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公开(公告)号:US12257837B2
公开(公告)日:2025-03-25
申请号:US18032797
申请日:2020-10-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric T. Martin , James R. Przybyla , Garrett E. Clark
Abstract: In some examples, a fluidic die includes an arrangement of fluidic elements to dispense a fluid, where each fluidic element of the fluidic elements includes a fluidic actuator and a fluid chamber. The fluidic die includes an array of fluid feed holes in a plurality of dimensions to communicate the fluid with the fluidic elements, where each of multiple fluid feed holes along a first dimension of the plurality of dimensions is distinct from multiple fluid feed holes along a second dimension of the plurality of dimensions. The fluidic die includes circuit elements interspersed in regions between the fluidic elements along different axes of the fluidic die, where each circuit element of the circuit elements includes an active device. The fluidic elements and the circuit elements are formed on a common substrate.
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公开(公告)号:US20250058563A1
公开(公告)日:2025-02-20
申请号:US18720579
申请日:2021-12-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Jacob Lum , James R. Przybyla
Abstract: A fluid-ejection printhead includes a sparse array of fluid-ejection nozzles through which fluid is ejected onto dot rows parallel to a scan axis of the fluidejection printhead. The fluid is ejected by more than one fluid-ejection nozzle of the sparse array onto each dot row. The fluid-ejection printhead includes fluidejection element. Each element can correspond to a pair of the fluid-ejection nozzles through which the fluid is ejected onto a same dot row and include a corresponding pair of fluid-ejection actuators. Each element can instead correspond to one of the fluid-ejection nozzles and include one fluid-ejection actuator.
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公开(公告)号:US11951739B2
公开(公告)日:2024-04-09
申请号:US17799708
申请日:2020-03-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Thomas Martin , Gary G. Lutnesky , James R. Przybyla , Rogelio Cicili
CPC classification number: B41J2/14072 , B41J2/04543 , B41J2/0458 , B41J2/04581 , B41J2002/14491 , B41J2202/11 , B41J2202/20
Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.
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公开(公告)号:US11312129B2
公开(公告)日:2022-04-26
申请号:US17267542
申请日:2018-11-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Martin , James R. Przybyla , Daryl E. Anderson
Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of firing subassemblies grouped into zones. Each firing subassembly includes 1) a firing chamber, 2) a fluid actuator, and 3) a sensor plate. The fluidic die also includes a measurement device per zone to measure a voltage indicative of an impedance within a selected firing chamber. The fluidic die includes a selector per firing subassembly to couple a selected sensor plate to the measurement device. A selector is adjacent a respective firing subassembly and a distance between the selector and the measurement device is different as compared to other selectors.
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公开(公告)号:US11292250B2
公开(公告)日:2022-04-05
申请号:US16965703
申请日:2018-03-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Martin , Tsuyoshi Yamashita , James R. Przybyla
Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of fluid actuators grouped into primitives. Each actuator is disposed in a fluid chamber. The fluidic die also includes an array of fluid sensors. Each fluid sensor is disposed within a fluid chamber and determines a characteristic within the fluid chamber. A data parser of the fluidic die extracts from an incoming signal, firing instructions and measurement instructions for the fluidic die. The measurement instructions indicate at least one of a peak measurement during a nucleation event and a reference measurement during a non-nucleation event. A firing controller generates firing signals based on the firing instructions and a measurement controller activates, during a measurement interval of a printing cycle for the primitive, a measurement for a selected actuator based on the measurement instructions.
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公开(公告)号:US11173712B2
公开(公告)日:2021-11-16
申请号:US16970470
申请日:2018-04-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric T. Martin , Daryl E. Anderson , James R. Przybyla
Abstract: In some examples, a system includes a device support to receive a fluid dispensing device, and a controller to identify, based on data controlling activation of fluidic actuators, a fluidic actuator that is to be activated in a first activation cycle of a group of activation cycles that correspond to activation intervals of respective fluidic actuators of a group of fluidic actuators of the fluid dispensing device, the identified fluidic actuator being part of the group of fluidic actuators. To perform a sense measurement for the identified fluidic actuator, the controller suppresses activation of the identified fluidic actuator in the first activation cycle, and causes activation of the identified fluidic actuator in a sense measurement cycle different from the first activation cycle, the sense measurement cycle being part of the group of activation cycles.
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公开(公告)号:US20210347171A1
公开(公告)日:2021-11-11
申请号:US17251982
申请日:2019-01-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Daryl E. Anderson , Eric Martin , James R. Przybyla , Chien-Hua Chen
Abstract: One example provides a fluidic die including a semiconductor substrate, and a nozzle layer disposed on the substrate, the nozzle layer having a top surface opposite the substrate and including a nozzle formed therein, the nozzle including a fluid chamber disposed below the top surface and a nozzle orifice extending through the nozzle layer from the top surface to the fluid chamber, the fluid chamber to hold fluid, and the nozzle to eject fluid drops from the fluid chamber via the nozzle orifice. An electrode is disposed in contact with the nozzle layer about a perimeter of the nozzle orifice, the electrode to carry an electrical charge to adjust movement of electrically charged components of the fluid.
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公开(公告)号:US20200234092A1
公开(公告)日:2020-07-23
申请号:US16486119
申请日:2017-04-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Daryl E. Anderson , Eric T. Martin , James R. Przybyla
Abstract: Examples include a fluidic die. The fluidic die may comprise an array of fluid actuators, an actuation data register, a mask register, and actuation logic. The actuation data register may store actuation data that indicates fluid ejectors to actuate for a set of actuation events. The mask register may store mask data that indicates a set of fluid actuators enabled for actuation for a respective actuation event of the set of actuation events. The actuation logic may electrically actuate a subset of the fluid actuators based at least in part on the actuation data register and the mask register for the respective actuation event.
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公开(公告)号:US09570384B2
公开(公告)日:2017-02-14
申请号:US14818922
申请日:2015-08-05
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Lawrence H. White , Robert Vina , Terry Mcmahon , James R. Przybyla
IPC: H01L23/48 , H01L23/552 , H01L23/52 , H01L29/40 , H01L23/498 , H01L21/768 , H01L23/00
CPC classification number: H01L23/49822 , H01L21/76838 , H01L24/03 , H01L24/05 , H01L2224/0235 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05013 , H01L2224/05024 , H01L2224/05092 , H01L2224/05553 , H01L2224/45124 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01073 , H01L2924/01079 , H01L2924/04642 , H01L2924/05042 , H01L2924/0534 , H01L2924/05432 , H01L2924/05442 , H01L2924/059 , H01L2924/05994 , H01L2924/1461 , H01L2924/01029 , H01L2924/00 , H01L2224/48
Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.
Abstract translation: 半导体器件可以包括基板和位于基板附近的迹线层,并且包括用于向半导体器件提供电连接的迹线。 导电层可以位于跟踪层附近并形成接合焊盘。 非导电薄膜层可以位于迹线层和导电层之间。 薄膜层可以包括通孔以使得能够从迹线到接合焊盘的电连接。 衬底和多个导电层之间的迹线的一部分可以具有斜边。
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公开(公告)号:US11559987B2
公开(公告)日:2023-01-24
申请号:US17058690
申请日:2019-01-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Martin , Daryl E. Anderson , James R. Przybyla , Chien-Hua Chen , Diane R. Hammerstad
Abstract: One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.
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