Vertical DRAM having metallic node conductor
    25.
    发明授权
    Vertical DRAM having metallic node conductor 有权
    具有金属节点导体的垂直DRAM

    公开(公告)号:US06583462B1

    公开(公告)日:2003-06-24

    申请号:US09702338

    申请日:2000-10-31

    IPC分类号: H01L27108

    摘要: A dynamic random access memory device formed in a substrate having a trench. The trench has a side wall, a top, a lower portion, and a circumference. The device includes a signal storage node including a metallic storage node conductor formed in the lower portion of the trench and isolated from the side wall by a node dielectric and a collar oxide above the node dielectric. Preferably, the trench has an aspect ratio of greater than 50. A buried strap is coupled to the storage node conductor and contacts a portion of the side wall of the trench above the collar oxide. A trench-top dielectric which is formed upon the buried strap has a trench-top dielectric thickness. A signal transfer device includes a first diffusion region extending into the substrate adjacent the portion of the trench side wall contacted by the buried strap, a gate insulator having a gate insulator thickness formed on the trench side wall above the first buried strap, wherein the gate insulator thickness is less than the trench-top dielectric thickness, and a gate conductor formed within the trench upon the trench-top dielectric and adjacent the gate insulator.

    摘要翻译: 形成在具有沟槽的衬底中的动态随机存取存储器件。 沟槽具有侧壁,顶部,下部和圆周。 该装置包括信号存储节点,该信号存储节点包括形成在沟槽下部的金属存储节点导体,并通过节点电介质和节点电介质上方的环形氧化物与侧壁隔离。 优选地,沟槽具有大于50的纵横比。掩埋带耦合到存储节点导体并且接触环形氧化物上方的沟槽的侧壁的一部分。 形成在掩埋带上的沟槽电介质具有沟槽顶部的电介质厚度。 信号传送装置包括:第一扩散区域,其延伸到与所述掩埋带接触的所述沟槽侧壁的所述部分相邻的所述衬底;门绝缘体,其具有形成在所述第一掩埋带的上方的所述沟槽侧壁上的栅绝缘体厚度, 绝缘体厚度小于沟槽顶部电介质厚度,以及形成在沟槽顶部电介质并且邻近栅极绝缘体的沟槽内的栅极导体。

    Methods for fabricating a metal-oxide-semiconductor device structure
    26.
    发明授权
    Methods for fabricating a metal-oxide-semiconductor device structure 有权
    金属氧化物半导体器件结构的制造方法

    公开(公告)号:US07951660B2

    公开(公告)日:2011-05-31

    申请号:US10703355

    申请日:2003-11-07

    IPC分类号: H01L21/336

    摘要: A method for fabricating a metal-oxide-semiconductor device structure. The method includes introducing a dopant species concurrently into a semiconductor active layer that overlies an insulating layer and a gate electrode overlying the semiconductor active layer by ion implantation. The thickness of the semiconductor active layer, the thickness of the gate electrode, and the kinetic energy of the dopant species are chosen such that the projected range of the dopant species in the semiconductor active layer and insulating layer lies within the insulating layer and a projected range of the dopant species in the gate electrode lies within the gate electrode. As a result, the semiconductor active layer and the gate electrode may be doped simultaneously during a single ion implantation and without the necessity of an additional implant mask.

    摘要翻译: 一种制造金属氧化物半导体器件结构的方法。 该方法包括通过离子注入将掺杂剂物质同时引入覆盖在半导体有源层上的绝缘层和栅电极的半导体有源层中。 选择半导体有源层的厚度,栅电极的厚度和掺杂剂物质的动能,使得半导体有源层和绝缘层中的掺杂剂物质的投影范围位于绝缘层内,并且投影 栅电极中的掺杂物种类的范围位于栅电极内。 结果,半导体有源层和栅电极可以在单个离子注入期间同时掺杂,而不需要另外的注入掩模。

    Layer patterning using double exposure processes in a single photoresist layer
    27.
    发明授权
    Layer patterning using double exposure processes in a single photoresist layer 有权
    在单一光致抗蚀剂层中使用双曝光工艺的层图案化

    公开(公告)号:US07923202B2

    公开(公告)日:2011-04-12

    申请号:US11831099

    申请日:2007-07-31

    IPC分类号: G03F7/26

    摘要: A structure and a method for forming the same. The method includes providing a structure which includes (a) a to-be-patterned layer, (b) a photoresist layer on top of the to-be-patterned layer wherein the photoresist layer includes a first opening, and (c) a cap region on side walls of the first opening. A first top surface of the to-be-patterned layer is exposed to a surrounding ambient through the first opening. The method further includes performing a first lithography process resulting in a second opening in the photoresist layer. The second opening is different from the first opening. A second top surface of the to-be-patterned layer is exposed to a surrounding ambient through the second opening.

    摘要翻译: 一种结构及其形成方法。 该方法包括提供一种结构,其包括(a)待图案化层,(b)在待图案化层的顶部上的光致抗蚀剂层,其中光致抗蚀剂层包括第一开口,和(c)帽 区域在第一开口的侧壁上。 待图案化层的第一顶表面通过第一开口暴露于周围环境。 该方法还包括执行在光致抗蚀剂层中产生第二开口的第一光刻工艺。 第二个开口与第一个开口不同。 待图案化层的第二顶表面通过第二开口暴露于周围环境。