCORPORATED

Inventor： Hoon Kim ,  Jin Su Kim

IPC: C03C15/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C23/00

CPC classification number: C03C15/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C23/0005 ,  C03C23/002 ,  C03C23/0025

Abstract: A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.

公开(公告)号：US11752500B2

公开(公告)日：2023-09-12

申请号：US17049676

申请日：2019-04-23

Applicant: CORNING INCORPORATED

Inventor： Ye Fang ,  Jin Su Kim ,  Aize Li

IPC: B01L3/00

CPC classification number: B01L3/502715 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2200/12 ,  B01L2300/12 ,  B01L2300/161 ,  B01L2300/168

Abstract: A method for manufacturing a microfluidic device (100) includes depositing a bonding layer (106) on a surface of a second glass layer (104a) of a glass substrate having a first glass layer (102) and the second glass layer (104a) fused to the first glass layer (102), such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel (112) in the glass substrate; and bonding a cover (108) to the glass substrate with the bonding layer (106).

公开(公告)号：US20230271875A1

公开(公告)日：2023-08-31

申请号：US17924142

申请日：2021-05-05

Applicant: CORNING INCORPORATED

Inventor： Venkatesh Botu ,  Attila Lang de Falussy ,  Jin Su Kim ,  Karl William Koch, III ,  Aize Li ,  James Patrick Trice

IPC: C03C17/02 ,  C03C23/00 ,  C09K13/08 ,  C03C15/00

CPC classification number: C03C17/02 ,  C03C23/007 ,  C09K13/08 ,  C03C15/00

Abstract: A method of forming a glass laminate includes providing a substrate having a core layer and at least one cladding layer; heat treating the substrate at a temperature such that the at least one cladding layer is phase-separated after the heat treating; and etch treating the substrate for at least 10 sec. A phase-separated glass laminate includes a substrate having a core layer and at least one phase-separated cladding layer, such that the glass laminate has a % transmission of at least 96%, and the at least one cladding layer comprises a grain size in a range of 10 nm to 1 μm, or a graded glass index of greater than 5 nm.

公开(公告)号：US20210024407A1

公开(公告)日：2021-01-28

申请号：US17040070

申请日：2019-03-28

Applicant: CORNING INCORPORATED

Inventor： George Halsey Beall ,  Heather Debra Boek ,  Ling Cai ,  Jin Su Kim ,  Dean Michael Thelen ,  Mark Owen Weller

IPC: C03C10/00 ,  B32B17/06 ,  C03B32/02

Abstract: A glass-ceramic that includes: SiO2 from about 35 mol % to about 80 mol %; B2O3 from about 10 mol % to about 50 mol %; P2O5 from about 10 mol % to about 50 mol %; and an optional addition of one or more of CaO, MgO and Bi2O3 from 0 mol % to about 5 mol %, wherein the glass-ceramic further comprises a boron-phosphate crystalline phase.

公开(公告)号：US20210009467A1

公开(公告)日：2021-01-14

申请号：US17040204

申请日：2019-04-02

Applicant: CORNING INCORPORATED

Inventor： Hoon Kim ,  Jin Su Kim

IPC: C03C15/00 ,  C03C3/091 ,  C03C3/093 ,  C03C3/087 ,  C03C3/097

Abstract: A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.

公开(公告)号：US20200018459A1

公开(公告)日：2020-01-16

申请号：US16464450

申请日：2017-11-28

Applicant: CORNING INCORPORATED

Inventor： Paul Bennett Dohn ,  Jin Su Kim

IPC: F21V3/10 ,  C03B17/02 ,  F21V3/06

Abstract: A strengthened glass cover for a light fixture includes a glass core layer, a first glass cladding layer fused to a first surface of the glass core layer, and a second glass cladding layer fused to a second surface of the glass core layer. A coefficient of thermal expansion (CTE) of the glass core layer is greater than a CTE of each of the first glass cladding layer and the second glass cladding layer, whereby the glass core layer is in tension and each of the first glass cladding layer and the second glass cladding layer is in compression. A light fixture includes a housing and the cover coupled to the housing.

公开(公告)号：US12076971B2

公开(公告)日：2024-09-03

申请号：US17041884

申请日：2019-03-27

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Dean Michael Thelen

IPC: B32B7/027 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03C10/00 ,  C03C21/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: B32B7/027 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C4/18 ,  C03C10/0009 ,  C03C10/0054 ,  H05K1/024 ,  H05K1/0306 ,  B32B2307/30 ,  B32B2307/732 ,  B32B2457/00 ,  C03C21/002 ,  C03C2204/00 ,  H05K2201/017 ,  H05K2201/0191 ,  H05K2201/068

Abstract: A laminated glass structure for an electronic device includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad glass layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to about 100 GHz.

公开(公告)号：US20240082841A1

公开(公告)日：2024-03-14

申请号：US17766867

申请日：2020-10-13

Applicant: CORNING INCORPORATED

Inventor： Jonathan Paul Icenhower ,  Jin Su Kim ,  Xinyuan Liu

IPC: B01L3/00

CPC classification number: B01L3/502761 ,  B01L3/502707 ,  B01L2200/0647 ,  B01L2200/12 ,  B01L2200/16 ,  B01L2300/0654 ,  B01L2300/165

Abstract: Glass articles including a glass laminate substrate having a plurality of flow channels formed therein are provided. The glass laminate substrate includes a first glass layer and a second glass layer fused together. In various embodiments, at least 80% of a total area of a floor of each of the flow channels has a local surface flatness of less than 100 nm/mm2, measured along a length and width of the floor of each of the plurality of flow channels Such glass articles are manufactured using a method including contacting a first portion of the first glass layer with a first etchant for a first etch time to at least partially form flow channels in the glass substrate and contacting the flow channels with a second etchant for a second etch time to flatten a floor of each of the flow channels.

公开(公告)号：US20230364606A1

公开(公告)日：2023-11-16

申请号：US18226855

申请日：2023-07-27

Applicant: CORNING INCORPORATED

Inventor： Ye Fang ,  Jin Su Kim ,  Aize Li

IPC: B01L3/00

CPC classification number: B01L3/502715 ,  B01L3/502707 ,  B01L2300/12 ,  B01L2300/161 ,  B01L2300/168 ,  B01L2200/12 ,  B01L2200/027

Abstract: A method for manufacturing a microfluidic device includes depositing a bonding layer on a surface of a second glass layer of a glass substrate having a first glass layer and the second glass layer fused to the first glass layer, such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel in the glass substrate; and bonding a cover to the glass substrate with the bonding layer.

公开(公告)号：US11764117B2

公开(公告)日：2023-09-19

申请号：US17043561

申请日：2019-04-02

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jin Su Kim

IPC: H01L23/053 ,  B32B3/30 ,  B32B17/06 ,  B81B7/00 ,  B81C1/00 ,  C03C15/00 ,  H01L21/52 ,  H01L23/04 ,  H01L23/26 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/48 ,  H01L23/10 ,  H01L23/08

CPC classification number: H01L23/053 ,  B32B3/30 ,  B32B17/06 ,  B81B7/0038 ,  B81B7/0067 ,  B81C1/00317 ,  C03C15/00 ,  H01L21/52 ,  H01L23/041 ,  H01L23/08 ,  H01L23/10 ,  H01L23/26 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/483 ,  B32B2315/08 ,  B32B2457/14 ,  B81C2203/0109 ,  H01L2933/0033

Abstract: Wafer level encapsulated packages includes a wafer, a glass substrate hermetically sealed to the wafer, and an electronic component. The glass substrate includes a glass cladding layer fused to a glass core layer and a cavity formed in the glass substrate. The electronic component is encapsulated within the cavity. In various embodiments, the floor of the cavity is planar and substantially parallel to a plane defined by a top surface of the glass cladding layer. The glass cladding layer has a higher etch rate in an etchant than the glass core layer. In various embodiments, the wafer level encapsulated package is substantially optically transparent. Methods for forming the wafer level encapsulated package and electronic devices formed from the wafer level encapsulated package are also described.