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    MULTI-PHASE ELASTOMERIC THERMALLY CONDUCTIVE MATERIALS
    23.
    发明申请
    MULTI-PHASE ELASTOMERIC THERMALLY CONDUCTIVE MATERIALS 审中-公开
    多相弹性导热材料

    公开(公告)号：US20160177159A1

    公开(公告)日：2016-06-23

    申请号：US14906145

    申请日：2013-09-11

    Applicant: DOW GLOBAL TECHNOLOGIES LLC

    Inventor： Yunfeng Yang ,  Hongyu Chen ,  Mohamed Esseghir ,  Bharat I. Chaudhary

    IPC: C09K5/14 ,  H01L23/367 ,  H01L23/373 ,  F28F21/06

    CPC classification number: C09K5/14 ,  C08K3/22 ,  C08K3/28 ,  C08L23/0815 ,  C08L23/0853 ,  C08L23/16 ,  F28F21/06 ,  H01L23/3675 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Thermally conductive materials comprising a non-polar elastomer, a polar elastomer, and a thermally conductive filler. The polar elastomer and non-polar elastomer are sufficiently immiscible to form a polar elastomer phase and a non-polar elastomer phase. The thermally conductive filler is concentrated in an amount of at least 60 volume percent of the total filler amount in either the non-polar elastomer phase or the polar elastomer phase. The thermally conductive material has a tensile modulus less than 200 MPa. Such thermally conductive materials can be employed in a variety of articles of manufacture as thermal interface materials.

    Abstract translation: 包含非极性弹性体，极性弹性体和导热填料的导热材料。 极性弹性体和非极性弹性体是充分混溶的，以形成极性弹性体相和非极性弹性体相。 在非极性弹性体相或极性弹性体相中，导热填料的浓度至少为总填料量的60体积％。 导热材料的拉伸弹性模量小于200MPa。 这种导热材料可以用作各种制品作为热界面材料。

    CROSSLINKABLE OLEFIN/SILANE INTERPOLYMER COMPOSITIONS WITH REDUCED PEROXIDE LEVELS
    24.
    发明申请
    CROSSLINKABLE OLEFIN/SILANE INTERPOLYMER COMPOSITIONS WITH REDUCED PEROXIDE LEVELS 有权

    公开(公告)号：US20250051528A1

    公开(公告)日：2025-02-13

    申请号：US18719488

    申请日：2021-12-17

    Applicant: Dow Global Technologies LLC

    Inventor： Yunfeng Yang ,  Yabin Sun ,  Colin Li Pi Shan ,  Gaoxiang Wu ,  Wenxin Zhang

    IPC: C08J3/24 ,  C08K5/14 ,  C08K5/549

    Abstract: A process to form a crosslinked composition, the process comprising thermally treating a composition that comprises the following components: a) at least one olefin/silane interpolymer comprising at least one Si—H group, b) at least one peroxide, and c) at least one crosslinking coagent, wherein the composition has a mole ratio of active oxygen atom to carbon-carbon double bond of ≥0.02 and ≤0.7, based on the active oxygen atom content of component b and the carbon-carbon double bond content of component c. A composition that comprises the following components: a) at least one olefin/silane interpolymer comprising at least one Si—H group, b) at least one peroxide, and c) at least one crosslinking coagent, wherein the composition has a mole ratio of active oxygen atom to carbon-carbon double bond of ≥0.02 and ≤0.7, based on the active oxygen atom content of component b and the carbon-carbon double bond content of component c.

    Encapsulant Sheet with Low Potential Induced Degradation
    26.
    发明公开
    Encapsulant Sheet with Low Potential Induced Degradation 审中-公开

    公开(公告)号：US20240213386A1

    公开(公告)日：2024-06-27

    申请号：US18254591

    申请日：2020-12-17

    Applicant: Dow Global Technologies LLC

    Inventor： Wenxin Zhang ,  Yabin Sun ,  Yunfeng Yang ,  Yuyan Li

    IPC: H01L31/048 ,  H01L31/18

    CPC classification number: H01L31/0481 ,  H01L31/186

    Abstract: An encapsulant sheet includes a material formed from an ethylene/C4-C8α-olefin copolymer having a resin volume resistivity (VR) from greater than 1×1014Ω cm at 60° C. to less than 1×1016Ω cm at 60° C. and from 0.01 wt % to 0.2 wt % of an ion scavenger. The encapsulant sheet has a transmittance greater than 91%. A photovoltaic module (10) includes a front encapsulant sheet (12a) and a rear encapsulant sheet (12b) composed of the material. The photovoltaic module (10) has a power loss after potential induced degradation (PID) test from 0.05% to less than 5%.

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