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    Avalanche photodetectors with a multiple-thickness charge sheet
    21.
    发明授权
    Avalanche photodetectors with a multiple-thickness charge sheet 有权

    公开(公告)号：US11721780B2

    公开(公告)日：2023-08-08

    申请号：US17528385

    申请日：2021-11-17

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Asif Chowdhury ,  Yusheng Bian

    IPC: H01L31/107 ,  H01L31/18 ,  H01L31/0352 ,  H01L31/028

    CPC classification number: H01L31/1075 ,  H01L31/028 ,  H01L31/035281 ,  H01L31/1804

    Abstract: Structures for an avalanche photodetector and methods of forming a structure for an avalanche photodetector. The structure includes a first semiconductor layer having a first portion and a second portion, and a second semiconductor layer stacked in a vertical direction with the first semiconductor layer. The first portion of the first semiconductor layer defines a multiplication region of the avalanche photodetector, and the second semiconductor layer defines an absorption region of the avalanche photodetector. The structure further includes a charge sheet in the second portion of the first semiconductor layer. The charge sheet has a thickness that varies with position in a horizontal plane, and the charge sheet is positioned in the vertical direction between the second semiconductor layer and the first portion of the first semiconductor layer.

    Optical components undercut by a sealed cavity
    24.
    发明授权
    Optical components undercut by a sealed cavity 有权

    公开(公告)号：US11650382B1

    公开(公告)日：2023-05-16

    申请号：US17510934

    申请日：2021-10-26

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Ryan Sporer ,  Yusheng Bian ,  Takako Hirokawa

    IPC: H04B10/00 ,  G02B6/42 ,  G02B6/30

    CPC classification number: G02B6/4251 ,  G02B6/305

    Abstract: Structures including an optical component, such as an edge coupler, and methods of fabricating a structure that includes an optical component, such as an edge coupler. The structure includes a substrate having a sealed cavity, an optical component, and a dielectric layer between the optical component and the sealed cavity. The optical component is positioned vertically over the substrate and the dielectric layer, and the optical component overlaps with the sealed cavity in the substrate.

    PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components
    25.
    发明授权
    PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components 有权

    公开(公告)号：US11650381B1

    公开(公告)日：2023-05-16

    申请号：US17650845

    申请日：2022-02-12

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Nicholas A. Polomoff ,  Yusheng Bian ,  Thomas Houghton

    IPC: G02B6/42 ,  G02B6/30

    CPC classification number: G02B6/4243 ,  G02B6/30 ,  G02B6/423

    Abstract: PIC die packages may include a PIC die including: a body having a plurality of layers including a plurality of interconnect layers. A first optical fiber is positioned in a groove and a second optical fiber positioned in another groove in the edge of the body. The first optical fiber is aligned with an optical component in a first layer of the body at a first vertical depth, and the second optical fiber is aligned with another optical component in a second, different layer of the body at a second different vertical depth. A cover is over at least a portion of the body. The cover includes a member having a face defining a first seat therein having a first height to receive a portion of the first optical fiber, and defining a second seat therein having a second, different height to receive a portion of the second optical fiber.

    OPTICAL COUPLERS WITH DIAGONAL LIGHT TRANSFER
    26.
    发明公开
    OPTICAL COUPLERS WITH DIAGONAL LIGHT TRANSFER 审中-公开

    公开(公告)号：US20230143832A1

    公开(公告)日：2023-05-11

    申请号：US17524218

    申请日：2021-11-11

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/122 ,  G02B6/125 ,  G02B6/12

    CPC classification number: G02B6/1228 ,  G02B6/125 ,  G02B6/12002

    Abstract: Structures for an optical coupler and methods of fabricating a structure for an optical coupler. The structure includes a first waveguide core having a first tapered section and a second waveguide core having a second tapered section positioned adjacent to the first tapered section of the first waveguide core. The second tapered section is positioned with a lateral offset in a lateral direction relative to the first tapered section. The second tapered section is positioned with a vertical offset in a vertical direction relative to the first tapered section.

    OPTICAL COMPONENTS UNDERCUT BY A SEALED CAVITY
    27.
    发明申请
    OPTICAL COMPONENTS UNDERCUT BY A SEALED CAVITY 有权

    公开(公告)号：US20230128786A1

    公开(公告)日：2023-04-27

    申请号：US17510934

    申请日：2021-10-26

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Ryan Sporer ,  Yusheng Bian ,  Takako Hirokawa

    IPC: G02B6/42 ,  G02B6/30

    Abstract: Structures including an optical component, such as an edge coupler, and methods of fabricating a structure that includes an optical component, such as an edge coupler. The structure includes a substrate having a sealed cavity, an optical component, and a dielectric layer between the optical component and the sealed cavity. The optical component is positioned vertically over the substrate and the dielectric layer, and the optical component overlaps with the sealed cavity in the substrate.

    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH SUPPLEMENTAL WAVEGUIDE-ENHANCED OPTICAL COUPLING BETWEEN PRIMARY WAVEGUIDES
    28.
    发明申请
    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH SUPPLEMENTAL WAVEGUIDE-ENHANCED OPTICAL COUPLING BETWEEN PRIMARY WAVEGUIDES 有权

    公开(公告)号：US20230064852A1

    公开(公告)日：2023-03-02

    申请号：US17411106

    申请日：2021-08-25

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/122

    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first primary waveguide, which has a first main body and a first end portion that is tapered; at least one supplemental waveguide positioned laterally adjacent to and extending beyond the first end portion of the first primary waveguide; and a second primary waveguide, which has a second main body and a second end portion that at least partially underlays/overlays the first end portion of the first primary waveguide and the supplemental waveguide(s). The arrangement the end portions of the primary waveguides and the supplemental waveguide(s) allows for mode matching conditions to be met at multiple locations at the interface between the primary waveguides, thereby creating multiple signal paths between the primary waveguides and effectively reducing the light signal power density in any one path to prevent or at least minimize any power-induced damage.

    Edge couplers with metamaterial rib features
    29.
    发明授权
    Edge couplers with metamaterial rib features 有权

    公开(公告)号：US11536902B1

    公开(公告)日：2022-12-27

    申请号：US17369253

    申请日：2021-07-07

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/122 ,  G02B6/13 ,  G02B6/12

    Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A waveguide core includes a waveguide core section that has a first notched sidewall, a second notched sidewall, and an end surface connecting the first notched sidewall to the second notched sidewall. Segments are positioned with a spaced arrangement adjacent to the end surface of the waveguide core section, and a slab layer is adjoined to the segments, the first notched sidewall of the waveguide core section, the second notched sidewall of the waveguide core section, and the end surface of the waveguide core section. The segments and the waveguide core section have a first thickness, and the slab layer has a second thickness that is less than the first thickness.

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