公开(公告)号：US20140212814A1

公开(公告)日：2014-07-31

申请号：US14229190

申请日：2014-03-28

申请人： FUJIFILM Corporation

发明人： Junichi ITO ,  Akinori SHIBUYA ,  Tomoki MATSUDA ,  Yoko TOKUGAWA ,  Toshiaki FUKUHARA ,  Naohiro TANGO ,  Kaoru IWATO ,  Masahiro YOSHIDOME ,  Shinichi SUGIYAMA ,  Shohei KATAOKA

IPC分类号： G03F7/027

CPC分类号： G03F7/027 ,  C07C309/06 ,  C07C309/12 ,  C07C309/17 ,  C07C311/48 ,  C07C381/12 ,  C07C2601/08 ,  C07C2601/14 ,  C07C2603/74 ,  C07D279/30 ,  C07D307/33 ,  C07D327/08 ,  C07D333/76 ,  C07D335/16 ,  C07D339/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/2041

摘要： Provided is an actinic-ray- or radiation-sensitive resin composition, including any of compounds of general formula (1) below that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid and a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer.

摘要翻译： 本发明提供了一种光化学射线或辐射敏感性树脂组合物，其包括以下通式（1）的任何化合物：当暴露于光化射线或辐射时，其被分解，从而产生酸和树脂，当被 酸分解，从而增加其在碱性显影剂中的溶解度。

公开(公告)号：US20170192355A1

公开(公告)日：2017-07-06

申请号：US15467357

申请日：2017-03-23

申请人： FUJIFILM Corporation

发明人： Masafumi KOJIMA ,  Akiyoshi GOTO ,  Akinori SHIBUYA ,  Keita KATO ,  Keiyu OU

IPC分类号： G03F7/038 ,  G03F7/20 ,  G03F7/38 ,  G03F7/004 ,  G03F7/40 ,  H01L21/027 ,  C08F220/18 ,  G03F7/09 ,  G03F7/16 ,  G03F7/32

CPC分类号： G03F7/038 ,  C08F220/18 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/091 ,  G03F7/11 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/325 ,  G03F7/327 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027

摘要： The present invention has an object to provide a method for forming a negative tone pattern in which shrinkage of a film in post exposure bake is suppressed; a method for manufacturing an electronic device including the pattern forming method; and an active-light-sensitive or radiation-sensitive resin composition. The method for forming a negative tone pattern of the present invention includes: a film formation step of forming an active-light-sensitive or radiation-sensitive resin composition film on a substrate, using a resist composition; an exposing step of irradiating the film with active light or radiation; a heating treatment step of performing a heating treatment on the film irradiated with active light or radiation; and a developing step of developing the heating-treated film using a developer including an organic solvent, in which the resist composition includes a resin A having a repeating unit A with a group represented by a specific formula, a resin B having a repeating unit B with a group represented by a specific formula, and a compound that generates an acid upon irradiation with active light or radiation.

公开(公告)号：US20170097565A1

公开(公告)日：2017-04-06

申请号：US15384521

申请日：2016-12-20

申请人： FUJIFILM Corporation

发明人： Shohei KATAOKA ,  Akinori SHIBUYA ,  Keiyu OU

IPC分类号： G03F7/004 ,  G03F7/09 ,  G03F7/40 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/038 ,  G03F7/16

CPC分类号： G03F7/0045 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/091 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40

摘要： An active-light-sensitive or radiation-sensitive resin composition includes a basic compound (A) corresponding to at least one of the following basic compound (A1) or (A2): (A1) a nonionic compound having an alicyclic structure (a1) and a basic site (b2) at a site different from the alicyclic structure within one molecule, or (A2) a nonionic compound having a heterocyclic structure (a2) having no basicity and a basic site (b2) at a site different from the heterocyclic structure within one molecule.

公开(公告)号：US20160070167A1

公开(公告)日：2016-03-10

申请号：US14840654

申请日：2015-08-31

申请人： FUJIFILM CORPORATION

发明人： Shohei KATAOKA ,  Akinori SHIBUYA ,  Toshiaki FUKUHARA ,  Hajime FURUTANI ,  Michihiro SHIRAKAWA

IPC分类号： G03F7/038 ,  G03F7/32 ,  C07C311/51 ,  G03F7/20

CPC分类号： G03F7/038 ,  C07C25/18 ,  C07C233/04 ,  C07C235/88 ,  C07C311/03 ,  C07C311/06 ,  C07C311/51 ,  C07C311/53 ,  C07C381/12 ,  C07C2601/14 ,  C07C2603/74 ,  C07D327/06 ,  C07D333/46 ,  C07D333/76 ,  C07D411/06 ,  C08F220/26 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/20 ,  G03F7/325 ,  H01L21/0275

摘要： There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition.

摘要翻译： 提供了一种图案形成方法，其包括（i）形成含有光化射线敏感性或辐射敏感性树脂组合物的膜的步骤，所述树脂组合物含有（A）由特定式表示的化合物，（B）不同于化合物 （A），并且能够在用光化射线或辐射照射时产生酸，和（P）不与化合物（A）产生的酸反应的树脂，并且能够降低对有机溶剂 - 通过由化合物（B）产生的酸的作用，（ii）曝光膜的步骤，和（iii）通过使用含有机溶剂的显影剂显影曝光的膜以形成负型图案的步骤 ; 上述的光化射线敏感或辐射敏感树脂组合物; 使用该组合物的抗蚀剂膜。

公开(公告)号：US20160048082A1

公开(公告)日：2016-02-18

申请号：US14919329

申请日：2015-10-21

申请人： FUJIFILM Corporation

发明人： Masafumi KOJIMA ,  Akiyoshi GOTO ,  Michihiro SHIRAKAWA ,  Hajime FURUTANI ,  Akinori SHIBUYA

IPC分类号： G03F7/32 ,  G03F7/20

CPC分类号： G03F7/325 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2041 ,  G03F7/2053

摘要： A pattern-forming method includes forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing at least a resin that exhibits, due to an action of an acid, increase in polarity and decrease in solubility with respect to a developer including an organic solvent, and a compound that generates an acid by being irradiated with actinic rays or radiation; exposing the film; and forming a negative tone pattern by developing the exposed film with a developer including an organic solvent, in which the developer includes at least one compound A selected from the group consisting of an onium salt, a polymer having an onium salt, a nitrogen-containing compound including three or more nitrogen atoms, a basic polymer, and a phosphorus-based compound.

摘要翻译： 图案形成方法包括通过使用至少含有树脂的光化射线敏感性或辐射敏感性树脂组合物在基材上形成膜，所述树脂组合物由于酸的作用而显示极性增加并且溶解度降低 包括有机溶剂的显影剂和通过用光化射线或辐射照射产生酸的化合物; 曝光电影; 以及通过用包括有机溶剂的显影剂显影所述曝光膜形成负色调图案，其中所述显影剂包括至少一种选自以下的化合物A：鎓盐，具有鎓盐的聚合物，含氮的 包括三个或更多个氮原子的化合物，碱性聚合物和磷基化合物。

公开(公告)号：US20140234759A1

公开(公告)日：2014-08-21

申请号：US14229240

申请日：2014-03-28

申请人： FUJIFILM Corporation

发明人： Shohei KATAOKA ,  Akinori SHIBUYA ,  Junichi ITO ,  Tomoki MATSUDA ,  Toshiaki FUKUHARA ,  Naohiro TANGO ,  Kaoru IWATO ,  Masahiro YOSHIDOME ,  Shinichi SUGIYAMA ,  Yoko TOKUGAWA

IPC分类号： G03F7/038

CPC分类号： G03F7/038 ,  C08F220/28 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/2041

摘要： According to one embodiment, there is provided an actinic ray- or radiation-sensitive resin composition containing (A) a resin containing a repeating unit represented by general formula (1) below and a repeating unit that is decomposed by an action of an acid to generate an alkali-soluble group, and (B) a compound that generates the acid when exposed to actinic rays or radiation, where L represents a bivalent connecting group, R1 represents a hydrogen atom or an alkyl group, and Z represents a cyclic acid anhydride structure.

摘要翻译： 根据一个实施方案，提供了一种光化射线或辐射敏感性树脂组合物，其含有（A）含有下述通式（1）表示的重复单元的树脂和通过酸作用分解的重复单元 产生碱溶性基团，（B）当暴露于光化学射线或辐射时产生酸的化合物，其中L表示二价连接基团，R 1表示氢原子或烷基，Z表示环状酸酐 结构体。

公开(公告)号：US20210388134A1

公开(公告)日：2021-12-16

申请号：US17412239

申请日：2021-08-25

申请人： FUJIFILM Corporation

发明人： Naoya SHIMOJU ,  Akinori SHIBUYA

IPC分类号： C08F212/08 ,  C08F222/10 ,  C08F2/50 ,  C08F220/06 ,  C08G61/10 ,  G03F7/00

摘要： Provided are: a curable composition for imprinting, which contains a compound C represented by Formula (C1) and a radical polymerization initiator; a kit including the curable composition; a pattern producing method using the curable composition; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.

公开(公告)号：US20200089113A1

公开(公告)日：2020-03-19

申请号：US16689389

申请日：2019-11-20

申请人： FUJIFILM Corporation

发明人： Takeshi KAWABATA ,  Kenta YOSHIDA ,  Yu IWAI ,  Akinori SHIBUYA

IPC分类号： G03F7/037 ,  G03F7/004 ,  C08G73/10 ,  C08G73/22 ,  H01L23/29 ,  H01L21/56

摘要： A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

公开(公告)号：US20190382623A1

公开(公告)日：2019-12-19

申请号：US16546996

申请日：2019-08-21

申请人： FUJIFILM Corporation

发明人： Naoya SHIMOJU ,  Akinori SHIBUYA ,  Yuichiro GOTO

IPC分类号： C09J7/30 ,  C09J5/00 ,  H01L21/027 ,  B32B7/12 ,  B32B3/26 ,  B32B37/12 ,  B32B37/15 ,  B32B38/00 ,  B32B9/00 ,  B32B9/04 ,  B32B27/30

摘要： There are provided a composition for forming an adhesive film for imprinting having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting contains a resin having a polymerizable group; and a solvent, in which the resin has at least one kind of a repeating unit derived from a polymerizable compound having a C log P value less than or equal to 0, and solubility of the resin in water at 25° C. is greater than or equal to 1 mass %, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.

公开(公告)号：US20180215874A1

公开(公告)日：2018-08-02

申请号：US15938528

申请日：2018-03-28

申请人： FUJIFILM Corporation

发明人： Takeshi KAWABATA ,  Yu IWAI ,  Akinori SHIBUYA

IPC分类号： C08G73/12 ,  G03F7/031 ,  G03F7/037 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  H01L23/498

摘要： Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.