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公开(公告)号：US5432378A
公开(公告)日：1995-07-11
申请号：US166882
申请日：1993-12-15
IPC分类号： H01H85/143 , H01H85/00 , H01H85/041 , H01H85/045 , H01H85/046 , H01H85/06 , H01L27/02
CPC分类号： H01H85/046 , H01H85/0411 , H01H2085/0034 , H01H85/003
摘要： A subminiature circuit protector includes an electrically insulating substrate, a fuse element connecting end termination pads, the termination pads extending to end and lateral edges of the substrate, an electrically insulation cover over the fuse element and termination pads, and end terminations formed over the end and a portion of the lateral surfaces of the substrate electrically connecting with the termination pads.
摘要翻译： 超小型电路保护器包括电绝缘基板，连接端部端接焊盘的熔丝元件，终止焊盘延伸到基板的端部和侧边缘，熔断元件上的电绝缘盖和终端焊盘以及端部上形成的端部端接 以及衬底的侧表面的一部分与端接焊盘电连接。
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公开(公告)号：US5440802A
公开(公告)日：1995-08-15
申请号：US302999
申请日：1994-09-12
IPC分类号： H01H69/02 , H01H85/041 , H01H85/0445 , H01H85/046
CPC分类号： H01H85/0411 , H01H2085/0414 , H01H69/02 , H01H69/022 , H01H85/0418 , H01H85/046 , Y10T29/49107 , Y10T29/49162 , Y10T29/49787
摘要： A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.
摘要翻译： 一种制造芯片熔断器的方法包括以下步骤：在绿色未焙烧的陶瓷衬底上沉积多列导电金属膜，并将多个线元件设置在膜柱上并垂直于膜柱的衬底上。 绿色的未焙烧陶瓷的覆盖物通过线元件和膜柱结合到基底上以形成层压体。 然后将层压体切割成单独的熔丝，然后将其烧制以固化陶瓷并在导线元件和金属膜之间形成金属间键。 然后将端部终端涂层施加到熔断器以便于将电路中的保险丝连接起来。 本发明涉及一种根据该方法制造的芯片保险丝。
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公开(公告)号：US4612529A
公开(公告)日：1986-09-16
申请号：US715799
申请日：1985-03-25
申请人： Leon Gurevich , Vernon Spaunhorst
发明人： Leon Gurevich , Vernon Spaunhorst
IPC分类号： H01H69/02 , H01H37/76 , H01H85/00 , H01H85/02 , H01H85/041 , H01H85/045 , H01H85/143 , H01H85/147 , H01H85/153 , H01H85/17 , H01H85/20 , H01H85/38 , H01H85/14
CPC分类号： H01H85/0417 , H01H85/38 , H01H2069/027 , H01H2085/0034 , H01H2085/0412 , H01H85/003
摘要： A subminiature fuse is disclosed comprising two terminals, a substrate, a fusible conductor, and a unitary housing. The unitary housing is sealed and provides increased mechanical strength, thus reducing the risk of a catastrophic failure of the fuse. The upper portion of the fuse terminals are shaped into finger like projections adaptable to mechanically fastening the fusible conductor and the substrate thereto thus facilitating the manufacturing process. In one embodiment the fusible conductor and adjacent portions of the terminals and substrate are coated with a ceramic coating or adhesive. The housing is sealed by ultrasonic welding or preferably in an insert molded plastic enclosure which is substantially devoid of air.
摘要翻译： 公开了一种超小型熔断器，其包括两个端子，衬底，可熔导体和整体壳体。 整体式外壳密封并提供增加的机械强度，从而降低保险丝灾难性故障的风险。 熔断器端子的上部形成为适于将可熔导体和基板机械地紧固的手指状突起，从而便于制造过程。 在一个实施例中，可熔体导体和端子和基底的相邻部分涂覆有陶瓷涂层或粘合剂。 壳体通过超声波焊接或优选地在基本上没有空气的插入模制塑料外壳中密封。
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公开(公告)号：US20060214259A1
公开(公告)日：2006-09-28
申请号：US11091665
申请日：2005-03-28
申请人： Vernon Spaunhorst
发明人： Vernon Spaunhorst
IPC分类号： H01L29/00
CPC分类号： H01H85/0411 , H01H69/022 , H01H85/046 , H01H85/143 , H01H2069/025 , H01H2085/0412 , H01H2085/266 , H01L24/01 , H05K3/3426 , H05K2201/10181 , H05K2201/10583 , H05K2201/10651 , Y02P70/613
摘要： A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.
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公开(公告)号：US6160695A
公开(公告)日：2000-12-12
申请号：US371544
申请日：1999-08-10
CPC分类号： H01T4/08 , H01C7/12 , H01T21/00 , Y10S428/901 , Y10T29/49002 , Y10T29/49117 , Y10T29/49146 , Y10T29/49156 , Y10T428/24926 , Y10T428/24992
摘要： A method for fabricating transient voltage protection devices is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection and includes specific ceramic materials designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.
摘要翻译： 描述了一种用于制造瞬态电压保护装置的方法，其中使用金刚石切割锯形成接地导体和另一个导体之间的间隙。 衬底材料选择，并包括特定的陶瓷材料，旨在优化性能和可制造性。 可以提供覆盖层以最小化间隙形成期间导体的毛刺。
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公开(公告)号：US4613195A
公开(公告)日：1986-09-23
申请号：US711527
申请日：1985-03-14
申请人： Frank Suher , Glen Dunn , Vernon Spaunhorst , Angelo Urani
发明人： Frank Suher , Glen Dunn , Vernon Spaunhorst , Angelo Urani
CPC分类号： H01R33/94
摘要： A terminal adapter for a cartridge fuse accommodating the installation of the fuse in fuse holders of a different size and type while at time insuring the installation of the proper class of fuse in a particular application.
摘要翻译： 用于盒式存储器的端子适配器，其容纳将熔丝安装在不同尺寸和类型的熔丝保持器中，同时确保在特定应用中安装适当类型的熔丝。
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公开(公告)号：US6013358A
公开(公告)日：2000-01-11
申请号：US972574
申请日：1997-11-18
CPC分类号： H01T4/08 , H01C7/12 , H01T21/00 , Y10S428/901 , Y10T29/49002 , Y10T29/49117 , Y10T29/49146 , Y10T29/49156 , Y10T428/24926 , Y10T428/24992
摘要： A transient voltage protection device is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection includes specific ceramic materials having a density of less than 3.8 gm/cm.sup.3 designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.
摘要翻译： 描述了一种瞬态电压保护装置，其中使用金刚石切割锯形成接地导体和另一导体之间的间隙。 基材选择包括密度小于3.8gm / cm 3的特定陶瓷材料，旨在优化性能和可制造性。 可以提供覆盖层以最小化间隙形成期间导体的毛刺。
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公开(公告)号：US4751489A
公开(公告)日：1988-06-14
申请号：US897689
申请日：1986-08-18
申请人： Vernon Spaunhorst
发明人： Vernon Spaunhorst
IPC分类号： H01H85/00 , H01H37/76 , H01H85/041 , H01H85/045 , H01H85/147 , H01H85/153 , H01H85/17 , H01H85/16
CPC分类号： H01H85/0417 , H01H2085/0034 , H01H85/003
摘要： A subminiature fuse comprising two terminals, a substrate, a fusible conductor, ceramic coating, a second coating and a unitary housing. A ceramic substrate 80 plated at both ends is inserted into fingers (70) in terminal, a fusible wire element 10 is strung between the fingers (70) and (20, 30) and electrically connects the terminal (20, 30). The assembly 160 is encased in a ceramic adhesive 180 which is encased in a second material (200) with superior dielectric properties. The ceramic encased assembly is enclosed in a unitary housing by injection molding.
摘要翻译： 一种包括两个端子，一个基板，一个可熔导体，陶瓷涂层，一个第二涂层和一个整体壳体的超小型保险丝。 将两端电镀的陶瓷基板80插入端子中的指状物（70）中，将可熔线元件10串在指状物（70）和（20,30）之间并电连接端子（20,30）。 组件160被封装在陶瓷粘合剂180中，陶瓷粘合剂180被封装在具有优良介电特性的第二材料（200）中。 陶瓷封装组件通过注射成型封装在一体式外壳中。
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