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公开(公告)号：US08531263B2
公开(公告)日：2013-09-10
申请号：US12953201
申请日：2010-11-23
IPC分类号： H01H85/20
CPC分类号： H01H85/0241 , H01H85/0039 , H01H85/0047 , H01H85/0052 , H01H85/0417
摘要： A circuit protection device includes a conductive layer which is connected to first and second terminals. A spring is electrically connected to the first and second terminals. When an over-voltage or over-temperature condition occurs within a charging circuit, one or more heat generating resistive elements melts material associated with one or more of the ends of the spring thereby releasing the spring to create an open circuit.
摘要翻译： 电路保护装置包括连接到第一和第二端子的导电层。 弹簧电连接到第一和第二端子。 当在充电电路内发生过电压或过温情况时，一个或多个发热电阻元件熔化与弹簧的一个或多个端部相关联的材料，从而释放弹簧以产生开路。
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公开(公告)号：US20090027821A1
公开(公告)日：2009-01-29
申请号：US11828844
申请日：2007-07-26
申请人： James A. Colby , Stephen Whitney , Du Yaosheng
发明人： James A. Colby , Stephen Whitney , Du Yaosheng
IPC分类号： H02H5/04
CPC分类号： H02H5/048 , H01C7/02 , H01H85/0418 , H01H85/046 , H01H85/048 , H01H2085/0414 , H01H2085/0483 , H03K17/687 , H03K17/72 , H03K17/74
摘要： A circuit protection device includes a fuse element placed in parallel with a PTC thermistor layer. The element and PTC thermistor layer are provided on one or more insulating substrate, such as an FR-4 or polyimide substrate. First and second conductors connect the fuse element and PTC thermistor layer electrically in parallel, such that current (i) initially under normal flows mainly through the fuse element and PTC thermistor layer at a lower drop in voltage and (ii) after an opening of the fuse element flows under normal operation through the PTC thermistor layer at a higher drop in voltage.
摘要翻译： 电路保护装置包括与PTC热敏电阻层并联放置的熔丝元件。 元件和PTC热敏电阻层设置在一个或多个绝缘基板上，例如FR-4或聚酰亚胺基板。 第一和第二导体并联电连接熔丝元件和PTC热敏电阻层，使得最初正常流动的电流（i）主要通过熔断元件和PTC热敏电阻层以较低的电压下降，以及（ii）在打开 熔断元件在正常工作下通过PTC热敏电阻层以较高的电压下降流动。
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公开(公告)号：US5440802A
公开(公告)日：1995-08-15
申请号：US302999
申请日：1994-09-12
IPC分类号： H01H69/02 , H01H85/041 , H01H85/0445 , H01H85/046
CPC分类号： H01H85/0411 , H01H2085/0414 , H01H69/02 , H01H69/022 , H01H85/0418 , H01H85/046 , Y10T29/49107 , Y10T29/49162 , Y10T29/49787
摘要： A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.
摘要翻译： 一种制造芯片熔断器的方法包括以下步骤：在绿色未焙烧的陶瓷衬底上沉积多列导电金属膜，并将多个线元件设置在膜柱上并垂直于膜柱的衬底上。 绿色的未焙烧陶瓷的覆盖物通过线元件和膜柱结合到基底上以形成层压体。 然后将层压体切割成单独的熔丝，然后将其烧制以固化陶瓷并在导线元件和金属膜之间形成金属间键。 然后将端部终端涂层施加到熔断器以便于将电路中的保险丝连接起来。 本发明涉及一种根据该方法制造的芯片保险丝。
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公开(公告)号：US5432378A
公开(公告)日：1995-07-11
申请号：US166882
申请日：1993-12-15
IPC分类号： H01H85/143 , H01H85/00 , H01H85/041 , H01H85/045 , H01H85/046 , H01H85/06 , H01L27/02
CPC分类号： H01H85/046 , H01H85/0411 , H01H2085/0034 , H01H85/003
摘要： A subminiature circuit protector includes an electrically insulating substrate, a fuse element connecting end termination pads, the termination pads extending to end and lateral edges of the substrate, an electrically insulation cover over the fuse element and termination pads, and end terminations formed over the end and a portion of the lateral surfaces of the substrate electrically connecting with the termination pads.
摘要翻译： 超小型电路保护器包括电绝缘基板，连接端部端接焊盘的熔丝元件，终止焊盘延伸到基板的端部和侧边缘，熔断元件上的电绝缘盖和终端焊盘以及端部上形成的端部端接 以及衬底的侧表面的一部分与端接焊盘电连接。
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