摘要:
A method for fabricating a magnetic head using a modified P1 cap process. A first pole is formed. A cap is formed above the first pole. A gap layer is formed above the cap. A second pole is formed above the gap layer. Exposed portions of the gap layer are removed. The cap and first pole are milled for creating a shoulder of the first pole tapered upwardly towards the cap. Another method for fabricating a magnetic head includes forming a first pole, forming a gap layer above the first pole, forming a second pole above the gap layer, forming a layer of photoresist above the second pole, patterning the photoresist such that the photoresist covers areas of the gap layer positioned towards the second pole, removing exposed portions of the gap layer, removing part of exposed portions of the first pole for forming steps in the first pole on opposite sides of the photoresist, removing the photoresist, and milling for creating a shoulder of the first pole tapering upwardly towards the cap.
摘要:
Write elements and methods of fabricating magnetic write poles are described. For one method, a vertical mask structure is formed on a magnetic layer in locations of a pole tip and a yoke of a write pole. The vertical mask structure may be formed by coating vertical surfaces of resists with an atomic layer deposition (ALD) process or a similar process. A removal process is then performed around the vertical mask structure to define the pole tip and part of the yoke of the write pole, and the vertical mask structure is removed. A lower portion of the pole tip is them masked while the upper portion of the pole tip and the part of the yoke is exposed. The upper portion of the pole tip and the part of the yoke are then expanded with magnetic material, such as with a plating process.
摘要:
A magnetic head for use in a perpendicular recording system having a novel shield structure that provides exceptional magnetic shielding from extraneous magnetic fields such as from a write coil, shaping layer or return pole of the write head. The shield structure is constructed to have a bottom or leading surface that is generally coplanar with the bottom or leading surface of the shaping layer, but all or a portion of the shield structure is not as thick as the shaping layer so as to have a top surface that does not extend to the same elevation (in a trailing direction) as that of the shaping layer. Making the shields extend to a lower level than the shaping layer improves magnetic performance by reducing flux leakage from the write pole, and also provides manufacturing advantages, such as during the manufacturing of the write pole. These manufacturing advantages include the advantage of having the shields covered with a protective layer of, for example, alumina during the ion milling of the write pole.
摘要:
Methods for improving within wafer and wafer to wafer yields during fabrication of notched trailing shield structures are disclosed. Ta/Rh CMP stop layers are deposited prior to planarization and notch formation to ensure a planar surface for trailing shield structures. These stop layers may be blanket deposited or patterned prior to CMP. Patterned stop layers produce the highest yields.
摘要:
Write elements and methods of fabricating magnetic write poles are described. For one method, a vertical mask structure is formed on a magnetic layer in locations of a pole tip and a yoke of a write pole. The vertical mask structure may be formed by coating vertical surfaces of resists with an atomic layer deposition (ALD) process or a similar process. A removal process is then performed around the vertical mask structure to define the pole tip and part of the yoke of the write pole, and the vertical mask structure is removed. A lower portion of the pole tip is them masked while the upper portion of the pole tip and the part of the yoke is exposed. The upper portion of the pole tip and the part of the yoke are then expanded with magnetic material, such as with a plating process.
摘要:
Methods for improving within wafer and wafer to wafer yields during fabrication of notched trailing shield structures are disclosed. Ta/Rh CMP stop layers are deposited prior to planarization and notch formation to ensure a planar surface for trailing shield structures. These stop layers may be blanket deposited or patterened prior to CMP. Patterned stop layers produce the highest yields.
摘要:
A magnetic head for use in a perpendicular recording system having a novel shield structure that provides exceptional magnetic shielding from extraneous magnetic fields such as from a write coil, shaping layer or return pole of the write head. The shield structure is constructed to have a bottom or leading surface that is generally coplanar with the bottom or leading surface of the shaping layer, but all or a portion of the shield structure is not as thick as the shaping layer so as to have a top surface that does not extend to the same elevation (in a trailing direction) as that of the shaping layer. Making the shields extend to a lower level than the shaping layer improves magnetic performance by reducing flux leakage from the write pole, and also provides manufacturing advantages, such as during the manufacturing of the write pole. These manufacturing advantages include the advantage of having the shields covered with a protective layer of, for example, alumina during the ion milling of the write pole.
摘要:
A method for manufacturing a magnetic write head for perpendicular magnetic recording. The method includes forming a write pole, and then depositing a refill layer. A mask structure can be formed over the writ pole and refill layer, the mask structure being configured to define a stitched pole. An ion milling or reactive ion milling can then be performed to remove portions of the refill layer that are not protected by the mask structure. Then a magnetic material can be deposited to form a stitched write pole that defines a secondary flare point. The stitched pole can also be self aligned with an electrical lapping guide in order to accurately locate the front edge of the secondary flare point relative to the air bearing surface of the write head.