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    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    21.
    发明申请
    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的制造方法

    公开(公告)号：US20140322893A1

    公开(公告)日：2014-10-30

    申请号：US14324626

    申请日：2014-07-07

    Applicant: FUJIFILM CORPORATION

    Inventor： Shiro TAN ,  Kazuhiro FUJIMAKI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

    IPC: H01L23/00 ,  H01L21/683

    CPC classification number: H01L23/562 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67115 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray, radiation or heat to irradiation of the adhesive layer with an actinic ray, radiation or heat, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching a first surface of the treated member from the adhesive layer of the adhesive support, wherein the irradiation of the adhesive layer with an actinic ray, radiation or heat is conducted so that adhesiveness decreases toward an outer surface from an inner surface on the substrate side of the adhesive layer.

    Abstract translation: 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘合性的粘合剂层进行照射时的光化射线，辐射或加热以对所述粘合剂层进行照射 光化射线，辐射或热，将待处理部件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于被处理物体的第一表面的第二表面进行机械或化学处理 构件，以获得处理构件，并且从粘合剂支撑体的粘合剂层分离处理构件的第一表面，其中进行具有光化射线，辐射或热的粘合剂层的照射，使得粘附性朝向外表面减小 从粘合剂层的基板侧的内表面。

    INK COMPOSITION, METHOD FOR PRODUCING THE SAME, AND IMAGE-FORMING METHOD
    23.
    发明申请
    INK COMPOSITION, METHOD FOR PRODUCING THE SAME, AND IMAGE-FORMING METHOD 审中-公开

    公开(公告)号：US20200024468A1

    公开(公告)日：2020-01-23

    申请号：US16587060

    申请日：2019-09-30

    Applicant: FUJIFILM CORPORATION

    Inventor： Ichiro KOYAMA ,  Noriaki SATO ,  Shota SUZUKI

    IPC: C09D11/38 ,  C09D11/101 ,  C09D11/102 ,  B41M5/00 ,  B41J11/00

    Abstract: Provided is an ink composition including: water; particles that each include a polymer having at least one of a urethane bond or a urea bond, and each have a polymerizable group; and a combination of a polymerization inhibitor A1 that is at least one selected from the group consisting of quinone compounds, nitroso compounds, and N-oxyl compounds, and a polymerization inhibitor A2 that is at least one selected from the group consisting of phenol compounds, or a combination of a polymerization inhibitor B1 that is at least one selected from the group consisting of phenol compounds having a solubility of 1.0 g/100 mL or more in water at 25° C., and a polymerization inhibitor B2 that is at least one selected from the group consisting of phenol compounds having a solubility of less than 1.0 g/100 mL in water at 25° C.

    AQUEOUS DISPERSION, METHOD FOR MANUFACTURING THE SAME, AND IMAGE FORMING METHOD
    25.
    发明申请
    AQUEOUS DISPERSION, METHOD FOR MANUFACTURING THE SAME, AND IMAGE FORMING METHOD 审中-公开

    公开(公告)号：US20190077980A1

    公开(公告)日：2019-03-14

    申请号：US16188282

    申请日：2018-11-13

    Applicant: FUJIFILM CORPORATION

    Inventor： Noriaki SATO ,  Shota SUZUKI ,  Ichiro KOYAMA

    IPC: C09D11/38 ,  C09D11/101

    Abstract: Provided are an aqueous dispersion including a microcapsule that contains a core and a shell; a dispersant that is at least one of a carboxylic acid (A) represented by Formula (A) or a salt of the carboxylic acid (A); and water, a method for manufacturing the aqueous dispersion, and an image forming method using the aqueous dispersion [in Formula (A), L represents a divalent linking group, X represents O, NH, or, NR2, R1 represents a hydrocarbon group having 9 or more carbon atoms, R2 represents a hydrocarbon group having 1 to 20 carbon atoms, and n represents 0 or 1].

    KIT AND LAMINATE
    27.
    发明申请
    KIT AND LAMINATE 审中-公开

    公开(公告)号：US20180012751A1

    公开(公告)日：2018-01-11

    申请号：US15712595

    申请日：2017-09-22

    Applicant: FUJIFILM Corporation

    Inventor： Yoshitaka KAMOCHI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

    IPC: H01L21/02 ,  H01L21/304 ,  C09J125/04 ,  C09J5/06 ,  C09J153/00 ,  C09J121/00 ,  C09J201/00

    CPC classification number: H01L21/022 ,  C09J5/06 ,  C09J121/00 ,  C09J125/04 ,  C09J153/00 ,  C09J201/00 ,  H01L21/02057 ,  H01L21/02304 ,  H01L21/304 ,  H01L21/31133 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

    Abstract: Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

    TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
    28.
    发明申请
    TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES 有权
    用于制造半导体器件的临时粘结层压板及制造半导体器件的方法

    公开(公告)号：US20160013088A1

    公开(公告)日：2016-01-14

    申请号：US14865755

    申请日：2015-09-25

    Applicant: FUJIFILM Corporation

    Inventor： Ichiro KOYAMA ,  Yu IWAI ,  Kazuhiro FUJIMAKI

    IPC: H01L21/683 ,  C09J123/16 ,  H01L21/324 ,  C09J125/14

    CPC classification number: H01L21/6835 ,  C09J4/00 ,  C09J123/16 ,  C09J125/14 ,  H01L21/324 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834

    Abstract: A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.

    Abstract translation: 提供了用于制造半导体器件的临时粘接层压板和半导体器件的制造方法。 待加工构件（半导体晶片等）可以在构件的机械或化学过程中被牢固且容易地暂时支撑，然后即使在经过处理的构件之后，处理构件也可以容易地从临时支撑件释放而不损坏处理构件 高温过程。 层压体包括：（A）剥离层和（B）粘合剂层。 剥离层含有（a1）在25℃恒温下加热条件下在氮气流中测定时，在25℃下为5％的质量还原温度为5 5％ ./min; 和（a2）在相同条件下测定时，具有250℃以上5％质量降低温度的粘合剂。

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