公开(公告)号：US09076940B2

公开(公告)日：2015-07-07

申请号：US13971547

申请日：2013-08-20

Applicant: CREE, INC.

Inventor： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC: H01L33/00 ,  H01L33/60 ,  H05B33/08 ,  H01L25/075 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

公开(公告)号：US20140183584A1

公开(公告)日：2014-07-03

申请号：US14108815

申请日：2013-12-17

Applicant: CREE, INC.

Inventor： Tao Tong ,  Ronan Le Toquin ,  Bernd Keller ,  Eric Tarsa

IPC: H01L33/50

CPC classification number: H01L33/505 ,  F21K9/232 ,  F21K9/64 ,  F21V3/02 ,  F21V3/12 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: LED lamps or bulbs are disclosed that comprise a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink. The phosphor carrier can have a three-dimensional shape and comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light passes through the phosphor carrier. The phosphor carrier converts at least some of the LED light, with some embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can operate at a lower temperature to have greater phosphor conversion efficiency and reduced heat related damage. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and conceal the phosphor carrier.

Abstract translation: 公开了包括光源，散热结构和具有至少一种转换材料的远程荧光体载体的LED灯或灯泡。 荧光体载体可以远离光源并安装到散热器。 荧光体载体可以具有三维形状并且包括导热透明材料和荧光体层，其中基于LED的光源安装到散热器，使得光通过荧光体载体。 荧光体载体转换至少一些LED光，一些实施例发射LED和磷光体的白光组合。 荧光体载体中的荧光体可以在较低温度下操作，以具有更大的磷光体转换效率和减少的热相关损伤。 灯或灯泡还可以包括在荧光体载体上的扩散器以分配光并隐藏荧光体载体。

公开(公告)号：US20130341653A1

公开(公告)日：2013-12-26

申请号：US13971547

申请日：2013-08-20

Applicant: Cree, Inc.

Inventor： THOMAS YUAN ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract translation: 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。