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59 条记录 (耗时 0.025 秒)

    Leveler compounds
    21.
    发明授权
    Leveler compounds 有权
    矫平剂化合物

    公开(公告)号：US07662981B2

    公开(公告)日：2010-02-16

    申请号：US12322090

    申请日：2009-01-29

    申请人： Deyan Wang ,  Robert D. Mikkola ,  Chunyi Wu ,  George G. Barclay

    发明人： Deyan Wang ,  Robert D. Mikkola ,  Chunyi Wu ,  George G. Barclay

    IPC分类号： C07D303/12

    CPC分类号： C25D3/38 ,  H01L21/2885 ,  H05K3/423

    摘要： Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

    摘要翻译： 提供含有流平剂混合物的电镀浴，其中混合物包括具有第一扩散系数的第一级试剂和具有第二扩散系数的第二流平剂。 这种电镀浴在一定范围的电解质浓度下沉积基本平坦的金属层，特别是铜层。 还公开了使用这种电镀浴沉积金属层的方法。 这些浴和方法对于在具有小孔径的基板（例如电子设备）上提供铜的平面层是有用的。

    Leveler compounds
    22.
    发明申请
    Leveler compounds 有权

    公开(公告)号：US20060016693A1

    公开(公告)日：2006-01-26

    申请号：US11182311

    申请日：2005-07-16

    申请人： Deyan Wang ,  Robert Mikkola ,  Chunyi Wu ,  George Barclay

    发明人： Deyan Wang ,  Robert Mikkola ,  Chunyi Wu ,  George Barclay

    IPC分类号： C25D3/38

    CPC分类号： C08G59/184 ,  C25D3/38 ,  H01L21/2885 ,  H05K3/423

    摘要： Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

    Coating compositions for photoresists
    27.
    发明申请
    Coating compositions for photoresists 有权
    光刻胶的涂料组合物

    公开(公告)号：US20070160930A1

    公开(公告)日：2007-07-12

    申请号：US11651090

    申请日：2007-01-08

    申请人： Deyan Wang ,  Peter Trefonas ,  Michael Gallagher

    发明人： Deyan Wang ,  Peter Trefonas ,  Michael Gallagher

    IPC分类号： G03C1/00

    CPC分类号： G03F7/11 ,  G03F7/0392 ,  G03F7/2041

    摘要： In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing.

    摘要翻译： 一方面，本发明涉及包含树脂组分的涂料组合物，其中树脂组分的主要部分包含至少基本上不含氟的一种或多种树脂。 本发明的涂料组合物可用作光致抗蚀剂外涂层，包括浸渍光刻加工。

    Leveler compounds
    28.
    发明申请
    Leveler compounds 有权
    矫平剂化合物

    公开(公告)号：US20070084732A1

    公开(公告)日：2007-04-19

    申请号：US11541806

    申请日：2006-10-02

    申请人： Deyan Wang ,  Robert Mikkola ,  George Barclay

    发明人： Deyan Wang ,  Robert Mikkola ,  George Barclay

    IPC分类号： C25D3/38

    CPC分类号： C25D3/38 ,  C25D3/02 ,  C25D3/40 ,  C25D7/12 ,  C25D7/123 ,  H05K3/423

    摘要： Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.

    摘要翻译： 提供金属电镀浴的流平剂。 含有这种流平剂的镀浴提供具有基本水平表面的金属沉积物。 可以选择这种流平剂以选择性地将期望水平的杂质掺入到金属沉积物中。

    Compositions and processes for immersion lithography
    30.
    发明授权
    Compositions and processes for immersion lithography 有权
    浸没光刻的组成和工艺

    公开(公告)号：US08715902B2

    公开(公告)日：2014-05-06

    申请号：US12319737

    申请日：2009-01-12

    申请人： Deyan Wang

    发明人： Deyan Wang

    IPC分类号： G03F7/004 ,  G03F7/20

    CPC分类号： G03F7/0392 ,  G03F7/0046 ,  G03F7/0047 ,  G03F7/0382 ,  G03F7/0757 ,  G03F7/0758 ,  G03F7/2041

    摘要： New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that can be substantially non-mixable with a resin component of the resist. Further preferred photoresist compositions of the invention comprise 1) Si substitution, 2) fluorine substitution; 3) hyperbranched polymers; and/or 4) polymeric particles. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.

    摘要翻译： 提供了可用于浸没式光刻的新的光致抗蚀剂组合物。 本发明优选的光致抗蚀剂组合物包含一种或多种可与抗蚀剂的树脂组分基本上不可混合的材料。 本发明的另外优选的光致抗蚀剂组合物包括1）Si取代，2）氟取代; 3）超支化聚合物; 和/或4）聚合物颗粒。 本发明的特别优选的光致抗蚀剂可以在浸没光刻处理期间将抗蚀剂材料的浸出降低到与抗蚀剂层接触的浸没流体中。